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SMJ416400-10HKB

产品描述4MX4 FAST PAGE DRAM, 100ns, CDFP28, CERAMIC, DFP-28
产品类别存储    存储   
文件大小542KB,共22页
制造商Texas Instruments(德州仪器)
官网地址http://www.ti.com.cn/
敬请期待 详细参数 选型对比

SMJ416400-10HKB概述

4MX4 FAST PAGE DRAM, 100ns, CDFP28, CERAMIC, DFP-28

SMJ416400-10HKB规格参数

参数名称属性值
厂商名称Texas Instruments(德州仪器)
零件包装代码DFP
包装说明DFP,
针数28
Reach Compliance Codeunknown
ECCN代码EAR99
访问模式FAST PAGE
最长访问时间100 ns
其他特性RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 代码R-CDFP-F28
长度19.655 mm
内存密度16777216 bit
内存集成电路类型FAST PAGE DRAM
内存宽度4
功能数量1
端口数量1
端子数量28
字数4194304 words
字数代码4000000
工作模式ASYNCHRONOUS
最高工作温度125 °C
最低工作温度-55 °C
组织4MX4
输出特性3-STATE
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码DFP
封装形状RECTANGULAR
封装形式FLATPACK
认证状态Not Qualified
刷新周期4096
座面最大高度3.32 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子形式FLAT
端子节距1.27 mm
端子位置DUAL
宽度11.43 mm

SMJ416400-10HKB相似产品对比

SMJ416400-10HKB SMJ416400-70HKB SMJ416400-80HKB SMJ416400-80SV SMJ416400-70FNC SMJ416400-80FNC SMJ416400-10SV SMJ416400-10FNC SMJ416400-70SV
描述 4MX4 FAST PAGE DRAM, 100ns, CDFP28, CERAMIC, DFP-28 4MX4 FAST PAGE DRAM, 70ns, CDFP28, CERAMIC, DFP-28 4MX4 FAST PAGE DRAM, 80ns, CDFP28, CERAMIC, DFP-28 4MX4 FAST PAGE DRAM, 80ns, CZIP24, CERAMIC, ZIP-24 4MX4 FAST PAGE DRAM, 70ns, CDSO24, 0.450 INCH, CERAMIC, LCC-28/24 4MX4 FAST PAGE DRAM, 80ns, CDSO24, 0.450 INCH, CERAMIC, LCC-28/24 4MX4 FAST PAGE DRAM, 100ns, CZIP24, CERAMIC, ZIP-24 4MX4 FAST PAGE DRAM, 100ns, CDSO24, 0.450 INCH, CERAMIC, LCC-28/24 4MX4 FAST PAGE DRAM, 70ns, CZIP24, CERAMIC, ZIP-24
零件包装代码 DFP DFP DFP ZIP DLCC DLCC ZIP DLCC ZIP
包装说明 DFP, CERAMIC, DFP-28 CERAMIC, DFP-28 CERAMIC, ZIP-24 0.450 INCH, CERAMIC, LCC-28/24 SON, ZIP, SON, ZIP,
针数 28 28 28 24 28/24 28/24 24 28/24 24
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
访问模式 FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE
最长访问时间 100 ns 70 ns 80 ns 80 ns 70 ns 80 ns 100 ns 100 ns 70 ns
其他特性 RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 代码 R-CDFP-F28 R-CDFP-F28 R-CDFP-F28 R-CZIP-T24 R-CDSO-N24 R-CDSO-N24 R-CZIP-T24 R-CDSO-N24 R-CZIP-T24
长度 19.655 mm 19.655 mm 19.655 mm 31.75 mm 19.685 mm 19.685 mm 31.75 mm 19.685 mm 31.75 mm
内存密度 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit
内存集成电路类型 FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM
内存宽度 4 4 4 4 4 4 4 4 4
功能数量 1 1 1 1 1 1 1 1 1
端口数量 1 1 1 1 1 1 1 1 1
端子数量 28 28 28 24 24 24 24 24 24
字数 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words
字数代码 4000000 4000000 4000000 4000000 4000000 4000000 4000000 4000000 4000000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
组织 4MX4 4MX4 4MX4 4MX4 4MX4 4MX4 4MX4 4MX4 4MX4
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装代码 DFP DFP DFP ZIP SON SON ZIP SON ZIP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 FLATPACK FLATPACK FLATPACK IN-LINE SMALL OUTLINE SMALL OUTLINE IN-LINE SMALL OUTLINE IN-LINE
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
刷新周期 4096 4096 4096 4096 4096 4096 4096 4096 4096
座面最大高度 3.32 mm 3.32 mm 3.32 mm 13.08 mm 3.18 mm 3.18 mm 13.08 mm 3.18 mm 13.08 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES NO YES YES NO YES NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
端子形式 FLAT FLAT FLAT THROUGH-HOLE NO LEAD NO LEAD THROUGH-HOLE NO LEAD THROUGH-HOLE
端子节距 1.27 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm
端子位置 DUAL DUAL DUAL ZIG-ZAG DUAL DUAL ZIG-ZAG DUAL ZIG-ZAG
宽度 11.43 mm 11.43 mm 11.43 mm 2.92 mm 11.43 mm 11.43 mm 2.92 mm 11.43 mm 2.92 mm
厂商名称 Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) - Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器)
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