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89HPES12NT3ZABC8

产品描述Bus Controller, PBGA324
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小495KB,共29页
制造商IDT (Integrated Device Technology)
标准
下载文档 详细参数 选型对比 全文预览 文档解析

89HPES12NT3ZABC8概述

Bus Controller, PBGA324

89HPES12NT3ZABC8规格参数

参数名称属性值
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
包装说明BGA, BGA324,18X18,40
Reach Compliance Codecompliant
JESD-30 代码S-PBGA-B324
端子数量324
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA324,18X18,40
封装形状SQUARE
封装形式GRID ARRAY
电源1,3.3 V
认证状态Not Qualified
表面贴装YES
温度等级COMMERCIAL
端子形式BALL
端子节距1 mm
端子位置BOTTOM

文档解析

这份文档是关于IDT公司生产的89HPES12NT3芯片的数据手册,该芯片属于IDT PRECISE™家族,是一种PCI Express®交换解决方案。以下是一些值得关注的技术信息:

  1. 产品概述

    • 89HPES12NT3是一款12通道、3端口的外围芯片,用于高性能应用,如服务器、存储和通信/网络。
  2. 主要特性

    • 提供高达48 Gbps(6 GBps)的聚合交换容量。
    • 低延迟直通交换架构。
    • 支持最大有效载荷大小高达2048字节。
    • 符合PCI Express Base规范修订版1.0a。
  3. 灵活的架构

