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UPA1900TE-A

产品描述5500mA, 20V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, THIN, MINIMOLD PACKAGE-6
产品类别分立半导体    晶体管   
文件大小62KB,共8页
制造商Renesas(瑞萨电子)
官网地址https://www.renesas.com/
标准  
下载文档 详细参数 选型对比 全文预览

UPA1900TE-A概述

5500mA, 20V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, THIN, MINIMOLD PACKAGE-6

UPA1900TE-A规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Renesas(瑞萨电子)
包装说明THIN, MINIMOLD PACKAGE-6
针数6
Reach Compliance Codecompliant
ECCN代码EAR99
其他特性ESD PROTECTED
配置SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压20 V
最大漏极电流 (Abs) (ID)5.5 A
最大漏极电流 (ID)5.5 A
最大漏源导通电阻0.045 Ω
FET 技术METAL-OXIDE SEMICONDUCTOR
JESD-30 代码R-PDSO-G6
JESD-609代码e6
元件数量1
端子数量6
工作模式ENHANCEMENT MODE
最高工作温度150 °C
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)260
极性/信道类型N-CHANNEL
最大功率耗散 (Abs)2 W
认证状态Not Qualified
表面贴装YES
端子面层Tin/Bismuth (Sn98Bi2)
端子形式GULL WING
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
晶体管应用SWITCHING
晶体管元件材料SILICON

