128X16 3-WIRE SERIAL EEPROM, PDSO8, LEAD FREE, TSSOP-8
参数名称 | 属性值 |
厂商名称 | ABLIC |
零件包装代码 | SOIC |
包装说明 | TSSOP, |
针数 | 8 |
Reach Compliance Code | unknown |
最大时钟频率 (fCLK) | 0.5 MHz |
JESD-30 代码 | R-PDSO-G8 |
长度 | 4.4 mm |
内存密度 | 2048 bit |
内存集成电路类型 | EEPROM |
内存宽度 | 16 |
功能数量 | 1 |
端子数量 | 8 |
字数 | 128 words |
字数代码 | 128 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
组织 | 128X16 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
并行/串行 | SERIAL |
认证状态 | Not Qualified |
座面最大高度 | 1.1 mm |
串行总线类型 | 3-WIRE |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 2.7 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
宽度 | 3 mm |
最长写入周期时间 (tWC) | 8 ms |
S-93A56AD0AT8T2UD | S-93A46AD0AK8T2UD | S-93A46AD0AJ8T2UD | S-93A66AD0AJ8T2UD | S-93A46AD0AT8T2UD | S-93A66AD0AT8T2UD | S-93A56AD0AJ8T2UD | S-93A56AD0AK8T2UD | S-93A66AD0AK8T2UD | |
---|---|---|---|---|---|---|---|---|---|
描述 | 128X16 3-WIRE SERIAL EEPROM, PDSO8, LEAD FREE, TSSOP-8 | 64X16 3-WIRE SERIAL EEPROM, PDSO8, LEAD FREE, TMSOP-8 | 64X16 3-WIRE SERIAL EEPROM, PDSO8, LEAD FREE, SOP-8 | 256X16 3-WIRE SERIAL EEPROM, PDSO8, LEAD FREE, SOP-8 | 64X16 3-WIRE SERIAL EEPROM, PDSO8, LEAD FREE, TSSOP-8 | 256X16 3-WIRE SERIAL EEPROM, PDSO8, LEAD FREE, TSSOP-8 | 128X16 3-WIRE SERIAL EEPROM, PDSO8, LEAD FREE, SOP-8 | 128X16 3-WIRE SERIAL EEPROM, PDSO8, LEAD FREE, TMSOP-8 | 256X16 3-WIRE SERIAL EEPROM, PDSO8, LEAD FREE, TMSOP-8 |
厂商名称 | ABLIC | ABLIC | ABLIC | ABLIC | ABLIC | ABLIC | ABLIC | ABLIC | ABLIC |
零件包装代码 | SOIC | MSOP | SOIC | SOIC | SOIC | SOIC | SOIC | MSOP | MSOP |
包装说明 | TSSOP, | VSSOP, | LEAD FREE, SOP-8 | LEAD FREE, SOP-8 | LEAD FREE, TSSOP-8 | TSSOP, | SOP, | VSSOP, | VSSOP, |
针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknow | unknow | unknow |
最大时钟频率 (fCLK) | 0.5 MHz | 0.5 MHz | 0.5 MHz | 0.5 MHz | 0.5 MHz | 0.5 MHz | 0.5 MHz | 0.5 MHz | 0.5 MHz |
JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
长度 | 4.4 mm | 2.9 mm | 5.02 mm | 5.02 mm | 4.4 mm | 4.4 mm | 5.02 mm | 2.9 mm | 2.9 mm |
内存密度 | 2048 bit | 1024 bit | 1024 bit | 4096 bit | 1024 bit | 4096 bit | 2048 bi | 2048 bi | 4096 bi |
内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
字数 | 128 words | 64 words | 64 words | 256 words | 64 words | 256 words | 128 words | 128 words | 256 words |
字数代码 | 128 | 64 | 64 | 256 | 64 | 256 | 128 | 128 | 256 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 128X16 | 64X16 | 64X16 | 256X16 | 64X16 | 256X16 | 128X16 | 128X16 | 256X16 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | VSSOP | SOP | SOP | TSSOP | TSSOP | SOP | VSSOP | VSSOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.1 mm | 0.8 mm | 1.75 mm | 1.75 mm | 1.1 mm | 1.1 mm | 1.75 mm | 0.8 mm | 0.8 mm |
串行总线类型 | 3-WIRE | 3-WIRE | 3-WIRE | 3-WIRE | 3-WIRE | 3-WIRE | 3-WIRE | 3-WIRE | 3-WIRE |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.65 mm | 0.65 mm | 1.27 mm | 1.27 mm | 0.65 mm | 0.65 mm | 1.27 mm | 0.65 mm | 0.65 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 3 mm | 2.8 mm | 3.9 mm | 3.9 mm | 3 mm | 3 mm | 3.9 mm | 2.8 mm | 2.8 mm |
最长写入周期时间 (tWC) | 8 ms | 8 ms | 8 ms | 8 ms | 8 ms | 8 ms | 8 ms | 8 ms | 8 ms |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved