LF
BUK7K6R2-40E
6 November 2013
PA
K
56D
Dual N-channel 40 V, 5.8 mΩ standard level MOSFET
Product data sheet
1. General description
Dual standard level N-channel MOSFET in an LFPAK56D (Dual Power-SO8) package
using TrenchMOS technology. This product has been designed and qualified to
AEC Q101 standard for use in high performance automotive applications.
2. Features and benefits
•
•
•
•
•
Dual MOSFET
Q101 compliant
Repetitive avalanche rated
Suitable for thermally demanding environments due to 175 °C rating
True standard level gate with V
GS(th)
of greater than 1 V at 175 °C
3. Applications
•
•
•
•
12 V Automotive systems
Motors, lamps and solenoid control
Transmission control
Ultra high performance power switching
4. Quick reference data
Table 1.
Symbol
V
DS
I
D
P
tot
R
DSon
Quick reference data
Parameter
drain-source voltage
drain current
total power dissipation
Conditions
T
j
≥ 25 °C; T
j
≤ 175 °C
V
GS
= 10 V; Tmb = 25 °C;
Fig. 1
T
mb
= 25 °C;
Fig. 2
V
GS
= 10 V; I
D
= 20 A; T
j
= 25 °C;
Fig. 11
I
D
= 20 A; V
DS
= 32 V; V
GS
= 10 V;
T
j
= 25 °C;
Fig. 13; Fig. 14
[1]
Continuous current is limited by package.
[1]
Min
-
-
-
Typ
-
-
-
Max
40
40
68
Unit
V
A
W
Static characteristics FET1 and FET2
drain-source on-state
resistance
-
4.8
5.8
mΩ
Dynamic characteristics FET1 and FET2
Q
GD
gate-drain charge
-
10.5
-
nC
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NXP Semiconductors
BUK7K6R2-40E
Dual N-channel 40 V, 5.8 mΩ standard level MOSFET
5. Pinning information
Table 2.
Pin
1
2
3
4
5
6
7
8
Pinning information
Symbol Description
S1
G1
S2
G2
D2
D2
D1
D1
source1
gate1
source2
gate2
drain2
drain2
drain1
drain1
1
2
3
4
S1
G1
S2
G2
mbk725
Simplified outline
8
7
6
5
Graphic symbol
D1 D1
D2 D2
LFPAK56D (SOT1205)
6. Ordering information
Table 3.
Ordering information
Package
Name
BUK7K6R2-40E
LFPAK56D
Description
Plastic single ended surface mounted package (LFPAK56D); 8
leads
Version
SOT1205
Type number
7. Marking
Table 4.
Marking codes
Marking code
76E240
Type number
BUK7K6R2-40E
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
DS
V
DGR
V
GS
I
D
Parameter
drain-source voltage
drain-gate voltage
gate-source voltage
drain current
Conditions
T
j
≥ 25 °C; T
j
≤ 175 °C
R
GS
= 20 kΩ
T
j
≤ 175 °C; DC
V
GS
= 10 V; Tmb = 25 °C;
Fig. 1
T
mb
= 100 °C; V
GS
= 10 V;
Fig. 1
I
DM
P
tot
BUK7K6R2-40E
Min
-
-
-20
[1]
[1]
Max
40
40
20
40
40
308
68
Unit
V
V
V
A
A
A
W
2 / 13
-
-
-
-
peak drain current
total power dissipation
T
mb
= 25 °C; pulsed; t
p
≤ 10 µs;
Fig. 4
T
mb
= 25 °C;
Fig. 2
All information provided in this document is subject to legal disclaimers.
© NXP N.V. 2013. All rights reserved
Product data sheet
6 November 2013
NXP Semiconductors
BUK7K6R2-40E
Dual N-channel 40 V, 5.8 mΩ standard level MOSFET
Symbol
T
stg
T
j
I
S
I
SM
E
DS(AL)S
Parameter
storage temperature
junction temperature
Conditions
Min
-55
-55
Max
175
175
Unit
°C
°C
Source-drain diode FET1 and FET2
source current
peak source current
T
mb
= 25 °C
pulsed; t
p
≤ 10 µs; T
mb
= 25 °C
I
D
= 40 A; V
sup
≤ 40 V; V
GS
= 10 V;
T
j(init)
= 25 °C;
Fig. 3
[1]
-
-
40
308
A
A
Avalanche Ruggedness FET1 and FET2
non-repetitive drain-source
avalanche energy
[1]
[2]
[3]
80
[2][3]
-
157
mJ
Continuous current is limited by package.