UPA1900TE-A文档预览

DATA SHEET
MOS FIELD EFFECT TRANSISTOR
µ
PA1900
N-CHANNEL MOS FIELD EFFECT TRANSISTOR
FOR SWITCHING
DESCRIPTION
The
µ
PA1900 is a switching device which can be driven
directly by a 2.5 V power source.
The
µ
PA1900 features a low on-state resistance and
excellent switching characteristics, and is suitable for
applications such as power switch of portable machine and
so on.
2.8 ±0.2
PACKAGE DRAWING (Unit: mm)
0.32
+0.1
–0.05
0.65
–0.15
+0.1
0.16
+0.1
–0.06
6
5
4
1.5
0 to 0.1
1
2
3
FEATURES
Can be driven by a 2.5 V power source
Low on-state resistance
R
DS(on)1
= 35 mΩ MAX. (V
GS
= 4.5 V, I
D
= 3.0 A)
R
DS(on)2
= 38 mΩ MAX. (V
GS
= 4.0 V, I
D
= 3.0 A)
R
DS(on)3
= 45 mΩ MAX. (V
GS
= 2.5 V, I
D
= 3.0 A)
1, 2, 5, 6 : Drain
3
: Gate
4
: Source
0.95
0.95
0.65
0.9 to 1.1
1.9
2.9 ±0.2
ORDERING INFORMATION
PART NUMBER
PACKAGE
6-pin Mini Mold (Thin Type)
EQUIVALENT CIRCUIT
Drain
µ
PA1900TE
ABSOLUTE MAXIMUM RATINGS (T
A
= 25°C)
Drain to Source Voltage
Gate to Source Voltage
Drain Current (DC)
Drain Current (pulse)
Note1
V
DSS
V
GSS
I
D(DC)
I
D(pulse)
P
T1
Note2
20
±12
±5.5
±22
0.2
2
150
–55 to +150
V
V
A
A
W
W
°C
°C
Gate
Gate
Protection
Diode
Marking: TG
Body
Diode
Source
Total Power Dissipation
Total Power Dissipation
Channel Temperature
Storage Temperature
Notes 1.
PW
10
µ
s, Duty Cycle
1%
2.
Mounted on FR-4 Board, t
5 sec.
Remark
P
T2
T
ch
T
stg
The diode connected between the gate and source of the transistor serves as a protector against ESD.
When this device actually used, an additional protection circuit is externally required if a voltage
exceeding the rated voltage may be applied to this device.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No.
D13809EJ2V0DS00 (2nd edition)
Date Published May 2001 NS CP(K)
Printed in Japan
The mark
5
shows major revised points.
©
1998, 1999
µ
PA1900
ELECTRICAL CHARACTERISTICS (T
A
= 25°C)
CHARACTERISTICS
Zero Gate Voltage Drain Current
Gate Leakage Current
Gate Cut-off Voltage
Forward Transfer Admittance
Drain to Source On-state Resistance
SYMBOL
I
DSS
I
GSS
V
GS(off)
| y
fs
|
R
DS(on)1
R
DS(on)2
R
DS(on)3
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Total Gate Charge
Gate to Source Charge
Gate to Drain Charge
Diode Forward Voltage
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
Q
G
Q
GS
Q
GD
V
F(S-D)
TEST CONDITIONS
V
DS
= 20 V, V
GS
= 0 V
V
GS
= ±12 V, V
DS
= 0 V
V
DS
= 10 V, I
D
= 1 mA
V
DS
= 10 V, I
D
= 3.0 A
V
GS
= 4.5 V, I
D
= 3.0 A
V
GS
= 4.0 V, I
D
= 3.0 A
V
GS
= 2.5 V, I
D
= 3.0 A
V
DS
= 10 V
V
GS
= 0 V
f = 1 MHz
V
DD
= 10 V
I
D
= 3.0 A
V
GS(on)
= 4.0 V
R
G
= 10
V
DS
= 16 V
I
D
= 5.5 A
V
GS
= 4.0 V
I
F
= 5.5 A, V
GS
= 0 V
0.5
3
0.93
9.2
28
29
37
595
222
133
61
172
220
293
6.7
1.2
3.1
0.87
35
38
45
MIN.
TYP.
MAX.
10
±10
1.5
UNIT
µ
A
µ
A
V
S
mΩ
mΩ
mΩ
pF
pF
pF
ns
ns
ns
ns
nC
nC
nC
V
TEST CIRCUIT 1 SWITCHING TIME
TEST CIRCUIT 2 GATE CHARGE
D.U.T.
D.U.T.
R
L
PG.
R
G
R
G
= 10
V
DD
I
D
90 %
90 %
I
D
0 10 %
t
d(on)
t
on
t
r
t
d(off)
t
off
10 %
t
f
V
GS
I
G
= 2 mA
V
GS(on)
90 %
V
GS
Wave Form
R
L
V
DD
0
10 %
PG.
50
V
GS
0
τ
τ
= 1
µ
s
Duty Cycle
1 %
I
D
Wave Form
2
Data Sheet D13809EJ2V0DS
µ
PA1900
TYPICAL CHARACTERISTICS (T
A
= 25°C)
°
DERATING FACTOR OF FORWARD BIAS
SAFE OPERATING AREA
100
5
100
FORWARD BIAS SAFE OPERATING AREA
dT - Derating Factor - %
I
D
- Drain Current - A
80
10
R V
(@
)
L 4.
(on
=
DS GS
d
ite )
im 5 V
I
D (pulse)
PW
10
10
0m
s
5s
I
D (DC)
=1
ms
60
ms
1
40
20
0.1
0
30
60
90
120
150
0.01
0.1
Single Pulse
Mounted on 250mm
2
x 35
µ
m Copper Pad
Connected to Drain Electrode in
50mm x 50mm x 1.6mm FR-4 Board
T
A
- Ambient Temperature -
˚C
1
10
V
DS
- Drain to Source Voltage - V
100
DRAIN CURRENT vs.
DRAIN TO SOURCE VOLTAGE
20
V
GS
= 4.5 V
I
D
- Drain Current - A
FORWARD TRANSFER CHARACTERISTICS
100
V
DS
= 10 V
4.0 V
10
16
2.5 V
12
I
D
- Drain Current - A
1
0.1
0.01
0.001
0.0001
0.00001
0
T
A
= 125˚C
75˚C
8
T
A
= 25˚C
−25˚C
4
0
0.2
0.4
0.6
0.8
1.0
1.0
2.0
3.0
V
DS
- Drain to Source Voltage - V
V
GS
- Gate to Source Voltage - V
GATE CUT-OFF VOLTAGE vs.
CHANNEL TEMPERATURE
V
GS(off)
- Gate to Source Cut-off Voltage - V
FORWARD TRANSFER ADMITTANCE vs.
DRAIN CURRENT
| y
fs
| - Forward Transfer Admittance - S
1.5
V
DS
= 10 V
I
D
= 1 mA
100
V
DS
=
−10
V
10 T
A
=
−25˚C
25˚C
75˚C
125˚C
1
1.0
0.1
0.5
−50
0
50
100
150
0.01
0.01
0.1
1
10
100
T
ch
- Channel Temperature - ˚C
I
D
- Drain Current - A
Data Sheet D13809EJ2V0DS
3
µ
PA1900
R
DS(on)
- Drain to Source On-State Resistance - mΩ
R
DS(on)
- Drain to Source On-State Resistance - mΩ
DRAIN TO SOURCE ON-STATE
RESISTANCE vs. DRAIN CURRENT
60
V
GS
= 2.5 V
DRAIN TO SOURCE ON-STATE
RESISTANCE vs. DRAIN CURRENT
50
V
GS
= 4.0 V
50
T
A
=125
°C
75
°C
40
T
A
=125
°C
75
°C
40
25
°C
−25°C
30
25
°C
−25°C
30
20
0.01
0.1
1
10
100
20
0.01
0.1
1
10
100
I
D
- Drain Current - A
R
DS(on)
- Drain to Source On-State Resistance - mΩ
I
D
- Drain Current - A
50
V
GS
= 4.5 V
R
DS(on)
- Drain to Source On-state Resistance - mΩ
DRAIN TO SOURCE ON-STATE
RESISTANCE vs. DRAIN CURRENT
DRAIN TO SOURCE ON-STATE RESISTANCE vs.
CHANNEL TEMPERATURE
60
I
D
= 3.0 A
50
40
T
A
=125
°C
75
°C
V
GS
= 2.5 V
40
4.0 V
4.5 V
30
25
°C
−25°C
30
20
0.01
0.1
1
10
100
20
−50
0
50
100
150
I
D
- Drain Current - A
T
ch
- Channel Temperature -
°C
CAPACITANCE vs. DRAIN TO
SOURCE VOLTAGE
10000
f = 1 MHz
V
GS
= 0 V
R
DS(on)
- Drain to Source On-State Resistance - mΩ
DRAIN TO SOURCE ON-STATE RESISTANCE vs.
GATE TO SOURCE VOLTAGE
100
I
D
= 3.0 A
80
C
iss
, C
oss
, C
rss
- Capacitance - pF
1000
C
iss
C
oss
100
C
rss
60
40
20
0
2
4
6
8
10
10
0.1
1
10
100
V
GS
- Gate to Source Voltage - V
V
DS
- Drain Source Voltage - V
4
Data Sheet D13809EJ2V0DS
µ
PA1900
SWITCHING CHARACTERISTICS
1000
t
d(on)
, t
r
, t
d(off)
, t
f
- Switching Time - ns
SOURCE TO DRAIN DIODE
FORWARD VOLTAGE
100
t
d(off)
t
r
100
t
f
I
F(S-D)
- Diode Forward Current - A
10
t
d(on)
1
10
0.1
1.0
0.1
V
DD
= 10 V
V
GS(on)
= 4.0 V
R
G
= 10
1
I
D
- Drain Current - A
10
0.01
0.4
0.6
0.8
1.0
1.2
1.4
V
F(S-D)
- Source to Drain Voltage - V
DYNAMIC INPUT CHARACTERISTICS
10
I
D
= 5.5 A
V
DS
- Drain to Source Voltage - V
8
V
DD
= 16 V
10 V
6
4
2
0
2
4
6
8
10
12
Q
G
- Gate Charge - nC
5
1000
Single Pulse
TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH
r
th(t)
- Transient Thermal Resistance -
°C/W
Without Board
100
Mounted on 250mm
2
×35µm
Copper Pad
Connected to Drain Electrode
in 50mm×50mm×1.6mm FR-4 Board
10
1
0.001
0.01
0.1
1
PW - Pulse Width - s
10
100
1000
Data Sheet D13809EJ2V0DS
5

