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IDT72T51343L6BB: 产品描述FIFO, 64KX18, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256; 产品类别存储存储; 文件大小515KB，共55页; 制造商IDT (Integrated Device Technology)

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IDT72T51343L6BB概述

FIFO, 64KX18, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256

IDT72T51343L6BB规格参数

参数名称	属性值
是否无铅	含铅
是否Rohs认证	不符合
厂商名称	IDT (Integrated Device Technology)
零件包装代码	BGA
包装说明	17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
针数	256
Reach Compliance Code	not_compliant
ECCN代码	EAR99
最长访问时间	3.7 ns
周期时间	6 ns
JESD-30 代码	S-PBGA-B256
JESD-609代码	e0
长度	17 mm
内存密度	1179648 bit
内存宽度	18
湿度敏感等级	3
功能数量	1
端子数量	256
字数	65536 words
字数代码	64000
工作模式	SYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	64KX18
可输出	YES
封装主体材料	PLASTIC/EPOXY
封装代码	BGA
封装形状	SQUARE
封装形式	GRID ARRAY
并行/串行	PARALLEL
峰值回流温度（摄氏度）	225
认证状态	Not Qualified
座面最大高度	3.5 mm
最大供电电压 (Vsup)	2.625 V
最小供电电压 (Vsup)	2.375 V
标称供电电压 (Vsup)	2.5 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	BALL
端子节距	1 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	20
宽度	17 mm

IDT72T51343L6BB相似产品对比

	IDT72T51343L6BB	IDT72T51353L6BBI	IDT72T51353L5BB	IDT72T51353L6BB	IDT72T51343L5BB	IDT72T51343L6BBI	IDT72T51333L6BBI	IDT72T51333L5BB	IDT72T51333L6BB
描述	FIFO, 64KX18, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256	FIFO, 128KX18, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256	FIFO, 128KX18, 3.6ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256	FIFO, 128KX18, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256	FIFO, 64KX18, 3.6ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256	FIFO, 64KX18, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256	FIFO, 32KX18, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256	FIFO, 32KX18, 3.6ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256	FIFO, 32KX18, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
是否无铅	含铅	含铅	含铅	含铅	含铅	含铅	含铅	含铅	含铅
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
厂商名称	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
零件包装代码	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
包装说明	17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256	17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256	17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256	17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256	17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256	17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256	17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256	17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256	17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
针数	256	256	256	256	256	256	256	256	256
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	_compli	_compli	_compli
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
最长访问时间	3.7 ns	3.7 ns	3.6 ns	3.7 ns	3.6 ns	3.7 ns	3.7 ns	3.6 ns	3.7 ns
周期时间	6 ns	6 ns	5 ns	6 ns	5 ns	6 ns	6 ns	5 ns	6 ns
JESD-30 代码	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0	e0
长度	17 mm	17 mm	17 mm	17 mm	17 mm	17 mm	17 mm	17 mm	17 mm
内存密度	1179648 bit	2359296 bit	2359296 bit	2359296 bit	1179648 bit	1179648 bit	589824 bi	589824 bi	589824 bi
内存宽度	18	18	18	18	18	18	18	18	18
湿度敏感等级	3	3	3	3	3	3	3	3	3
功能数量	1	1	1	1	1	1	1	1	1
端子数量	256	256	256	256	256	256	256	256	256
字数	65536 words	131072 words	131072 words	131072 words	65536 words	65536 words	32768 words	32768 words	32768 words
字数代码	64000	128000	128000	128000	64000	64000	32000	32000	32000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	70 °C	85 °C	70 °C	70 °C	70 °C	85 °C	85 °C	70 °C	70 °C
组织	64KX18	128KX18	128KX18	128KX18	64KX18	64KX18	32KX18	32KX18	32KX18
可输出	YES	YES	YES	YES	YES	YES	YES	YES	YES
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	225	225	225	225	225	225	225	225	225
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	3.5 mm	3.5 mm	3.5 mm	3.5 mm	3.5 mm	3.5 mm	3.5 mm	3.5 mm	3.5 mm
最大供电电压 (Vsup)	2.625 V	2.625 V	2.625 V	2.625 V	2.625 V	2.625 V	2.625 V	2.625 V	2.625 V
最小供电电压 (Vsup)	2.375 V	2.375 V	2.375 V	2.375 V	2.375 V	2.375 V	2.375 V	2.375 V	2.375 V
标称供电电压 (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
处于峰值回流温度下的最长时间	20	20	20	20	20	20	20	20	20
宽度	17 mm	17 mm	17 mm	17 mm	17 mm	17 mm	17 mm	17 mm	17 mm

IDT72T51343L6BB

IDT72T51343L6BB概述

IDT72T51343L6BB规格参数

IDT72T51343L6BB相似产品对比

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