CMOS PARALLEL-TO-SERIAL FIFO
2048
X
9
4096
X
9
Integrated Device Technology, Inc.
IDT72131
IDT72141
FEATURES:
• 35ns parallel port access time, 45ns cycle time
• 50MHz serial port shift rate
• Expandable in depth and width with no external
components
• Programmable word lengths including 7-9, 16-18, 32-36
bit using Flexishift™ serial output without using any
additional components
• Multiple status flags: Full, Almost-Full (1/8 from full),
Half-Full, Almost Empty (1/8 from empty), and Empty
• Asynchronous and simultaneous read and write
operations
• Dual-Port zero fall-through architecture
• Retransmit capability in single device mode
• Produced with high-performance, low power CMOS
technology
• Available in 28-pin ceramic and plastic DIP.
• Military product compliant to MlL-STD-883, Class B
DESCRIPTION:
The IDT72131/72141 are high-speed, low power parallel-
to-serial FIFOs. These FIFOs are ideally suited to serial
communications applications, tape/disk controllers, and local
area networks (LANs). The IDT72131/72141 can be config-
ured with the IDTs serial-to-parallel FIFOs (IDT72132/72142)
for bidirectional serial data buffering.
The FIFO has a 9-bit parallel input port and a serial output
port. Wider and deeper parallel-to-serial data buffers can be
built using multiple IDT72131/72141 chips. IDTs unique
Flexishift serial expansion logic (SOX,
NR
) makes width
expansion possible with no additional components. These
FIFOs will expand to a variety of word widths including 8, 9, 16,
and 32 bits. The IDT72131/141 can also be directly connected
for depth expansion.
Five flags are provided to monitor the FIFO. The full and
empty flags prevent any FIFO data overflow or underflow
conditions. The almost-full (7/8), half-full, and almost empty
(1/8) flags signal memory utilization within the FIFO.
The IDT72131/72141 is fabricated using IDTs high-speed
submicron CMOS technology. Military grade product is manu-
factured in compliance with the latest revision of MIL-STD-
883, Class B.
FUNCTIONAL BLOCK DIAGRAM
D
0
-D
8
PIN CONFIGURATION
W
D
4
D
3
D
2
D
1
NEXT READ
POINTER
NR
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
Vcc
D
5
D
6
D
7
D
8
EF
FLAG
LOGIC
AEF
/HF
FF
WRITE
POINTER
RAM ARRAY
2048 x 9
4096 x 9
W
D
0
XI
SOX
SOCP
SO
P28-1
&
C28-3
23
22
21
20
19
18
17
16
15
FL/RT
RS
EF
XO/HF
GND
Q
8
Q
7
Q
6
RS
FL/RT
RESET LOGIC
SOCP
EXPANSION
LOGIC
SERIAL OUTPUT
CIRCUITRY
SOX
SO
AEF
FF
Q
4
GND
XI
XO/
NR
Q
4
Q
6
Q
7
Q
8
2751 drw 01
DIP
TOP VIEW
2751 drw 02a
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
MILITARY AND COMMERCIAL TEMPERATURE RANGES
©1996
Integrated Device Technology, Inc.
DECEMBER 1995
DSC-2751/5
5.35
1
IDT72131, IDT72141
CMOS PARALLEL-TO-SERIAL FIFO 2048 x 9 & 4096 x 9
MILITARY AND COMMERCIAL TEMPERATURE RANGES
PIN DESCRIPTIONS
Symbol
D
0
–D
8
Inputs
Reset
Name
I/O
I
I
Data inputs for 9-bit wide data.
When
RS
is set LOW, internal READ and WRITE pointers are set to the first location of the RAM
array.
HF
and
FF
go HIGH, and
AEF
and
EF
go LOW. A reset is required before an initial WRITE
after power-up.
W
must be HIGH and SOCP must be LOW during
RS
cycle.
Description
RS
W
SOCP
Write
I
A write cycle is initiated on the falling edge of WRITE if the Full Flag (
FF
) is not set. Data set-
up and hold times must be adhered to with respect to the rising edge of WRITE. Data is stored
in the RAM array sequentially and independently of any ongoing read operation.
NR
FL
/
RT
Serial Output
Clock
Next Read
First Load/
Retransmit
I
I
I
A serial bit read cycle is initiated on the rising edge of SOCP if the Empty Flag (
EF
) is not set. In
both Depth and Serial Word Width Expansion modes, all of the SOCP pins are tied together.