    • 支持多种配置选项,包括端口仲裁、端口链接宽度自动协商等。
    • 支持非透明端口功能,包括交叉链路支持和映射窗口。
  4. 高度集成的解决方案

    • 无需外部组件,芯片内部集成了所需的所有功能。
  5. 可靠性、可用性和可服务性(RAS)特性

    • 支持热交换和故障转移应用。
  6. 电源管理

    • 支持PCI电源管理接口规范。
  7. 测试和调试特性

    • 内置SerDes伪随机比特流(PRBS)发生器,支持通过SMBus读取和写入任何内部寄存器。
  8. SMBus接口

    • 包含两个SMBus接口,一个作为从设备提供对所有软件可见寄存器的访问,另一个作为主设备用于初始化。
  9. 引脚描述和特性

    • 文档提供了详细的引脚功能描述和特性,包括信号类型、名称、描述以及它们的内部上拉或下拉电阻情况。
  10. 系统时钟参数

    • 包括输入参考时钟频率范围、占空比、上升/下降时间等。
  11. 功耗

    • 提供了在不同条件下的典型和最大功耗数据。
  12. 直流电气特性

    • 包括PCIe传输和接收的电压、阻抗、眼图等参数。
  13. 封装信息

    • 芯片采用324球BGA封装,提供了详细的引脚分配图。
  14. 修订历史

    • 文档记录了数据手册的修订历史。
  15. 公司联系信息

    • 提供了IDT公司的联系方式和订购信息。

89HPES12NT3ZABC8文档预览

12-lane 3-Port Non-Transparent
PCI Express® Switch
®
89HPES12NT3
Data Sheet
Preliminary Information*
Device Overview
The 89HPES12NT3 is a member of the IDT PRECISE™ family of
PCI Express® switching solutions offering the next-generation I/O inter-
connect standard. The PES12NT3 is a 12-lane, 3-port peripheral chip
that performs PCI Express Base switching with a feature set optimized
for high performance applications such as servers, storage, and commu-
nications/networking. It provides high-performance I/O connectivity and
switching functions between a PCIe® upstream port, a transparent
downstream port, and a non-transparent downstream port.
With non-transparent bridging (NTB) functionality, the PES12NT3
can be used standalone or as a chipset with IDT PCIe System Intercon-
nect Switches in multi-host and intelligent I/O applications such as
communications, storage, and blade servers where inter-domain
communication is required.
Features
High Performance PCI Express Switch
Twelve PCI Express lanes (2.5Gbps), three switch ports
Delivers 48 Gbps (6 GBps) of aggregate switching capacity
Low latency cut-through switch architecture
Support for Max Payload size up to 2048 bytes
Supports one virtual channel and eight traffic classes
PCI Express Base specification Revision 1.0a compliant
Flexible Architecture with Numerous Configuration Options
Port arbitration schemes utilizing round robin
Supports automatic per port link width negotiation (x4, x2, or
x1)
Static lane reversal on all ports
Automatic polarity inversion on all lanes
Supports locked transactions, allowing use with legacy soft-
ware
Ability to load device configuration from serial EEPROM
Ability to control device via SMBus
Non-Transparent Port
Crosslink support on NTB port
Four mapping windows supported
Each may be configured as a 32-bit memory or I/O window
May be paired to form a 64-bit memory window
Interprocessor communication
Thirty-two inbound and outbound doorbells
Four inbound and outbound message registers
Two shared scratchpad registers
Allows up to sixteen masters to communicate through the non-
transparent port
No limit on the number of supported outstanding transactions
through the non-transparent bridge
Completely symmetric non-transparent bridge operation
allows similar/same configuration software to be run
Supports direct connection to a transparent or non-transparent
port of another switch
Block Diagram
3-Port Switch Core
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Non-
Transparent
Bridge
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
...
...
...
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
12 PCI Express Lanes
x4 Upstream Port and Two x4 Downstream Ports
Figure 1 Internal Block Diagram
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
Inc.
1 of 29
©
2007 Integrated Device Technology, Inc.
*Notice: The information in this document is subject to change without notice
April 11, 2007
DSC 6929
IDT 89HPES12NT3 Data Sheet
Highly Integrated Solution
Requires no external components
Incorporates on-chip internal memory for packet buffering and
queueing
Integrates twelve 2.5 Gbps embedded full duplex SerDes,
8B/10B encoder/decoder (no separate transceivers needed)
Reliability, Availability, and Serviceability (RAS) Features
Upstream port can be dynamically swapped with non-trans-
parent downstream port to support failover applications
Internal end-to-end parity protection on all TLPs ensures data
integrity even in systems that do not implement end-to-end
CRC (ECRC)
Supports ECRC pass-through in transparent and non-trans-
parent ports
Supports Hot-Swap
Power Management
Supports PCI Power Management Interface specification,
Revision 1.1 (PCI-PM)
Unused SerDes are disabled
Testability and Debug Features
Built in SerDes Pseudo-Random Bit Stream (PRBS) generator
Ability to read and write any internal register via the SMBus
Ability to bypass link training and force any link into any mode
