IC 3-CHANNEL, SGL ENDED MULTIPLEXER, QCC24, 4 X 4 MM, LEAD FREE, MO-220VGGD-2, LFCSP-24, Multiplexer or Switch
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | ADI(亚德诺半导体) |
零件包装代码 | QFN |
包装说明 | 4 X 4 MM, LEAD FREE, MO-220VGGD-2, LFCSP-24 |
针数 | 24 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
其他特性 | ALSO OPERATE AT 5V SUPPLY |
模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER |
JESD-30 代码 | S-XQCC-N24 |
JESD-609代码 | e3 |
长度 | 4 mm |
信道数量 | 3 |
功能数量 | 1 |
端子数量 | 24 |
标称断态隔离度 | 60 dB |
通态电阻匹配规范 | 0.15 Ω |
最大通态电阻 (Ron) | 6 Ω |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | UNSPECIFIED |
封装代码 | HVQCCN |
封装等效代码 | LCC24,.16SQ,20 |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 |
电源 | 3/5 V |
认证状态 | Not Qualified |
座面最大高度 | 1 mm |
最大信号电流 | 0.1 A |
最大供电电流 (Isup) | 0.7 mA |
最大供电电压 (Vsup) | 3.3 V |
最小供电电压 (Vsup) | 2.7 V |
标称供电电压 (Vsup) | 3 V |
表面贴装 | YES |
最长断开时间 | 255 ns |
最长接通时间 | 260 ns |
切换 | BREAK-BEFORE-MAKE |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Matte Tin (Sn) |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 40 |
宽度 | 4 mm |
ADG793ACCPZ-REEL | ADG793ACCPZ-500RL7 | ADG793GBCPZ-500RL7 | ADG793GCCPZ-500RL7 | ADG793GCCPZ-REEL | |
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描述 | IC 3-CHANNEL, SGL ENDED MULTIPLEXER, QCC24, 4 X 4 MM, LEAD FREE, MO-220VGGD-2, LFCSP-24, Multiplexer or Switch | IC 3-CHANNEL, SGL ENDED MULTIPLEXER, QCC24, 4 X 4 MM, LEAD FREE, MO-220VGGD-2, LFCSP-24, Multiplexer or Switch | IC 3-CHANNEL, SGL ENDED MULTIPLEXER, QCC24, 4 X 4 MM, LEAD FREE, MO-220VGGD-2, LFCSP-24, Multiplexer or Switch | IC 3-CHANNEL, SGL ENDED MULTIPLEXER, QCC24, 4 X 4 MM, LEAD FREE, MO-220VGGD-2, LFCSP-24, Multiplexer or Switch | IC 3-CHANNEL, SGL ENDED MULTIPLEXER, QCC24, 4 X 4 MM, LEAD FREE, MO-220VGGD-2, LFCSP-24, Multiplexer or Switch |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
零件包装代码 | QFN | QFN | QFN | QFN | QFN |
包装说明 | 4 X 4 MM, LEAD FREE, MO-220VGGD-2, LFCSP-24 | 4 X 4 MM, LEAD FREE, MO-220VGGD-2, LFCSP-24 | 4 X 4 MM, LEAD FREE, MO-220VGGD-2, LFCSP-24 | 4 X 4 MM, LEAD FREE, MO-220VGGD-2, LFCSP-24 | 4 X 4 MM, LEAD FREE, MO-220VGGD-2, LFCSP-24 |
针数 | 24 | 24 | 24 | 24 | 24 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
其他特性 | ALSO OPERATE AT 5V SUPPLY | ALSO OPERATE AT 5V SUPPLY | ALSO OPERATE AT 5V SUPPLY | ALSO OPERATE AT 5V SUPPLY | ALSO OPERATE AT 5V SUPPLY |
模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
JESD-30 代码 | S-XQCC-N24 | S-XQCC-N24 | S-XQCC-N24 | S-XQCC-N24 | S-XQCC-N24 |
JESD-609代码 | e3 | e3 | e3 | e3 | e3 |
长度 | 4 mm | 4 mm | 4 mm | 4 mm | 4 mm |
信道数量 | 3 | 3 | 3 | 3 | 3 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 24 | 24 | 24 | 24 | 24 |
标称断态隔离度 | 60 dB | 60 dB | 60 dB | 60 dB | 60 dB |
通态电阻匹配规范 | 0.15 Ω | 0.15 Ω | 0.15 Ω | 0.15 Ω | 0.15 Ω |
最大通态电阻 (Ron) | 6 Ω | 6 Ω | 6 Ω | 6 Ω | 6 Ω |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
封装等效代码 | LCC24,.16SQ,20 | LCC24,.16SQ,20 | LCC24,.16SQ,20 | LCC24,.16SQ,20 | LCC24,.16SQ,20 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 |
电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
最大信号电流 | 0.1 A | 0.1 A | 0.1 A | 0.1 A | 0.1 A |
最大供电电流 (Isup) | 0.7 mA | 0.7 mA | 0.7 mA | 0.7 mA | 0.7 mA |
最大供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V |
表面贴装 | YES | YES | YES | YES | YES |
最长断开时间 | 255 ns | 255 ns | 255 ns | 255 ns | 255 ns |
最长接通时间 | 260 ns | 260 ns | 260 ns | 260 ns | 260 ns |
切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | 40 |
宽度 | 4 mm | 4 mm | 4 mm | 4 mm | 4 mm |
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