To program the Serial Out data word width , connect
NR
with one of the Data Set pins (Q
4
, Q
6
,
Q
7
and Q
8
). For example,
NR
- Q
7
programs for a 8-bit Serial Out word width.
This is a dual purpose input. In the single device configuration (
XI
grounded), activating retransmit
(
FL
/
RT
-LOW) will set the internal READ pointer to the first location. There is no effect on the
WRITE pointer.
W
must be high and SOCP must be low before setting
FL
/
RT
LOW. Retransmit
is not compatible with depth expansion. In the depth expansion configuration,
FL
/
RT
grounded
indicates the first activated device.
In the single device configuration,
XI
is grounded. In depth expansion or daisy chain expansion,
XI
is connected to
XO
(expansion out) of the previous device.
In the Serial Output Expansion mode, the SOX pin of the least significant device is tied HIGH.
The SOX pin of all other devices is connected to the Q
8
pin of the previous device. Data is then
clocked out least significant bit first. For single device operation, SOX is tied HIGH.
Serial data is output on the Serial Output (SO) pin. Data is clocked out Least Significant Bit first.
In the Serial Width Expansion mode the SO pins are tied together and each SO pin is tristated
at the end of the byte.
When
FF
goes LOW, the device is full and further WRITE operations are inhibited. When
FF
is
HIGH, the device is not full.
When
EF
goes LOW, the device is empty and further READ operations are inhibited. When
EF
is HIGH, the device is not empty. See the description on page 6 for more details.
When
AEF
is LOW, the device is empty to 1/8 full or 7/8 to completely full. When
AEF
is HIGH,
the device is greater than 1/8 full, but less than 7/8 full.
This is a dual-purpose output. In the single device configuration (
XI
grounded), the device is more
than half full when HF is LOW. In the depth expansion configuration (
XO
connected to
XI
of the
next device), a pulse is sent from
XO
to
XI
when the last location in the RAM array is filled.
XI
SOX
Expansion In
Serial Output
Expansion
I
I
SO
Serial Output
O
FF
EF
AEF
XO/HF
Q
4
, Q
6
,
Q
7
and
Q
8
V
CC
GND
Full Flag
Empty Flag
Almost-Empty/
Almost-Full Flag
Expansion Out/
Half-Full Flag
Data Set
O
O
O
O
O
The appropriate Data Set pin (Q
4
, Q
6
, Q
7
and Q
8
) is connected to
NR
to program the Serial Out
data word width. For example: Q
6
-
NR
programs a 7-bit word width, Q
8
-
NR
programs a 9-bit
word width, etc.
Single Power Supply of 5V.
Single ground at 0V.
Power Supply
Ground
2751 tbl 01
STATUS FLAGS
Number of Words in FIFO
IDT72131
0
1-255
256-1024
1025-1792
1793-2047
2048
IDT72141
0
1-511
512-2048
2049-3584
3585-4095
4096
FF
H
H
H
H
H
L
AEF
L
L
H
H
L
L
HF
H
H
H
L
L
L
EF
L
H
H
H
H
H
2751 tbl 02
5.35
2
IDT72131, IDT72141
CMOS PARALLEL-TO-SERIAL FIFO 2048 x 9 & 4096 x 9
MILITARY AND COMMERCIAL TEMPERATURE RANGES
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol
V
TERM
Rating
Terminal Voltage
with Respect
to GND
Operating
Temperature
Temperature
Under Bias
Storage
Temperature
DC Output
Current
Commercial
–0.5 to +7.0
Military
–0.5 to +7.0
Unit
V
RECOMMENDED OPERATING CONDITIONS
Symbol
V
CCM
V
CC
GND
V
IH
V
IH
V
IL(1)
Parameter
Military Supply
Voltage
Commercial Supply
Voltage
Supply Voltage
Input High Voltage
Commercial
Input High Voltage
Military
Input Low Voltage
Min.
4.5
4.5
0
2.0
2.2
—
Typ.
5.0
5.0
0
—
—
—
Max. Unit
5.5
5.5
0
—
—
0.8
V
V
V
V
V
V
2751 tbl 04
T
A
T
BIAS
T
STG
I
OUT
0 to +70
–55 to +125
–55 to +125
50
–55 to +125
–65 to +135
–65 to +150
50
°C
°C
°C
mA
NOTE:
2751 tbl 03
1. Stresses greater than those listed under ABSOLUTE MAXIMUM
RATINGS may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or any other
conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
NOTE:
1. 1.5V undershoots are allowed for 10ns once per cycle.