Provides statistics and performance counters
Two SMBus Interfaces
Slave interface provides full access to all software-visible
registers by an external SMBus master
Master interface provides connection for an optional serial
EEPROM used for initialization
Master interface is also used by an external Hot-Plug I/O
expander
Master and slave interfaces may be tied together so the switch
can act as both master and slave
Eight General Purpose Input/Output pins
Packaged in 19x19mm 324-ball BGA with 1mm ball spacing
management. This includes round robin port arbitration, guaranteeing
bandwidth allocation and/or latency for critical traffic classes in applica-
tions such as high throughput 10 GbE I/Os, SATA controllers, and Fibre
Channel HBAs.
Switch Configuration
The PES12NT3 is a three port switch that contains 12 PCI Express
lanes. Each of the three ports is statically allocated 4 lanes with ports
labeled as A, B and C. Port A is the upstream port, port B is the trans-
parent downstream port, and port C is the non-transparent downstream
port.
During link training, link width is automatically negotiated. Each
PES12NT3 port is capable of independently negotiating to a x4, x2 or x1
width. Thus, the PES12NT3 may be used in virtually any three port
switch configuration (e.g., {x4, x4, x4}, {x4, x2, x2}, {x4, x2, x1}, etc.).
The PES12NT3 supports static lane reversal. For example, lane
reversal for upstream port A may be configured by asserting the PCI
Express Port A Lane Reverse (PEALREV) input signal or through serial
EEPROM or SMBus initialization. Lane reversal for ports B and C may
be enabled via a configuration space register, serial EEPROM, or the
SMBus.
Product Description
Utilizing standard PCI Express interconnect, the PES12NT3 provides
the most efficient high-performance I/O connectivity solution for applica-
tions requiring high throughput, low latency, and simple board layout
with a minimum number of board layers. With support for non-trans-
parent bridging, the PES12NT3, as a standalone switch or as a chipset
with IDT PCIe System Interconnect Switches, enables multi-host and
intelligent I/O applications requiring inter-domain communication. The
PES12NT3 provides 48 Gbps (6 GBps) of aggregated, full-duplex
switching capacity through 12 integrated serial lanes, using proven and
robust IDT technology. Each lane provides 2.5 Gbps of bandwidth in
both directions and is fully compliant with PCI Express Base specifica-
tion 1.0a.
The PES12NT3 is based on a flexible and efficient layered architec-
ture. The PCI Express layer consists of SerDes, Physical, Data Link and
Transaction layers in compliance with PCI Express Base specification
Revision 1.0a. The PES12NT3 can operate either as a store and
forward or cut-through switch depending on the packet size and is
designed to switch memory and I/O transactions. It supports eight Traffic
Classes (TCs) and one Virtual Channel (VC) with sophisticated resource
2 of 29
*Notice: The information in this document is subject to change without notice
April 11, 2007
IDT 89HPES12NT3 Data Sheet
CPU
PES12NT3
CPU
PES12NT3
CPU
PES12NT3
PCIe System Interconnect Switch
PCIe System Interconnect Switch
Embedded
CPU
Embedded
CPU
SATA / SAS
Embedded
CPU
GbE / 10GigE
FC
Figure 2 PCIe System Interconnect Architecture Block Diagram
Controller 1
CPU
Controller 2
CPU
PES12N3
Cache Maint. &
Possible Data Flow
x4 PCIe
x4 PCIe
PES12N3
x4 PCIe
FC
Controller
FC
Controller
Storage
To Server
FC 2Gb/s and
4Gb/s
FC 2Gb/s and
4Gb/s
To Server
Figure 3 Dual Host Storage System
3 of 29
April 11, 2007
IDT 89HPES12NT3 Data Sheet
Pin Description
The following tables list the functions of the pins provided on the PES12NT3. Some of the functions listed may be multiplexed onto the same pin.
The active polarity of a signal is defined using a suffix. Signals ending with an “N” are defined as being active, or asserted, when at a logic zero (low)
level. All other signals (including clocks, buses, and select lines) will be interpreted as being active, or asserted, when at a logic one (high) level.
Signal
PEALREV
Type
I
Name/Description
PCI Express Port A Lane Reverse.
When this bit is asserted, the lanes of
PCI Express Port A are reversed. This value may be overridden by modify-
ing the value of the PALREV bit in the PA_SWCTL register.
PCI Express Port A Serial Data Receive.
Differential PCI Express receive
pairs for port A.
PCI Express Port A Serial Data Transmit.
Differential PCI Express trans-
mit pairs for port A
PCI Express Port B Lane Reverse.
When this bit is asserted, the lanes of
