64X16 3-WIRE SERIAL EEPROM, PDSO8, LEAD FREE, TMSOP-8
| 参数名称 | 属性值 |
| 厂商名称 | ABLIC |
| 零件包装代码 | MSOP |
| 包装说明 | VSSOP, |
| 针数 | 8 |
| Reach Compliance Code | unknown |
| 最大时钟频率 (fCLK) | 0.5 MHz |
| JESD-30 代码 | R-PDSO-G8 |
| 长度 | 2.9 mm |
| 内存密度 | 1024 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 64 words |
| 字数代码 | 64 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 组织 | 64X16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VSSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
| 并行/串行 | SERIAL |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 串行总线类型 | 3-WIRE |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 宽度 | 2.8 mm |
| 最长写入周期时间 (tWC) | 8 ms |
| S-93A46AD0AK8T2UD | S-93A46AD0AJ8T2UD | S-93A66AD0AJ8T2UD | S-93A46AD0AT8T2UD | S-93A66AD0AT8T2UD | S-93A56AD0AT8T2UD | S-93A56AD0AJ8T2UD | S-93A56AD0AK8T2UD | S-93A66AD0AK8T2UD | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | 64X16 3-WIRE SERIAL EEPROM, PDSO8, LEAD FREE, TMSOP-8 | 64X16 3-WIRE SERIAL EEPROM, PDSO8, LEAD FREE, SOP-8 | 256X16 3-WIRE SERIAL EEPROM, PDSO8, LEAD FREE, SOP-8 | 64X16 3-WIRE SERIAL EEPROM, PDSO8, LEAD FREE, TSSOP-8 | 256X16 3-WIRE SERIAL EEPROM, PDSO8, LEAD FREE, TSSOP-8 | 128X16 3-WIRE SERIAL EEPROM, PDSO8, LEAD FREE, TSSOP-8 | 128X16 3-WIRE SERIAL EEPROM, PDSO8, LEAD FREE, SOP-8 | 128X16 3-WIRE SERIAL EEPROM, PDSO8, LEAD FREE, TMSOP-8 | 256X16 3-WIRE SERIAL EEPROM, PDSO8, LEAD FREE, TMSOP-8 |
| 厂商名称 | ABLIC | ABLIC | ABLIC | ABLIC | ABLIC | ABLIC | ABLIC | ABLIC | ABLIC |
| 零件包装代码 | MSOP | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | MSOP | MSOP |
| 包装说明 | VSSOP, | LEAD FREE, SOP-8 | LEAD FREE, SOP-8 | LEAD FREE, TSSOP-8 | TSSOP, | TSSOP, | SOP, | VSSOP, | VSSOP, |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknow | unknow | unknow |
| 最大时钟频率 (fCLK) | 0.5 MHz | 0.5 MHz | 0.5 MHz | 0.5 MHz | 0.5 MHz | 0.5 MHz | 0.5 MHz | 0.5 MHz | 0.5 MHz |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| 长度 | 2.9 mm | 5.02 mm | 5.02 mm | 4.4 mm | 4.4 mm | 4.4 mm | 5.02 mm | 2.9 mm | 2.9 mm |
| 内存密度 | 1024 bit | 1024 bit | 4096 bit | 1024 bit | 4096 bit | 2048 bit | 2048 bi | 2048 bi | 4096 bi |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 64 words | 64 words | 256 words | 64 words | 256 words | 128 words | 128 words | 128 words | 256 words |
| 字数代码 | 64 | 64 | 256 | 64 | 256 | 128 | 128 | 128 | 256 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 64X16 | 64X16 | 256X16 | 64X16 | 256X16 | 128X16 | 128X16 | 128X16 | 256X16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VSSOP | SOP | SOP | TSSOP | TSSOP | TSSOP | SOP | VSSOP | VSSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | 1.75 mm | 1.75 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.75 mm | 0.8 mm | 0.8 mm |
| 串行总线类型 | 3-WIRE | 3-WIRE | 3-WIRE | 3-WIRE | 3-WIRE | 3-WIRE | 3-WIRE | 3-WIRE | 3-WIRE |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 1.27 mm | 1.27 mm | 0.65 mm | 0.65 mm | 0.65 mm | 1.27 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 2.8 mm | 3.9 mm | 3.9 mm | 3 mm | 3 mm | 3 mm | 3.9 mm | 2.8 mm | 2.8 mm |
| 最长写入周期时间 (tWC) | 8 ms | 8 ms | 8 ms | 8 ms | 8 ms | 8 ms | 8 ms | 8 ms | 8 ms |
模拟与混合信号
WindowsCE
DSP 与 ARM 处理器
stm32/stm8
测试/测量
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