CAPACITANCE
(T
A
= +25°C, f = 1.0MHz)
Symbol
C
IN
C
OUT
Parameter
(1)
Input Capacitance
Output Capacitance
Conditions
V
IN
= 0V
V
OUT
= 0V
Max.
10
12
Unit
pF
pF
2751 tbl 05
NOTE:
1. This parameter is sampled and not 100% tested.
DC ELECTRICAL CHARACTERISTICS
(Commercial: V
CC
= 5.0V
±
10%, T
A
= 0°C to +70°C; Military: V
CC
= 5.0V
±
10%, T
A
= –55°C to +125°C)
IDT72131/IDT72141
Commercial
Symbol
I
IL(1)
I
OL(2)
V
OH
V
OL
I
CC1(3)
I
CC2(3)
Parameter
Input Leakage Current
(Any Input)
Output Leakage Current
Output Logic "1" Voltage,
I
OUT
= -8mA
Output Logic "0" Voltage
I
OUT
= 16mA
Power Supply Current
Average Standby Current
(
W
=
RS
=
FL
/
RT
= V
IH
)
(SOCP = V
IL
)
Power Down Current
Min.
–1
–10
2.4
—
—
—
Typ.
—
—
—
—
90
8
Max.
1
10
—
0.4
140
12
IDT72131/IDT72141
Military
Min.
–10
–10
2.4
—
—
—
Typ.
—
—
—
—
100
12
Max.
10
10
—
0.4
160
25
Unit
µA
µA
V
V
mA
mA
I
CC3
(L)
(3,4)
—
—
2
—
—
4
mA
2751 tbl 06
NOTES:
1. Measurements with 0.4
≤
V
IN
≤
V
CC
.
2. SOCP
≤
V
IL
, 0.4
≤
V
OUT
≤
V
CC
.
3. I
CC
measurements are made with outputs open.
4.
RS
=
FL
/
RT
=
W
= V
CC
-0.2V; SOCP
≤
0.2V; all other inputs
≥
V
CC
-0.2V or
≤
0.2V.
5.35
3
IDT72131, IDT72141
CMOS PARALLEL-TO-SERIAL FIFO 2048 x 9 & 4096 x 9
MILITARY AND COMMERCIAL TEMPERATURE RANGES
AC ELECTRICAL CHARACTERISTICS
(Commercial: V
CC
= 5.0V
±
10%, T
A
= 0°C to +70°C; Military: V
CC
= 5.0V
±
10%, T
A
= -55°C to +125°C)
Commercial
IDT72131L35
IDT72141L35
Min.
Max.
—
—
18
0
45
35
10
—
—
—
35
5
5
—
5
8
—
—
—
35
45
35
35
10
—
—
20
20
45
35
35
10
—
—
35
10
15
22.2
50
—
—
—
—
—
30
30
45
—
16
22
18
—
—
20
30
30
—
—
—
—
—
45
45
—
—
—
—
—
—
35
35
—
—
—
Military
IDT72131L40
IDT72141L40
Min.
Max.
—
—
20
0
50
40
10
—
—
—
40
5
5
—
5
8
—
—
—
40
50
40
40
10
—
—
20
20
50
40
40
10
—
—
40
10
15
20
50
—
—
—
—
—
35
35
50
—
16
22
18
—
—
25
35
35
—
—
—
—
—
50
50
—
—
—
—
—
—
40
40
—
—
—
Mil. and Com'l.
IDT72131L50
IDT72141L50
Min.
Max.
