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PC28F256P30TF: 产品描述Flash, 32MX16, 100ns, PBGA64, LEAD FREE, BGA-64; 产品类别存储存储; 文件大小7MB，共96页; 制造商Micron Technology; 官网地址http://www.mdtic.com.tw/; 标准

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PC28F256P30TF概述

Flash, 32MX16, 100ns, PBGA64, LEAD FREE, BGA-64

PC28F256P30TF规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	Micron Technology
零件包装代码	BGA
包装说明	TBGA, BGA64,8X8,40
针数	64
Reach Compliance Code	compliant
ECCN代码	3A991.B.1.A
最长访问时间	100 ns
其他特性	ASYNCHRONOUS READ MODE
备用内存宽度	16
启动块	TOP
最大时钟频率 (fCLK)	52 MHz
命令用户界面	YES
通用闪存接口	YES
数据轮询	NO
JESD-30 代码	R-PBGA-B64
JESD-609代码	e1
长度	13 mm
内存密度	268435456 bit
内存集成电路类型	FLASH
内存宽度	16
功能数量	1
部门数/规模	4,255
端子数量	64
字数	16777216 words
字数代码	16000000
工作模式	SYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	16MX16
封装主体材料	PLASTIC/EPOXY
封装代码	TBGA
封装等效代码	BGA64,8X8,40
封装形状	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE
并行/串行	PARALLEL
峰值回流温度（摄氏度）	260
电源	1.8,1.8/3.3 V
编程电压	1.8 V
认证状态	Not Qualified
座面最大高度	1.2 mm
部门规模	16K,64K
最大待机电流	0.00021 A
最大压摆率	0.031 mA
最大供电电压 (Vsup)	2 V
最小供电电压 (Vsup)	1.7 V
标称供电电压 (Vsup)	1.8 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Tin/Silver/Copper (Sn/Ag/Cu)
端子形式	BALL
端子节距	1 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	30
切换位	NO
类型	NOR TYPE
宽度	10 mm

