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NAND32GAH0PZA5F

产品描述Flash, 4GX8, PBGA169, 12 X 16 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, LFBGA-169
产品类别存储    存储   
文件大小698KB,共32页
制造商Numonyx ( Micron )
官网地址https://www.micron.com
标准  
下载文档 详细参数 选型对比 全文预览

NAND32GAH0PZA5F概述

Flash, 4GX8, PBGA169, 12 X 16 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, LFBGA-169

NAND32GAH0PZA5F规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Numonyx ( Micron )
零件包装代码BGA
包装说明LFBGA,
针数169
Reach Compliance Codeunknown
ECCN代码3A991.B.1.A
JESD-30 代码R-PBGA-B169
JESD-609代码e1
长度16 mm
内存密度34359738368 bit
内存集成电路类型FLASH
内存宽度8
功能数量1
端子数量169
字数4294967296 words
字数代码4000000000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-25 °C
组织4GX8
封装主体材料PLASTIC/EPOXY
封装代码LFBGA
封装形状RECTANGULAR
封装形式GRID ARRAY, LOW PROFILE, FINE PITCH
并行/串行PARALLEL
峰值回流温度(摄氏度)245
编程电压3.3 V
认证状态Not Qualified
座面最大高度1.4 mm
最大供电电压 (Vsup)3.465 V
最小供电电压 (Vsup)3.135 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级OTHER
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距0.5 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30
宽度12 mm

文档预览

下载PDF文档
NAND16GAH0P
NAND32GAH0P NAND64GAH0P
2-Gbyte, 4-Gbyte, 8-Gbyte, 1.8 V/3.3 V supply,
NAND flash memories with MultiMediaCard™ interface
Preliminary Data
Features
Packaged NAND flash memory with
MultiMediaCard interface
2, 4 and 8 Gbytes of formatted data storage
eMMC/MultiMediaCard system specification,
compliant with V4.3
Full backward compatibility with previous
MultiMediaCard system specification
Bus mode
– High-speed MultiMediaCard protocol
– Three different data bus widths:1 bit, 4 bits,
8 bits
– Data transfer rate: up to 52 Mbyte/s
Operating voltage range:
– V
CCQ
=1.8 V/3.3 V
– V
CC
= 3.3 V
Multiple block read (x8 at 52 MHz):
up to 29 Mbyte/s
Multiple block write (x8 at 52 MHz):
up to 19 Mbyte/s
Power dissipation
– Standby current: down to 100 µA (typ)
– Read current: down to 70 mA (typ)
– Write current: down to 100 mA (typ)
Trim for data management optimization
Simple boot sequence method
Enhanced power saving method by introducing
sleep functionality
Device summary
Density
2 Gbytes
4 Gbytes
8 Gbytes
LFBGA169
V
CC
= 3.3 V, V
CCQ
= 1.8 V/3.3 V
Package
Operating voltage
LFBGA169
LFBGA169 12 x 16 x 1.4 mm (ZA)
Error free memory access
– Internal error correction code
– Internal enhanced data management
algorithm (wear levelling, bad block
management, garbage collection)
– Possibility for the host to make sudden
power failure safe-update operations for
data content
Security
– Secure erase, secure trim and secure bad
block erase commands
– Disable protection modes (lock/unlock by
password and device’s permanent write
protection)
– Password protection of data
– Built-in write protection
Table 1.
Root part number
NAND16GAH0P
NAND32GAH0P
NAND64GAH0P
September 2009
Rev 3
1/32
www.numonyx.com
1
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.

NAND32GAH0PZA5F相似产品对比

NAND32GAH0PZA5F NAND16GAH0PZA5F NAND64GAH0PZA5F NAND16GAH0PZA5E
描述 Flash, 4GX8, PBGA169, 12 X 16 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, LFBGA-169 Flash, 2GX8, PBGA169, 12 X 16 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, LFBGA-169 Flash, 8GX8, PBGA169, 12 X 16 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, LFBGA-169 Flash, 2GX8, PBGA169, 12 X 16 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, LFBGA-169
是否无铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合
厂商名称 Numonyx ( Micron ) Numonyx ( Micron ) Numonyx ( Micron ) Numonyx ( Micron )
零件包装代码 BGA BGA BGA BGA
包装说明 LFBGA, LFBGA, LFBGA, LFBGA,
针数 169 169 169 169
Reach Compliance Code unknown unknown unknown unknown
ECCN代码 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A
JESD-30 代码 R-PBGA-B169 R-PBGA-B169 R-PBGA-B169 R-PBGA-B169
JESD-609代码 e1 e1 e1 e1
长度 16 mm 16 mm 16 mm 16 mm
内存密度 34359738368 bit 17179869184 bit 68719476736 bit 17179869184 bit
内存集成电路类型 FLASH FLASH FLASH FLASH
内存宽度 8 8 8 8
功能数量 1 1 1 1
端子数量 169 169 169 169
字数 4294967296 words 2147483648 words 8589934592 words 2147483648 words
字数代码 4000000000 2000000000 8000000000 2000000000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 85 °C 85 °C 85 °C 85 °C
最低工作温度 -25 °C -25 °C -25 °C -25 °C
组织 4GX8 2GX8 8GX8 2GX8
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LFBGA LFBGA LFBGA LFBGA
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 245 245 245 245
编程电压 3.3 V 3.3 V 3.3 V 3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.4 mm 1.4 mm 1.4 mm 1.4 mm
最大供电电压 (Vsup) 3.465 V 3.465 V 3.465 V 3.465 V
最小供电电压 (Vsup) 3.135 V 3.135 V 3.135 V 3.135 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 OTHER OTHER OTHER OTHER
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
端子形式 BALL BALL BALL BALL
端子节距 0.5 mm 0.5 mm 0.5 mm 0.5 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 30 30 30 30
宽度 12 mm 12 mm 12 mm 12 mm

 
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