Bus Driver, 81 Series, 1-Func, 8-Bit, True Output, TTL, PDIP24, PLASTIC, DIP-24
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | AMD(超微) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP24,.3 |
| 针数 | 24 |
| Reach Compliance Code | unknown |
| 系列 | 81 |
| JESD-30 代码 | R-PDIP-T24 |
| JESD-609代码 | e0 |
| 长度 | 31.877 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 24 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 最大电源电流（ICC） | 37 mA |
| 传播延迟（tpd） | 45 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.461 mm |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 15.24 mm |
| AM8120PCB | AM8120DCB | AM8120DMB | AM8120LCB | AM8120LMB | AM8120XMB | AM8120XCB | AM8120FMB | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Bus Driver, 81 Series, 1-Func, 8-Bit, True Output, TTL, PDIP24, PLASTIC, DIP-24 | Bus Driver, 81 Series, 1-Func, 8-Bit, True Output, TTL, CDIP24, 0.300 INCH, HERMETIC SEALED, SLIM, CERDIP-24 | Bus Driver, 81 Series, 1-Func, 8-Bit, True Output, TTL, CDIP24, 0.300 INCH, HERMETIC SEALED, SLIM, CERDIP-24 | Bus Driver, 81 Series, 1-Func, 8-Bit, True Output, TTL, CQCC28, LCC-28 | Bus Driver, 81 Series, 1-Func, 8-Bit, True Output, TTL, CQCC28, LCC-28 | Bus Driver, 81 Series, 1-Func, 8-Bit, True Output, TTL, 0.080 X 0.111 INCH, DIE | Bus Driver, 81 Series, 1-Func, 8-Bit, True Output, TTL, 0.080 X 0.111 INCH, DIE | Bus Driver, 81 Series, 1-Func, 8-Bit, True Output, TTL, CDFP24, CERAMIC, FP-24 |
| 厂商名称 | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
| 零件包装代码 | DIP | DIP | DIP | QLCC | QLCC | DIE | DIE | DFP |
| 包装说明 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | QCCN, LCC28,.45SQ | QCCN, LCC28,.45SQ | DIE, | DIE, | DFP, |
| 针数 | 24 | 24 | 24 | 28 | 28 | 24 | 24 | 24 |
| Reach Compliance Code | unknown | unknown | compliant | unknown | compliant | unknown | unknown | unknown |
| 系列 | 81 | 81 | 81 | 81 | 81 | 81 | 81 | 81 |
| JESD-30 代码 | R-PDIP-T24 | R-CDIP-T24 | R-CDIP-T24 | S-CQCC-N28 | S-CQCC-N28 | R-XUUC-N24 | R-XUUC-N24 | R-CDFP-F24 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 24 | 24 | 24 | 28 | 28 | 24 | 24 | 24 |
| 最高工作温度 | 70 °C | 70 °C | 125 °C | 70 °C | 125 °C | 125 °C | 70 °C | 125 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | DIP | DIP | QCCN | QCCN | DIE | DIE | DFP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | UNCASED CHIP | UNCASED CHIP | FLATPACK |
| 最大电源电流（ICC） | 37 mA | 37 mA | 37 mA | 37 mA | 37 mA | 37 mA | 37 mA | 37 mA |
| 传播延迟（tpd） | 45 ns | 45 ns | 54 ns | 45 ns | 54 ns | 54 ns | 45 ns | 54 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.5 V | 5.25 V | 5.5 V | 5.5 V | 5.25 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.5 V | 4.75 V | 4.5 V | 4.5 V | 4.75 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | YES | YES | YES | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | NO LEAD | FLAT |
| 端子位置 | DUAL | DUAL | DUAL | QUAD | QUAD | UPPER | UPPER | DUAL |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - | - | - |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | - | - | - |
| 长度 | 31.877 mm | 32.0675 mm | 32.0675 mm | 8.89 mm | 8.89 mm | - | - | 15.24 mm |
| 封装等效代码 | DIP24,.3 | DIP24,.3 | DIP24,.3 | LCC28,.45SQ | LCC28,.45SQ | - | - | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - |
| 座面最大高度 | 5.461 mm | 5.715 mm | 5.715 mm | 2.54 mm | 2.54 mm | - | - | 2.286 mm |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | - |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | - | - | 1.27 mm |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | - | - | - |
| 宽度 | 15.24 mm | 7.62 mm | 7.62 mm | 8.89 mm | 8.89 mm | - | - | 9.4615 mm |
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