PCI Express Port B are reversed. This value may be overridden by modify-
ing the value of the PBLREV bit in the PA_SWCTL register.
PCI Express Port B Serial Data Receive.
Differential PCI Express receive
pairs for port B.
PCI Express Port B Serial Data Transmit.
Differential PCI Express trans-
mit pairs for port B
PCI Express Port C Lane Reverse.
When this bit is asserted, the lanes of
PCI Express Port C are reversed. This value may be overridden by modify-
ing the value of the PCLREV bit in the PA_SWCTL register.
PCI Express Port C Serial Data Receive.
Differential PCI Express receive
pairs for port C.
PCI Express Port C Serial Data Transmit.
Differential PCI Express trans-
mit pairs for port C
PCI Express Reference Clock.
Differential reference clock pair input. This
clock is used as the reference clock by on-chip PLLs to generate the clocks
required for the system logic and on-chip SerDes. The frequency of the dif-
ferential reference clock is determined by the REFCLKM signal.
PCI Express Reference Clock Mode Select.
These signals select the fre-
quency of the reference clock input.
0x0 - 100 MHz
0x1 - 125 MHz
Table 1 PCI Express Interface Pins
PEARP[3:0]
PEARN[3:0]
PEATP[3:0]
PEATN[3:0]
PEBLREV
I
O
I
PEBRP[3:0]
PEBRN[3:0]
PEBTP[3:0]
PEBTN[3:0]
PECLREV
I
O
I
PECRP[3:0]
PECRN[3:0]
PECTP[3:0]
PECTN[3:0]
PEREFCLKP[1:0]
PEREFCLKN[1:0]
I
O
I
REFCLKM
I
Signal
MSMBADDR[4:1]
MSMBCLK
Type
I
I/O
Name/Description
Master SMBus Address.
These pins determine the SMBus address of the
serial EEPROM from which configuration information is loaded.
Master SMBus Clock.
This bidirectional signal is used to synchronize
transfers on the master SMBus. It is active and generating the clock only
when the EEPROM or I/O Expanders are being accessed.
Master SMBus Data.
This bidirectional signal is used for data on the mas-
ter SMBus.
Table 2 SMBus Interface Pins (Part 1 of 2)
MSMBDAT
I/O
4 of 29
April 11, 2007
IDT 89HPES12NT3 Data Sheet
Signal
SSMBADDR[5,3:1]
SSMBCLK
SSMBDAT
Type
I
I/O
I/O
Name/Description
Slave SMBus Address.
These pins determine the SMBus address to
which the slave SMBus interface responds.
Slave SMBus Clock.
This bidirectional signal is used to synchronize trans-
fers on the slave SMBus.
Slave SMBus Data.
This bidirectional signal is used for data on the slave
SMBus.
Table 2 SMBus Interface Pins (Part 2 of 2)
Signal
GPIO[0]
Type
I/O
Name/Description
General Purpose I/O.
This pin can be configured as a general purpose I/O pin.
Alternate function pin name: PEBRSTN
Alternate function pin type: Output
Alternate function: Reset output for downstream port B
General Purpose I/O.
This pin can be configured as a general purpose I/O pin.
Alternate function pin name: PECRSTN
Alternate function pin type: Output
Alternate function: Reset output for downstream port C
General Purpose I/O.
This pin can be configured as a general purpose I/O pin.
Alternate function pin name: PALINKUPN
Alternate function pin type: Output
Alternate function: Port A link up status output
General Purpose I/O.
This pin can be configured as a general purpose I/O pin.
Alternate function pin name: PBLINKUPN
Alternate function pin type: Output
Alternate function: Port B link up status output
General Purpose I/O.
This pin can be configured as a general purpose I/O pin.
Alternate function pin name: PCLINKUPN
Alternate function pin type: Output
Alternate function: Port C link up status output
General Purpose I/O.
This pin can be configured as a general purpose I/O pin.
Alternate function pin name: FAILOVERP
Alternate function pin type: Input
Alternate function: NTB upstream port failover
General Purpose I/O.
This pin can be configured as a general purpose I/O pin.
General Purpose I/O.
This pin can be configured as a general purpose I/O pin.
Table 3 General Purpose I/O Pins
GPIO[1]
I/O
GPIO[2]
I/O
GPIO[3]
I/O
GPIO[4]
I/O
GPIO[5]
I/O
GPIO[6]
GPIO[7]
I/O
I/O
5 of 29
April 11, 2007

89HPES12NT3ZABC8相似产品对比

89HPES12NT3ZABC8 89HPES12NT3ZABCG8
描述 Bus Controller, PBGA324 Bus Controller, PBGA324
是否Rohs认证 符合 符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology)
包装说明 BGA, BGA324,18X18,40 BGA, BGA324,18X18,40
Reach Compliance Code compliant compliant
JESD-30 代码 S-PBGA-B324 S-PBGA-B324
端子数量 324 324
最高工作温度 70 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA
封装等效代码 BGA324,18X18,40 BGA324,18X18,40
封装形状 SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY
电源 1,3.3 V 1,3.3 V
认证状态 Not Qualified Not Qualified
表面贴装 YES YES
温度等级 COMMERCIAL COMMERCIAL
端子形式 BALL BALL
端子节距 1 mm 1 mm
端子位置 BOTTOM BOTTOM

 
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