Refer to application note AN10273 for further information
Single-pulse avalanche rating limited by maximum junction temperature of 175 °C
003aak975
I
D
(A)
120
P
der
(%)
80
03aa16
60
40
(1)
40
20
0
0
30
60
90
120
150
T
j
(°C)
180
0
0
50
100
150
T
mb
(°C)
200
(1) Capped at 40A due to package
Fig. 1.
Continuous drain current as a function of
mounting base temperature
Fig. 2.
Normalized total power dissipation as a
function of mounting base temperature
BUK7K6R2-40E
All information provided in this document is subject to legal disclaimers.
© NXP N.V. 2013. All rights reserved
Product data sheet
6 November 2013
3 / 13
NXP Semiconductors
BUK7K6R2-40E
Dual N-channel 40 V, 5.8 mΩ standard level MOSFET
I
AL
(A)
10
2
003aak976
10
(1)
(2)
1
(3)
10
-1
10
-3
10
-2
10
-1
1
t
AL
(ms)
10
Fig. 3.
Avalanche rating; avalanche current as a function of avalanche time
I
D
(A)
10
3
003aak977
Limit R
DSon
= V
DS
/ I
D
10
2
t
p
= 10 us
100 us
10
1
DC
1 ms
10 ms
100 ms
10
-1
10
-1
1
10
V
DS
(V)
10
2
Fig. 4.
Safe operating area; continuous and peak drain currents as a function of drain-source voltage
9. Thermal characteristics
Table 6.
Symbol
R
th(j-mb)
Thermal characteristics
Parameter
thermal resistance
from junction to
mounting base
thermal resistance
from junction to
ambient
Conditions
Fig. 5
Min
-
Typ
-
Max
2.21
Unit
K/W
R
th(j-a)
Minimum footprint; mounted on a
printed circuit board
-
95
-
K/W
BUK7K6R2-40E
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© NXP N.V. 2013. All rights reserved
Product data sheet
6 November 2013
4 / 13
NXP Semiconductors
BUK7K6R2-40E
Dual N-channel 40 V, 5.8 mΩ standard level MOSFET
Z
th(j-mb)
(K/W)
10
003aak978
1
δ = 0.5
0.2
10
-1
0.1
0.05
0.02
single shot
P
δ=
t
p
T
10
-2
t
p
10
-3
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
t
T
t
p
(s)
1
Fig. 5.
Transient thermal impedance from junction to mounting base as a function of pulse duration
10. Characteristics
Table 7.
Symbol
V
(BR)DSS
Characteristics
Parameter
drain-source
breakdown voltage
gate-source threshold
voltage
Conditions
I
D
= 250 µA; V
GS
= 0 V; T
j
= -55 °C
I
D
= 250 µA; V
GS
= 0 V; T
j
= 25 °C
I
D
= 1 mA; V
DS
= V
GS
; T
j
= 25 °C;
Fig. 9; Fig. 10
I
D
= 1 mA; V
DS
= V
GS
; T
j
= 175 °C;
Fig. 9; Fig. 10
I
D
= 1 mA; V
DS
= V
GS
; T
j
= -55 °C;
Fig. 9; Fig. 10
I
DSS
drain leakage current
V
DS
= 40 V; V
GS
= 0 V; T
j
= 25 °C
V
DS
= 40 V; V
GS
= 0 V; T
j
= 175 °C
I
GSS
gate leakage current
V
GS
= -20 V; V
DS
= 0 V; T
j
= 25 °C
V
GS
= 20 V; V
DS
= 0 V; T
j
= 25 °C
R
DSon
drain-source on-state
resistance
V
GS
= 10 V; I
D
= 20 A; T
j
= 25 °C;
Fig. 11
V
GS
= 10 V; I
D
= 20 A; T
j
= 175 °C;
Fig. 11; Fig. 12
Dynamic characteristics FET1 and FET2
Q
G(tot)
Q
GS
Q
GD
BUK7K6R2-40E
Min
36
40
2.4
1
-
-
-
-
-
-
-
Typ
-
-
3
-
-
0.02
-
2
2
4.8
9.5
Max
-
-
4
-
4.5
1
500
100
100
5.8
11.4
Unit
V
V
V
V
V
µA
µA
nA
nA
mΩ
mΩ
Static characteristics FET1 and FET2
V
GS(th)
total gate charge
gate-source charge
gate-drain charge
I
D
= 20 A; V
DS
= 32 V; V
GS
= 10 V;
T
j
= 25 °C;
Fig. 13; Fig. 14
-
-
-
32.3
7.2
10.5
-
-
-
nC
nC
nC
All information provided in this document is subject to legal disclaimers.
© NXP N.V. 2013. All rights reserved
Product data sheet
6 November 2013
5 / 13
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