PC28F256P30TF相似产品对比

	PC28F256P30TF	RC28F256P30TF	JS28F256P30BF	RC48F4400P0VB0E	JS28F256P30TF	PF48F4400P0VBQE	RC28F256P30BF	PF48F4000P0ZBQE	PC28F256P30BF	RD48F4400P0VBQE
描述	Flash, 32MX16, 100ns, PBGA64, LEAD FREE, BGA-64	Flash, 16MX16, 100ns, PBGA64, BGA-64	Flash, 16MX16, 110ns, PDSO56, LEAD FREE, TSOP-56	Flash, 32MX16, 100ns, PBGA64, BGA-64	Flash, 16MX16, 110ns, PDSO56, LEAD FREE, TSOP-56	Flash, 32MX16, 100ns, PBGA88, 8 X 11 MM, 1 MM HEIGHT, LEAD FREE, SCSP-88	Flash, 16MX16, 100ns, PBGA64, BGA-64	Flash, 32MX16, PBGA88, 8 X 11 MM, 1 MM HEIGHT, LEAD FREE, SCSP-88	Flash, 32MX16, 100ns, PBGA64, LEAD FREE, BGA-64	Flash, 32MX16, 100ns, PBGA88, 8 X 11 MM, 1 MM HEIGHT, SCSP-88
是否无铅	不含铅	含铅	不含铅	含铅	不含铅	不含铅	含铅	不含铅	不含铅	含铅
是否Rohs认证	符合	不符合	符合	不符合	符合	符合	不符合	符合	符合	不符合
零件包装代码	BGA	BGA	TSOP	BGA	TSOP	BGA	BGA	BGA	BGA	BGA
包装说明	TBGA, BGA64,8X8,40	BGA-64	TSSOP, TSSOP56,.8,20	TBGA, BGA64,8X8,40	TSSOP, TSSOP56,.8,20	SCSP-88	BGA-64	VFBGA, BGA88,8X12,32	BGA-64	SCSP-88
针数	64	64	56	64	56	88	64	88	64	88
Reach Compliance Code	compliant	not_compliant	compliant	compliant	compliant	compliant	not_compliant	compliant	compliant	unknown
ECCN代码	3A991.B.1.A	EAR99	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A
最长访问时间	100 ns	100 ns	110 ns	100 ns	110 ns	100 ns	100 ns	100 ns	100 ns	100 ns
其他特性	ASYNCHRONOUS READ MODE	ASYNCHRONOUS READ MODE	ASYNCHRONOUS READ MODE	ASYNCHRONOUS READ MODE	ASYNCHRONOUS READ MODE	ASYNCHRONOUS READ MODE	ASYNCHRONOUS READ MODE	ASYNCHRONOUS READ MODE	ASYNCHRONOUS READ MODE	ASYNCHRONOUS READ MODE
启动块	TOP	TOP	BOTTOM	BOTTOM/TOP	TOP	BOTTOM/TOP	BOTTOM	BOTTOM	BOTTOM	BOTTOM/TOP
最大时钟频率 (fCLK)	52 MHz	52 MHz	40 MHz	52 MHz	40 MHz	52 MHz	52 MHz	52 MHz	52 MHz	52 MHz
命令用户界面	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
通用闪存接口	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
数据轮询	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
JESD-30 代码	R-PBGA-B64	R-PBGA-B64	R-PDSO-G56	R-PBGA-B64	R-PDSO-G56	R-PBGA-B88	R-PBGA-B64	R-PBGA-B88	R-PBGA-B64	R-PBGA-B88
长度	13 mm	13 mm	18.4 mm	13 mm	18.4 mm	11 mm	13 mm	11 mm	13 mm	11 mm
内存密度	268435456 bit	268435456 bit	268435456 bit	536870912 bit	268435456 bit	536870912 bit	268435456 bit	268435456 bit	268435456 bit	536870912 bit
内存集成电路类型	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
内存宽度	16	16	16	16	16	16	16	16	16	16
功能数量	1	1	1	1	1	1	1	1	1	1
部门数/规模	4,255	4,255	4,255	8, 510	4,255	8, 510	4,255	4,255	4,255	8, 510
端子数量	64	64	56	64	56	88	64	88	64	88
字数	16777216 words	16777216 words	16777216 words	33554432 words	16777216 words	33554432 words	16777216 words	16777216 words	16777216 words	33554432 words
字数代码	16000000	16000000	16000000	32000000	16000000	32000000	16000000	16000000	16000000	32000000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
组织	16MX16	16MX16	16MX16	32MX16	16MX16	32MX16	16MX16	16MX16	16MX16	32MX16
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	TBGA	TBGA	TSSOP	TBGA	TSSOP	TFBGA	TBGA	VFBGA	TBGA	TFBGA
封装等效代码	BGA64,8X8,40	BGA64,8X8,40	TSSOP56,.8,20	BGA64,8X8,40	TSSOP56,.8,20	BGA88,8X12,32	BGA64,8X8,40	BGA88,8X12,32	BGA64,8X8,40	BGA88,8X12,32
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	GRID ARRAY, THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE, FINE PITCH
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	260	235	260	235	260	NOT SPECIFIED	235	260	260	235
电源	1.8,1.8/3.3 V	1.8,1.8/3.3 V	1.8,1.8/3.3 V	1.8,3/3.3 V	1.8,1.8/3.3 V	1.8,3/3.3 V	1.8,1.8/3.3 V	1.8,1.8/3.3 V	1.8,1.8/3.3 V	1.8,3/3.3 V
编程电压	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1 mm	1.2 mm	1.2 mm
部门规模	16K,64K	16K,64K	16K,64K	16K,64K	16K,64K	16K,64K	16K,64K	16K,64K	16K,64K	16K,64K
最大待机电流	0.00021 A	0.00021 A	0.00021 A	0.00042 A	0.00021 A	0.00042 A	0.00021 A	0.00021 A	0.00021 A	0.00042 A
最大压摆率	0.031 mA	0.031 mA	0.031 mA	0.031 mA	0.031 mA	0.031 mA	0.031 mA	0.031 mA	0.031 mA	0.031 mA
最大供电电压 (Vsup)	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V
最小供电电压 (Vsup)	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V
标称供电电压 (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	BALL	BALL	GULL WING	BALL	GULL WING	BALL	BALL	BALL	BALL	BALL
端子节距	1 mm	1 mm	0.5 mm	1 mm	0.5 mm	0.8 mm	1 mm	0.8 mm	1 mm	0.8 mm
端子位置	BOTTOM	BOTTOM	DUAL	BOTTOM	DUAL	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
处于峰值回流温度下的最长时间	30	30	30	30	30	NOT SPECIFIED	30	30	30	30
切换位	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
类型	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
宽度	10 mm	10 mm	14 mm	10 mm	14 mm	8 mm	10 mm	8 mm	10 mm	8 mm
厂商名称	Micron Technology	Micron Technology	Micron Technology	-	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology
备用内存宽度	16	16	-	16	-	16	16	16	16	16
JESD-609代码	e1	e0	e3	e0	e3	-	e0	-	e1	-
端子面层	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Lead/Silver (Sn/Pb/Ag)	Matte Tin (Sn)	Tin/Lead/Silver (Sn/Pb/Ag)	Matte Tin (Sn)	-	Tin/Lead/Silver (Sn/Pb/Ag)	-	Tin/Silver/Copper (Sn/Ag/Cu)	-

PC28F256P30TF

PC28F256P30TF概述

PC28F256P30TF规格参数

PC28F256P30TF相似产品对比

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