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CA91C142B-33CB

产品描述VME Bus Controller, CMOS, CBGA361, 25 X 25 MM, CERAMIC, BGA-361
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小2MB,共428页
制造商Tundra Semiconductor Corp
下载文档 详细参数 选型对比 全文预览

CA91C142B-33CB概述

VME Bus Controller, CMOS, CBGA361, 25 X 25 MM, CERAMIC, BGA-361

CA91C142B-33CB规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Tundra Semiconductor Corp
包装说明25 X 25 MM, CERAMIC, BGA-361
Reach Compliance Codeunknown
地址总线宽度64
总线兼容性PCI
最大时钟频率33 MHz
最大数据传输速率70 MBps
外部数据总线宽度64
JESD-30 代码S-CBGA-B361
端子数量361
最高工作温度70 °C
最低工作温度
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码BGA
封装形状SQUARE
封装形式GRID ARRAY
认证状态Not Qualified
最大供电电压5.5 V
最小供电电压4.5 V
标称供电电压5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子形式BALL
端子位置BOTTOM
uPs/uCs/外围集成电路类型BUS CONTROLLER, VME

文档预览

下载PDF文档
TitlePage - 80A3010_MA001_03
Universe II
VME-to-PCI Bus Bridge Manual
User Manual
Document Number: 80A3010_MA001_03
Document Status: Final
Release Date: November 2002
This document discusses the features, capabilities, and
configuration requirements of the Universe II. It is intended for
hardware and software engineers who are designing system
interconnect applications with the Universe II.
Tundra Semiconductor Corporation

CA91C142B-33CB相似产品对比

CA91C142B-33CB CA91C142B-33IE CA91C142D-25EE CA91C142B-25EE CA91C142D-33IE CA91C142D-33CE CA91C142B-33CE CA91C142B-33IB CA91C142B-25EB
描述 VME Bus Controller, CMOS, CBGA361, 25 X 25 MM, CERAMIC, BGA-361 VME Bus Controller, CMOS, PBGA313, 35 X 35 MM, PLASTIC, BGA-313 VME Bus Controller, CMOS, PBGA313, 35 X 35 MM, PLASTIC, BGA-313 VME Bus Controller, CMOS, PBGA313, 35 X 35 MM, PLASTIC, BGA-313 VME Bus Controller, CMOS, PBGA313, 35 X 35 MM, PLASTIC, BGA-313 VME Bus Controller, CMOS, PBGA313, 35 X 35 MM, PLASTIC, BGA-313 VME Bus Controller, CMOS, PBGA313, 35 X 35 MM, PLASTIC, BGA-313 VME Bus Controller, CMOS, CBGA361, 25 X 25 MM, CERAMIC, BGA-361 VME Bus Controller, CMOS, CBGA361, 25 X 25 MM, CERAMIC, BGA-361
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
厂商名称 Tundra Semiconductor Corp Tundra Semiconductor Corp Tundra Semiconductor Corp Tundra Semiconductor Corp Tundra Semiconductor Corp Tundra Semiconductor Corp Tundra Semiconductor Corp Tundra Semiconductor Corp Tundra Semiconductor Corp
包装说明 25 X 25 MM, CERAMIC, BGA-361 35 X 35 MM, PLASTIC, BGA-313 35 X 35 MM, PLASTIC, BGA-313 35 X 35 MM, PLASTIC, BGA-313 35 X 35 MM, PLASTIC, BGA-313 35 X 35 MM, PLASTIC, BGA-313 35 X 35 MM, PLASTIC, BGA-313 25 X 25 MM, CERAMIC, BGA-361 25 X 25 MM, CERAMIC, BGA-361
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknow
地址总线宽度 64 64 64 64 64 64 64 64 64
总线兼容性 PCI PCI PCI PCI PCI PCI PCI PCI PCI
最大时钟频率 33 MHz 33 MHz 25 MHz 25 MHz 33 MHz 33 MHz 33 MHz 33 MHz 25 MHz
最大数据传输速率 70 MBps 70 MBps 70 MBps 70 MBps 70 MBps 70 MBps 70 MBps 70 MBps 70 MBps
外部数据总线宽度 64 64 64 64 64 64 64 64 64
JESD-30 代码 S-CBGA-B361 S-PBGA-B313 S-PBGA-B313 S-PBGA-B313 S-PBGA-B313 S-PBGA-B313 S-PBGA-B313 S-CBGA-B361 S-CBGA-B361
端子数量 361 313 313 313 313 313 313 361 361
最高工作温度 70 °C 85 °C 125 °C 125 °C 85 °C 70 °C 70 °C 85 °C 125 °C
最低工作温度 - -40 °C -55 °C -55 °C -40 °C - - -40 °C -55 °C
封装主体材料 CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装代码 BGA IBGA IBGA IBGA IBGA IBGA IBGA BGA BGA
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY, INTERSTITIAL PITCH GRID ARRAY, INTERSTITIAL PITCH GRID ARRAY, INTERSTITIAL PITCH GRID ARRAY, INTERSTITIAL PITCH GRID ARRAY, INTERSTITIAL PITCH GRID ARRAY, INTERSTITIAL PITCH GRID ARRAY GRID ARRAY
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
最大供电电压 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL INDUSTRIAL MILITARY MILITARY INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL MILITARY
端子形式 BALL BALL BALL BALL BALL BALL BALL BALL BALL
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
uPs/uCs/外围集成电路类型 BUS CONTROLLER, VME BUS CONTROLLER, VME BUS CONTROLLER, VME BUS CONTROLLER, VME BUS CONTROLLER, VME BUS CONTROLLER, VME BUS CONTROLLER, VME BUS CONTROLLER, VME BUS CONTROLLER, VME
长度 - 35 mm 35 mm 35 mm 35 mm 35 mm 35 mm - -
座面最大高度 - 3.5 mm 3.5 mm 3.5 mm 3.5 mm 3.5 mm 3.5 mm - -
端子节距 - 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm - -
宽度 - 35 mm 35 mm 35 mm 35 mm 35 mm 35 mm - -

 
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