OTP ROM, 256KX8, 120ns, CMOS, PQCC32, 0.450 INCH, PLASTIC, MO-052AE, LCC-32
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Mitsubishi(日本三菱) |
| 零件包装代码 | LCC |
| 包装说明 | QCCJ, LDCC32,.5X.6 |
| 针数 | 32 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 120 ns |
| 其他特性 | PAGE WRITE |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PQCC-J32 |
| JESD-609代码 | e0 |
| 长度 | 13.97 mm |
| 内存密度 | 2097152 bit |
| 内存集成电路类型 | OTP ROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 32 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 256KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC32,.5X.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | CHIP CARRIER |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.56 mm |
| 最大待机电流 | 0.0001 A |
| 最大压摆率 | 0.03 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 11.43 mm |
| M5M27C201J-12 | M5M27C201FP-15 | M5M27C201P-15 | M5M27C201VP-15 | M5M27C201VP-12 | M5M27C201RV-12 | M5M27C201P-12 | M5M27C201J-15 | M5M27C201RV-15 | M5M27C201FP-12 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | OTP ROM, 256KX8, 120ns, CMOS, PQCC32, 0.450 INCH, PLASTIC, MO-052AE, LCC-32 | OTP ROM, 256KX8, 150ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 | OTP ROM, 256KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | OTP ROM, 256KX8, 150ns, CMOS, PDSO40, 10 X 14 MM, PLASTIC, TSOP1-40 | OTP ROM, 256KX8, 120ns, CMOS, PDSO40, 10 X 14 MM, PLASTIC, TSOP1-40 | OTP ROM, 256KX8, 120ns, CMOS, PDSO40, 10 X 14 MM, PLASTIC, REVERSE, TSOP1-40 | OTP ROM, 256KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | OTP ROM, 256KX8, 150ns, CMOS, PQCC32, 0.450 INCH, PLASTIC, MO-052AE, LCC-32 | OTP ROM, 256KX8, 150ns, CMOS, PDSO40, 10 X 14 MM, PLASTIC, REVERSE, TSOP1-40 | OTP ROM, 256KX8, 120ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | LCC | SOIC | DIP | TSOP1 | TSOP1 | TSOP1 | DIP | LCC | TSOP1 | SOIC |
| 包装说明 | QCCJ, LDCC32,.5X.6 | SOP, SOP32,.56 | DIP, DIP32,.6 | TSOP1, TSSOP32,.8,20 | TSOP1, TSSOP32,.8,20 | TSOP1-R, TSSOP32,.8,20 | DIP, DIP32,.6 | QCCJ, LDCC32,.5X.6 | TSOP1-R, TSSOP32,.8,20 | SOP, SOP32,.56 |
| 针数 | 32 | 32 | 32 | 40 | 40 | 40 | 32 | 32 | 40 | 32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 120 ns | 150 ns | 150 ns | 150 ns | 120 ns | 120 ns | 120 ns | 150 ns | 150 ns | 120 ns |
| 其他特性 | PAGE WRITE | PAGE WRITE | PAGE WRITE | PAGE WRITE | PAGE WRITE | PAGE WRITE | PAGE WRITE | PAGE WRITE | PAGE WRITE | PAGE WRITE |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PQCC-J32 | R-PDSO-G32 | R-PDIP-T32 | R-PDSO-G40 | R-PDSO-G40 | R-PDSO-G40 | R-PDIP-T32 | R-PQCC-J32 | R-PDSO-G40 | R-PDSO-G32 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 13.97 mm | 20.75 mm | 40.6 mm | 12.4 mm | 12.4 mm | 12.4 mm | 40.6 mm | 13.97 mm | 12.4 mm | 20.75 mm |
| 内存密度 | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bi | 2097152 bi |
| 内存集成电路类型 | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 32 | 32 | 32 | 40 | 40 | 40 | 32 | 32 | 40 | 32 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | SOP | DIP | TSOP1 | TSOP1 | TSOP1-R | DIP | QCCJ | TSOP1-R | SOP |
| 封装等效代码 | LDCC32,.5X.6 | SOP32,.56 | DIP32,.6 | TSSOP32,.8,20 | TSSOP32,.8,20 | TSSOP32,.8,20 | DIP32,.6 | LDCC32,.5X.6 | TSSOP32,.8,20 | SOP32,.56 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | IN-LINE | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.56 mm | 3.05 mm | 5.1 mm | 1.2 mm | 1.2 mm | 1.2 mm | 5.1 mm | 3.56 mm | 1.2 mm | 3.05 mm |
| 最大待机电流 | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
| 最大压摆率 | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | YES | YES | YES | NO | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | J BEND | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 0.5 mm | 0.5 mm | 0.5 mm | 2.54 mm | 1.27 mm | 0.5 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 11.43 mm | 11.4 mm | 15.24 mm | 10 mm | 10 mm | 10 mm | 15.24 mm | 11.43 mm | 10 mm | 11.4 mm |
| 厂商名称 | Mitsubishi(日本三菱) | - | - | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) |
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