FIFO, 64X5, 34ns, Asynchronous, CMOS, PDSO18, SOIC-18
参数名称 | 属性值 |
厂商名称 | IDT (Integrated Device Technology) |
零件包装代码 | SOIC |
包装说明 | SOIC-18 |
针数 | 18 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
最长访问时间 | 34 ns |
其他特性 | FALL THRU 40NS |
周期时间 | 40 ns |
JESD-30 代码 | R-PDSO-G18 |
JESD-609代码 | e0 |
长度 | 11.55 mm |
内存密度 | 320 bit |
内存宽度 | 5 |
功能数量 | 1 |
端子数量 | 18 |
字数 | 64 words |
字数代码 | 64 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 64X5 |
输出特性 | 3-STATE |
可输出 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
并行/串行 | PARALLEL |
认证状态 | Not Qualified |
座面最大高度 | 2.65 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | TIN LEAD |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
宽度 | 7.5 mm |
IDT72404L25SO8 | IDT72402L35SO8 | IDT72402L25SO8 | IDT72404L15SO8 | IDT72402L15SO8 | IDT72402L10SO8 | IDT72402L45SO8 | IDT72404L10SO8 | |
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描述 | FIFO, 64X5, 34ns, Asynchronous, CMOS, PDSO18, SOIC-18 | FIFO, 64X5, 20ns, Asynchronous, CMOS, PDSO18, SOIC-18 | FIFO, 64X5, 34ns, Asynchronous, CMOS, PDSO18, SOIC-18 | FIFO, 64X5, 40ns, Asynchronous, CMOS, PDSO18, SOIC-18 | FIFO, 64X5, 40ns, Asynchronous, CMOS, PDSO18, SOIC-18 | FIFO, 64X5, 55ns, Asynchronous, CMOS, PDSO18, SOIC-18 | FIFO, 64X5, 19ns, Asynchronous, CMOS, PDSO18, SOIC-18 | FIFO, 64X5, 55ns, Asynchronous, CMOS, PDSO18, SOIC-18 |
零件包装代码 | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC |
包装说明 | SOIC-18 | SOP, | SOP, | SOP, | SOP, | SOP, | SOP, | SOP, |
针数 | 18 | 18 | 18 | 18 | 18 | 18 | 18 | 18 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 34 ns | 20 ns | 34 ns | 40 ns | 40 ns | 55 ns | 19 ns | 55 ns |
其他特性 | FALL THRU 40NS | FALL THRU 34NS | FALL THRU 40NS | FALL THRU 65NS | FALL THRU 65NS | FALL THRU 65NS | FALL THRU 30NS | FALL THRU 65NS |
周期时间 | 40 ns | 28.57 ns | 40 ns | 66.67 ns | 66.67 ns | 100 ns | 22.22 ns | 100 ns |
JESD-30 代码 | R-PDSO-G18 | R-PDSO-G18 | R-PDSO-G18 | R-PDSO-G18 | R-PDSO-G18 | R-PDSO-G18 | R-PDSO-G18 | R-PDSO-G18 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 11.55 mm | 11.55 mm | 11.55 mm | 11.55 mm | 11.55 mm | 11.55 mm | 11.55 mm | 11.55 mm |
内存密度 | 320 bit | 320 bit | 320 bit | 320 bit | 320 bit | 320 bit | 320 bit | 320 bit |
内存宽度 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 18 | 18 | 18 | 18 | 18 | 18 | 18 | 18 |
字数 | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words |
字数代码 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 64X5 | 64X5 | 64X5 | 64X5 | 64X5 | 64X5 | 64X5 | 64X5 |
输出特性 | 3-STATE | TOTEM POLE | TOTEM POLE | 3-STATE | TOTEM POLE | TOTEM POLE | TOTEM POLE | 3-STATE |
可输出 | YES | NO | NO | YES | NO | NO | NO | YES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | SOP | SOP | SOP | SOP | SOP | SOP | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.65 mm | 2.65 mm | 2.65 mm | 2.65 mm | 2.65 mm | 2.65 mm | 2.65 mm | 2.65 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 7.5 mm | 7.5 mm | 7.5 mm | 7.5 mm | 7.5 mm | 7.5 mm | 7.5 mm | 7.5 mm |
厂商名称 | IDT (Integrated Device Technology) | - | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
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