Bus Driver, 81 Series, 1-Func, 8-Bit, True Output, TTL, CDIP24, 0.300 INCH, HERMETIC SEALED, SLIM, CERDIP-24
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | AMD(超微) |
零件包装代码 | DIP |
包装说明 | DIP, DIP24,.3 |
针数 | 24 |
Reach Compliance Code | compliant |
系列 | 81 |
JESD-30 代码 | R-CDIP-T24 |
JESD-609代码 | e0 |
长度 | 32.0675 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | BUS DRIVER |
位数 | 8 |
功能数量 | 1 |
端口数量 | 2 |
端子数量 | 24 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出特性 | 3-STATE |
输出极性 | TRUE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP |
封装等效代码 | DIP24,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
最大电源电流(ICC) | 37 mA |
传播延迟(tpd) | 54 ns |
认证状态 | Not Qualified |
筛选级别 | MIL-STD-883 Class B (Modified) |
座面最大高度 | 5.715 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | TTL |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
触发器类型 | POSITIVE EDGE |
宽度 | 7.62 mm |
Base Number Matches | 1 |
AM8120DMB | AM8120DCB | AM8120LCB | AM8120LMB | AM8120XMB | AM8120PCB | AM8120XCB | AM8120FMB | |
---|---|---|---|---|---|---|---|---|
描述 | Bus Driver, 81 Series, 1-Func, 8-Bit, True Output, TTL, CDIP24, 0.300 INCH, HERMETIC SEALED, SLIM, CERDIP-24 | Bus Driver, 81 Series, 1-Func, 8-Bit, True Output, TTL, CDIP24, 0.300 INCH, HERMETIC SEALED, SLIM, CERDIP-24 | Bus Driver, 81 Series, 1-Func, 8-Bit, True Output, TTL, CQCC28, LCC-28 | Bus Driver, 81 Series, 1-Func, 8-Bit, True Output, TTL, CQCC28, LCC-28 | Bus Driver, 81 Series, 1-Func, 8-Bit, True Output, TTL, 0.080 X 0.111 INCH, DIE | Bus Driver, 81 Series, 1-Func, 8-Bit, True Output, TTL, PDIP24, PLASTIC, DIP-24 | Bus Driver, 81 Series, 1-Func, 8-Bit, True Output, TTL, 0.080 X 0.111 INCH, DIE | Bus Driver, 81 Series, 1-Func, 8-Bit, True Output, TTL, CDFP24, CERAMIC, FP-24 |
厂商名称 | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
零件包装代码 | DIP | DIP | QLCC | QLCC | DIE | DIP | DIE | DFP |
包装说明 | DIP, DIP24,.3 | DIP, DIP24,.3 | QCCN, LCC28,.45SQ | QCCN, LCC28,.45SQ | DIE, | DIP, DIP24,.3 | DIE, | DFP, |
针数 | 24 | 24 | 28 | 28 | 24 | 24 | 24 | 24 |
Reach Compliance Code | compliant | unknown | unknown | compliant | unknown | unknown | unknown | unknown |
系列 | 81 | 81 | 81 | 81 | 81 | 81 | 81 | 81 |
JESD-30 代码 | R-CDIP-T24 | R-CDIP-T24 | S-CQCC-N28 | S-CQCC-N28 | R-XUUC-N24 | R-PDIP-T24 | R-XUUC-N24 | R-CDFP-F24 |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 24 | 24 | 28 | 28 | 24 | 24 | 24 | 24 |
最高工作温度 | 125 °C | 70 °C | 70 °C | 125 °C | 125 °C | 70 °C | 70 °C | 125 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP | DIP | QCCN | QCCN | DIE | DIP | DIE | DFP |
封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | UNCASED CHIP | IN-LINE | UNCASED CHIP | FLATPACK |
最大电源电流(ICC) | 37 mA | 37 mA | 37 mA | 37 mA | 37 mA | 37 mA | 37 mA | 37 mA |
传播延迟(tpd) | 54 ns | 45 ns | 45 ns | 54 ns | 54 ns | 45 ns | 45 ns | 54 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 5.5 V | 5.25 V | 5.25 V | 5.5 V | 5.5 V | 5.25 V | 5.25 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.75 V | 4.75 V | 4.5 V | 4.5 V | 4.75 V | 4.75 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | YES | YES | YES | NO | YES | YES |
技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE | NO LEAD | FLAT |
端子位置 | DUAL | DUAL | QUAD | QUAD | UPPER | DUAL | UPPER | DUAL |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 | - | - |
JESD-609代码 | e0 | e0 | e0 | e0 | - | e0 | - | - |
长度 | 32.0675 mm | 32.0675 mm | 8.89 mm | 8.89 mm | - | 31.877 mm | - | 15.24 mm |
封装等效代码 | DIP24,.3 | DIP24,.3 | LCC28,.45SQ | LCC28,.45SQ | - | DIP24,.3 | - | - |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - | - |
座面最大高度 | 5.715 mm | 5.715 mm | 2.54 mm | 2.54 mm | - | 5.461 mm | - | 2.286 mm |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | - |
端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | - | 2.54 mm | - | 1.27 mm |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - | - |
触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | - | POSITIVE EDGE | - | - |
宽度 | 7.62 mm | 7.62 mm | 8.89 mm | 8.89 mm | - | 15.24 mm | - | 9.4615 mm |
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