FIFO, 64X5, 55ns, Asynchronous, CMOS, PDSO18, SOIC-18
| 参数名称 | 属性值 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, |
| 针数 | 18 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 55 ns |
| 其他特性 | FALL THRU 65NS |
| 周期时间 | 100 ns |
| JESD-30 代码 | R-PDSO-G18 |
| JESD-609代码 | e0 |
| 长度 | 11.55 mm |
| 内存密度 | 320 bit |
| 内存宽度 | 5 |
| 功能数量 | 1 |
| 端子数量 | 18 |
| 字数 | 64 words |
| 字数代码 | 64 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 64X5 |
| 输出特性 | TOTEM POLE |
| 可输出 | NO |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.65 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 7.5 mm |
| IDT72402L10SO8 | IDT72402L35SO8 | IDT72402L25SO8 | IDT72404L15SO8 | IDT72402L15SO8 | IDT72402L45SO8 | IDT72404L10SO8 | IDT72404L25SO8 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | FIFO, 64X5, 55ns, Asynchronous, CMOS, PDSO18, SOIC-18 | FIFO, 64X5, 20ns, Asynchronous, CMOS, PDSO18, SOIC-18 | FIFO, 64X5, 34ns, Asynchronous, CMOS, PDSO18, SOIC-18 | FIFO, 64X5, 40ns, Asynchronous, CMOS, PDSO18, SOIC-18 | FIFO, 64X5, 40ns, Asynchronous, CMOS, PDSO18, SOIC-18 | FIFO, 64X5, 19ns, Asynchronous, CMOS, PDSO18, SOIC-18 | FIFO, 64X5, 55ns, Asynchronous, CMOS, PDSO18, SOIC-18 | FIFO, 64X5, 34ns, Asynchronous, CMOS, PDSO18, SOIC-18 |
| 零件包装代码 | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC |
| 包装说明 | SOP, | SOP, | SOP, | SOP, | SOP, | SOP, | SOP, | SOIC-18 |
| 针数 | 18 | 18 | 18 | 18 | 18 | 18 | 18 | 18 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 55 ns | 20 ns | 34 ns | 40 ns | 40 ns | 19 ns | 55 ns | 34 ns |
| 其他特性 | FALL THRU 65NS | FALL THRU 34NS | FALL THRU 40NS | FALL THRU 65NS | FALL THRU 65NS | FALL THRU 30NS | FALL THRU 65NS | FALL THRU 40NS |
| 周期时间 | 100 ns | 28.57 ns | 40 ns | 66.67 ns | 66.67 ns | 22.22 ns | 100 ns | 40 ns |
| JESD-30 代码 | R-PDSO-G18 | R-PDSO-G18 | R-PDSO-G18 | R-PDSO-G18 | R-PDSO-G18 | R-PDSO-G18 | R-PDSO-G18 | R-PDSO-G18 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 11.55 mm | 11.55 mm | 11.55 mm | 11.55 mm | 11.55 mm | 11.55 mm | 11.55 mm | 11.55 mm |
| 内存密度 | 320 bit | 320 bit | 320 bit | 320 bit | 320 bit | 320 bit | 320 bit | 320 bit |
| 内存宽度 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 18 | 18 | 18 | 18 | 18 | 18 | 18 | 18 |
| 字数 | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words |
| 字数代码 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 64X5 | 64X5 | 64X5 | 64X5 | 64X5 | 64X5 | 64X5 | 64X5 |
| 输出特性 | TOTEM POLE | TOTEM POLE | TOTEM POLE | 3-STATE | TOTEM POLE | TOTEM POLE | 3-STATE | 3-STATE |
| 可输出 | NO | NO | NO | YES | NO | NO | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | SOP | SOP | SOP | SOP | SOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.65 mm | 2.65 mm | 2.65 mm | 2.65 mm | 2.65 mm | 2.65 mm | 2.65 mm | 2.65 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.5 mm | 7.5 mm | 7.5 mm | 7.5 mm | 7.5 mm | 7.5 mm | 7.5 mm | 7.5 mm |
| 厂商名称 | IDT (Integrated Device Technology) | - | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
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