UPA1900TE-A相似产品对比

UPA1900TE-A
描述 5500mA, 20V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, THIN, MINIMOLD PACKAGE-6
是否无铅 不含铅
是否Rohs认证 符合
厂商名称 Renesas(瑞萨电子)
包装说明 THIN, MINIMOLD PACKAGE-6
针数 6
Reach Compliance Code compliant
ECCN代码 EAR99
其他特性 ESD PROTECTED
配置 SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压 20 V
最大漏极电流 (Abs) (ID) 5.5 A
最大漏极电流 (ID) 5.5 A
最大漏源导通电阻 0.045 Ω
FET 技术 METAL-OXIDE SEMICONDUCTOR
JESD-30 代码 R-PDSO-G6
JESD-609代码 e6
元件数量 1
端子数量 6
工作模式 ENHANCEMENT MODE
最高工作温度 150 °C
封装主体材料 PLASTIC/EPOXY
封装形状 RECTANGULAR
封装形式 SMALL OUTLINE
峰值回流温度(摄氏度) 260
极性/信道类型 N-CHANNEL
最大功率耗散 (Abs) 2 W
认证状态 Not Qualified
表面贴装 YES
端子面层 Tin/Bismuth (Sn98Bi2)
端子形式 GULL WING
端子位置 DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED
晶体管应用 SWITCHING
晶体管元件材料 SILICON

 
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