—
—
30
5
65
50
15
—
—
—
50
5
5
—
5
10
—
—
—
50
65
50
50
15
—
—
35
35
65
50
50
15
—
—
50
10
15
15
40
—
—
—
—
—
45
45
65
—
26
22
18
—
—
25
40
40
—
—
—
—
—
65
65
—
—
—
—
—
—
50
50
—
—
—
Symbol
t
S
t
SOCP
t
DS
t
DH
t
WC
t
WPW
t
WR
t
WEF
t
WFF
t
WF
t
WPF
t
SOHZ
t
SOLZ
t
SOPD
t
SOX
t
SOCW
t
SOCEF
t
SOCFF
t
SOCF
t
REFSO
t
RSC
t
RS
t
RSS
t
RSR
t
RSF1
t
RSF2
t
RSQL
t
RSQH
t
RTC
t
RT
t
RTS
t
RTR
t
XOL
t
XOH
t
XI
t
XIR
t
XIS
Parameter
Parallel Shift Frequency
Serial-Out Shift Frequency
Data Set-up Time
Data Hold Time
Write Cycle Time
Write Pulse Width
Write Recovery Time
Write High to
EF
HIGH
Write Low to
FF
LOW
Write Low to Transitioning
HF
,
AEF
Write Pulse Width After
FF
HIGH
Unit
MHz
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
2751 tbl 07
PARALLEL INPUT TIMINGS
SERIAL OUTPUT TIMINGS
SOCP Rising Edge to SO at High-Z
(1)
SOCP Rising Edge to SO at Low-Z
(1)
SOCP Rising Edge to Valid Data on SO
SOX Set-up Time to SOCP Rising Edge
Serial In Clock Width HIGH/LOW
SOCP Rising Edge (Bit 0 - Last Word) to
EF
LOW
SOCP Rising Edge to
FF
HIGH
SOCP Rising Edge to
HF
,
AEF
, HIGH
Recovery Time SOCP After
EF
HIGH
Reset Cycle Time
Reset Pulse Width
Reset Set-up Time
Reset Recovery Time
Reset to
EF
and
AEF
LOW
Reset to
HF
and
FF
HIGH
Reset to Q LOW
Reset to Q HIGH
Retransmit Cycle Time
Retransmit Pulse Width
Retransmit Set-up Time
Retransmit Recovery Time
Read/Write to
XO
LOW
RESET TIMINGS
RETRANSMIT TIMINGS
DEPTH EXPANSION MODE TIMINGS
Read/Write to
XO
HIGH
XI
Pulse Width
XI
Recovery Time
XI
Set-up Time
NOTE:
1. Guaranteed by design minimum times, not tested.
5.35
4
IDT72131, IDT72141
CMOS PARALLEL-TO-SERIAL FIFO 2048 x 9 & 4096 x 9
MILITARY AND COMMERCIAL TEMPERATURE RANGES
AC TEST CONDITIONS
Input Pulse Levels
Input Rise/Fall Times
Input Timing Reference Levels
Output Reference Levels
Output Load
GND to 3.0V
5ns
1.5V
1.5V
See Figure A
2751 tbl 08
5V
1.1K
Ω
D.U.T.
680
Ω
30pF*
2751 drw 03
or equivalent circuit
Figure A. Ouput Load
*Including jig and scope capacitances
FUNCTIONAL DESCRIPTION
Parallel Data Input
The data is written into the FIFO in parallel through the
D
0-8
input data lines. A write cycle is initiated on the falling
edge of the Write (
W
) signal provided the Full Flag (
FF
) is not
asserted. If the
W
signal changes from HIGH-to-LOW and the
Full-Flag (
FF
) is already set, the write line is inhibited internally
from incrementing the write pointer and no write operation
occurs.
Data set-up and hold times must be met with respect to the
rising edge of Write. The data is written to the RAM at the write
pointer. On the rising edge of
W
, the write pointer is
incremented. Write operations can occur simultaneously or
asynchronously with read operations.
Serial Data Output
The serial data is output on the SO pin. The data is clocked
out on the rising edge of SOCP providing the Empty Flag (
EF
)
is not asserted. If the Empty Flag is asserted then the next data
word is inhibited from moving to the output register and being
clocked out by SOCP. NOTE: SOCP should not be clocked
once the last bit of the last word has been clocked out. If it is,
then two things will occur. One, the SO pin will go High-Z and
two, SOCP will be out of sync with Next Read (
NR
).
The serial word is shifted out Least Significant Bit first, that
is the first bit will be D0, then D1 and so on up to the serial word
width. The serial word width must be programmed by connect-
ing the appropriate Data Set line (Q4, Q6, Q7 or Q8) to the
NR
input. The Data Set lines are taps off a digital delay line.
Selecting one of these taps, programs the width of the serial
word to be read and shifted out.
t
RSC
t
RS
RS
t
RSS
W
t
RSF1
AEF, EF
t
RSF2
HF, FF
t
RSS
SOCP
t
RSQL
Q
4
, Q
6
, Q
7
, Q
8
2751 drw 04
t
RSR
t
RSR
t
RSQH
Figure 1. Reset
5.35
5
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