RISC Microprocessor, 8-Bit, 5MHz, CMOS, CDIP40
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | IDT (Integrated Device Technology) |
零件包装代码 | DIP |
包装说明 | SIDE BRAZED, CERAMIC, DIP-40 |
针数 | 40 |
Reach Compliance Code | unknown |
位大小 | 8 |
JESD-30 代码 | R-XDIP-T40 |
JESD-609代码 | e0 |
端子数量 | 40 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP40,.6 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 5 V |
认证状态 | Not Qualified |
速度 | 5 MHz |
最大压摆率 | 32 mA |
标称供电电压 | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC |
CA80C85B-5ED | CA80C85B-6CD | CA80C85B-5CD | CA80C85B-5ID | CA80C85B-6ID | CA80C85B-6ED | |
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描述 | RISC Microprocessor, 8-Bit, 5MHz, CMOS, CDIP40 | RISC Microprocessor, 8-Bit, 6MHz, CMOS, CDIP40 | Microprocessor, 8-Bit, 5MHz, CMOS, CDIP40, SIDE BRAZED, CERAMIC, DIP-40 | Microprocessor, 8-Bit, 5MHz, CMOS, CDIP40, SIDE BRAZED, CERAMIC, DIP-40 | Microprocessor, 8-Bit, 6MHz, CMOS, CDIP40, SIDE BRAZED, CERAMIC, DIP-40 | RISC Microprocessor, 8-Bit, 6MHz, CMOS, CDIP40 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | DIP | DIP | DIP | DIP | DIP | DIP |
包装说明 | SIDE BRAZED, CERAMIC, DIP-40 | SIDE BRAZED, CERAMIC, DIP-40 | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | SIDE BRAZED, CERAMIC, DIP-40 |
针数 | 40 | 40 | 40 | 40 | 40 | 40 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
位大小 | 8 | 8 | 8 | 8 | 8 | 8 |
JESD-30 代码 | R-XDIP-T40 | R-XDIP-T40 | R-CDIP-T40 | R-CDIP-T40 | R-CDIP-T40 | R-XDIP-T40 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
端子数量 | 40 | 40 | 40 | 40 | 40 | 40 |
最高工作温度 | 125 °C | 70 °C | 70 °C | 85 °C | 85 °C | 125 °C |
最低工作温度 | -55 °C | - | - | -40 °C | -40 °C | -55 °C |
封装主体材料 | CERAMIC | CERAMIC | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC |
封装代码 | DIP | DIP | DIP | DIP | DIP | DIP |
封装等效代码 | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
速度 | 5 MHz | 6 MHz | 5 MHz | 5 MHz | 6 MHz | 6 MHz |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR, RISC |
厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
最大压摆率 | 32 mA | - | 21 mA | 29 mA | 29 mA | - |
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