IC OP-AMP, 800 uV OFFSET-MAX, 4.5 MHz BAND WIDTH, PDSO16, SOIC-16, Operational Amplifier
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | ADI(亚德诺半导体) |
零件包装代码 | SOIC |
包装说明 | SOIC-16 |
针数 | 16 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
放大器类型 | OPERATIONAL AMPLIFIER |
最大平均偏置电流 (IIB) | 0.0004 µA |
最小共模抑制比 | 80 dB |
标称共模抑制比 | 95 dB |
最大输入失调电压 | 800 µV |
JESD-30 代码 | R-PDSO-G16 |
JESD-609代码 | e0 |
长度 | 10.3 mm |
负供电电压上限 | -18 V |
标称负供电电压 (Vsup) | -15 V |
功能数量 | 1 |
端子数量 | 16 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
认证状态 | Not Qualified |
座面最大高度 | 2.65 mm |
标称压摆率 | 2.8 V/us |
最大压摆率 | 10 mA |
供电电压上限 | 18 V |
标称供电电压 (Vsup) | 15 V |
表面贴装 | YES |
技术 | BIFET |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
标称均一增益带宽 | 4500 kHz |
宽度 | 7.5 mm |
AD743AR | AD743AR-16 | AD743AR-16-REEL | AD743JCHIPS | AD743SCHIPS | AD743SQ | AD743KR | AD743AQ | AD743KR-16-REEL7 | |
---|---|---|---|---|---|---|---|---|---|
描述 | IC OP-AMP, 800 uV OFFSET-MAX, 4.5 MHz BAND WIDTH, PDSO16, SOIC-16, Operational Amplifier | IC OP-AMP, 1500 uV OFFSET-MAX, 4.5 MHz BAND WIDTH, PDSO16, SOIC-16, Operational Amplifier | IC OP-AMP, 1500 uV OFFSET-MAX, 4.5 MHz BAND WIDTH, PDSO16, SOIC-16, Operational Amplifier | IC OP-AMP, 1500 uV OFFSET-MAX, 4.5 MHz BAND WIDTH, UUC7, DIE-7, Operational Amplifier | IC OP-AMP, 1000 uV OFFSET-MAX, 4.5 MHz BAND WIDTH, UUC7, DIE-7, Operational Amplifier | IC OP-AMP, 2000 uV OFFSET-MAX, 4.5 MHz BAND WIDTH, CDIP8, CERDIP-8, Operational Amplifier | IC OP-AMP, 500 uV OFFSET-MAX, 4.5 MHz BAND WIDTH, PDSO16, SOIC-16, Operational Amplifier | IC OP-AMP, 1500 uV OFFSET-MAX, 4.5 MHz BAND WIDTH, CDIP8, CERDIP-8, Operational Amplifier | IC OP-AMP, 1000 uV OFFSET-MAX, 4.5 MHz BAND WIDTH, PDSO16, SOIC-16, Operational Amplifier |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
零件包装代码 | SOIC | SOIC | SOIC | DIE | DIE | DIP | SOIC | DIP | SOIC |
包装说明 | SOIC-16 | SOIC-16 | SOIC-16 | DIE-7 | DIE-7 | DIP, DIP8,.3 | SOIC-16 | DIP, DIP8,.3 | SOP, SOP16,.3 |
针数 | 16 | 16 | 16 | 7 | 7 | 8 | 16 | 8 | 16 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
最大平均偏置电流 (IIB) | 0.0004 µA | 0.0006 µA | 0.0006 µA | 0.0006 µA | 0.0004 µA | 0.0006 µA | 0.00025 µA | 0.0006 µA | 0.0004 µA |
最小共模抑制比 | 80 dB | 78 dB | 78 dB | 78 dB | 80 dB | 78 dB | 90 dB | 78 dB | 88 dB |
最大输入失调电压 | 800 µV | 1500 µV | 1500 µV | 1500 µV | 1000 µV | 2000 µV | 500 µV | 1500 µV | 1000 µV |
JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-XUUC-N7 | R-XUUC-N7 | R-GDIP-T8 | R-PDSO-G16 | R-GDIP-T8 | R-PDSO-G16 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
负供电电压上限 | -18 V | -18 V | -18 V | -18 V | -18 V | -18 V | -18 V | -18 V | -18 V |
标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 16 | 16 | 16 | 7 | 7 | 8 | 16 | 8 | 16 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 70 °C | 125 °C | 125 °C | 70 °C | 85 °C | 70 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | - | -55 °C | -55 °C | - | -40 °C | - |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
封装代码 | SOP | SOP | SOP | DIE | DIE | DIP | SOP | DIP | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | UNCASED CHIP | UNCASED CHIP | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | 220 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
标称压摆率 | 2.8 V/us | 2.8 V/us | 2.8 V/us | 2.8 V/us | 2.8 V/us | 2.8 V/us | 2.8 V/us | 2.8 V/us | 2.8 V/us |
最大压摆率 | 10 mA | 10 mA | 10 mA | 10 mA | 10 mA | 10 mA | 10 mA | 10 mA | 10 mA |
供电电压上限 | 18 V | 18 V | 18 V | 18 V | 18 V | 18 V | 18 V | 18 V | 18 V |
标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
表面贴装 | YES | YES | YES | YES | YES | NO | YES | NO | YES |
技术 | BIFET | BIPOLAR | BIPOLAR | BIPOLAR | BIFET | BIPOLAR | BIFET | BIPOLAR | BIPOLAR |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | GULL WING | NO LEAD | NO LEAD | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING |
端子位置 | DUAL | DUAL | DUAL | UPPER | UPPER | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | 30 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
标称均一增益带宽 | 4500 kHz | 4500 kHz | 4500 kHz | 4500 kHz | 4500 kHz | 4500 kHz | 4500 kHz | 4500 kHz | 4500 kHz |
标称共模抑制比 | 95 dB | - | - | 95 dB | 95 dB | 95 dB | 102 dB | 95 dB | 102 dB |
长度 | 10.3 mm | 10.3 mm | 10.3 mm | - | - | - | 10.3 mm | - | 10.3 mm |
座面最大高度 | 2.65 mm | 2.65 mm | 2.65 mm | - | - | 5.08 mm | 2.65 mm | 5.08 mm | 2.64 mm |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | - | - | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
宽度 | 7.5 mm | 7.5 mm | 7.5 mm | - | - | 7.62 mm | 7.5 mm | 7.62 mm | 7.5 mm |
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