EE PLD, 25ns, 24-Cell, CMOS, CQCC44, 0.600 INCH, CERAMIC, LCC-44
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Atmel (Microchip) |
| 零件包装代码 | LCC |
| 包装说明 | QCCN, LCC44,.65SQ |
| 针数 | 44 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A001.A.2.C |
| 其他特性 | NO |
| 最大时钟频率 | 27 MHz |
| 系统内可编程 | NO |
| JESD-30 代码 | S-CQCC-N44 |
| JESD-609代码 | e0 |
| JTAG BST | NO |
| 长度 | 16.55 mm |
| 专用输入次数 | 14 |
| I/O 线路数量 | 24 |
| 宏单元数 | 24 |
| 端子数量 | 44 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 14 DEDICATED INPUTS, 24 I/O |
| 输出函数 | MACROCELL |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装等效代码 | LCC44,.65SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 5 V |
| 可编程逻辑类型 | EE PLD |
| 传播延迟 | 25 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B |
| 座面最大高度 | 2.74 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 16.55 mm |
| ATF2500CQ-25NM/883 | ATF2500CQL-30GM/883 | ATF2500CQL-30KM/883 | ATF2500CQL-30NM/883 | ATF2500CQ-25GM/883 | ATF2500CQ-25KM/883 | ATF2500CQ-25JI | ATF2500CQ-25PI | ATF2500CQ-25JC | ATF2500CQ-25PC | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | EE PLD, 25ns, 24-Cell, CMOS, CQCC44, 0.600 INCH, CERAMIC, LCC-44 | EE PLD, 30ns, 24-Cell, CMOS, CDIP40, 0.600 INCH, CERDIP-40 | EE PLD, 30ns, 24-Cell, CMOS, CQCC44, CERAMIC, LCC-44 | EE PLD, 30ns, 24-Cell, CMOS, CQCC44, 0.600 INCH, CERAMIC, LCC-44 | EE PLD, 25ns, 24-Cell, CMOS, CDIP40, 0.600 INCH, CERDIP-40 | EE PLD, 25ns, 24-Cell, CMOS, CQCC44, CERAMIC, LCC-44 | EE PLD, 25ns, 24-Cell, CMOS, PQCC44, PLASTIC, MS-018AC, LCC-44 | EE PLD, 25ns, 24-Cell, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 | EE PLD, 25ns, 24-Cell, CMOS, PQCC44, PLASTIC, MS-018AC, LCC-44 | EE PLD, 25ns, 24-Cell, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | LCC | DIP | LCC | LCC | DIP | LCC | LPCC | DIP | LPCC | DIP |
| 包装说明 | QCCN, LCC44,.65SQ | 0.600 INCH, CERDIP-40 | QCCJ, LDCC44,.7SQ | QCCN, LCC44,.65SQ | 0.600 INCH, CERDIP-40 | QCCJ, LDCC44,.7SQ | PLASTIC, MS-018AC, LCC-44 | 0.600 INCH, PLASTIC, DIP-40 | PLASTIC, MS-018AC, LCC-44 | 0.600 INCH, PLASTIC, DIP-40 |
| 针数 | 44 | 40 | 44 | 44 | 40 | 44 | 44 | 40 | 44 | 40 |
| Reach Compliance Code | compliant | not_compliant | compliant | compliant | not_compliant | compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| 其他特性 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 最大时钟频率 | 27 MHz | 23 MHz | 23 MHz | 23 MHz | 27 MHz | 27 MHz | 27 MHz | 27 MHz | 27 MHz | 27 MHz |
| 系统内可编程 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| JESD-30 代码 | S-CQCC-N44 | R-GDIP-T40 | S-CQCC-J44 | S-CQCC-N44 | R-GDIP-T40 | S-CQCC-J44 | S-PQCC-J44 | R-PDIP-T40 | S-PQCC-J44 | R-PDIP-T40 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| JTAG BST | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 长度 | 16.55 mm | 52.45 mm | 16.65 mm | 16.55 mm | 52.45 mm | 16.65 mm | 16.5862 mm | 52.2 mm | 16.5862 mm | 52.2 mm |
| 专用输入次数 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| I/O 线路数量 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| 宏单元数 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| 端子数量 | 44 | 40 | 44 | 44 | 40 | 44 | 44 | 40 | 44 | 40 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 85 °C | 85 °C | 70 °C | 70 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -40 °C | -40 °C | - | - |
| 组织 | 14 DEDICATED INPUTS, 24 I/O | 14 DEDICATED INPUTS, 24 I/O | 14 DEDICATED INPUTS, 24 I/O | 14 DEDICATED INPUTS, 24 I/O | 14 DEDICATED INPUTS, 24 I/O | 14 DEDICATED INPUTS, 24 I/O | 14 DEDICATED INPUTS, 24 I/O | 14 DEDICATED INPUTS, 24 I/O | 14 DEDICATED INPUTS, 24 I/O | 14 DEDICATED INPUTS, 24 I/O |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCN | DIP | QCCJ | QCCN | DIP | QCCJ | QCCJ | DIP | QCCJ | DIP |
| 封装等效代码 | LCC44,.65SQ | DIP40,.6 | LDCC44,.7SQ | LCC44,.65SQ | DIP40,.6 | LDCC44,.7SQ | LDCC44,.7SQ | DIP40,.6 | LDCC44,.7SQ | DIP40,.6 |
| 封装形状 | SQUARE | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
| 传播延迟 | 25 ns | 30 ns | 30 ns | 30 ns | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.74 mm | 5.72 mm | 4.57 mm | 2.74 mm | 5.72 mm | 4.57 mm | 4.57 mm | 5.59 mm | 4.57 mm | 5.59 mm |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.25 V | 5.25 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.75 V | 4.75 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | YES | NO | YES | YES | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD | THROUGH-HOLE | J BEND | NO LEAD | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | QUAD | DUAL | QUAD | QUAD | DUAL | QUAD | QUAD | DUAL | QUAD | DUAL |
| 宽度 | 16.55 mm | 15.24 mm | 16.65 mm | 16.55 mm | 15.24 mm | 16.65 mm | 16.5862 mm | 15.24 mm | 16.5862 mm | 15.24 mm |
| 厂商名称 | Atmel (Microchip) | - | - | - | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | - | - | - | - |
| 峰值回流温度（摄氏度） | 240 | NOT SPECIFIED | - | 240 | NOT SPECIFIED | 225 | 225 | NOT SPECIFIED | 225 | NOT SPECIFIED |
| 筛选级别 | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | - | - | - | - |
| 处于峰值回流温度下的最长时间 | 30 | NOT SPECIFIED | - | 30 | NOT SPECIFIED | 30 | 30 | NOT SPECIFIED | 30 | NOT SPECIFIED |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
