IC 2K X 4 OTPROM, 90 ns, CDIP18, 0.300 INCH, CERAMIC, DIP-18, Programmable ROM
| 参数名称 | 属性值 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 18 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 90 ns |
| JESD-30 代码 | R-GDIP-T18 |
| JESD-609代码 | e3/e4 |
| 内存密度 | 8192 bit |
| 内存集成电路类型 | OTP ROM |
| 内存宽度 | 4 |
| 功能数量 | 1 |
| 端子数量 | 18 |
| 字数 | 2048 words |
| 字数代码 | 2000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 2KX4 |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 温度等级 | MILITARY |
| 端子面层 | TIN/NICKEL PALLADIUM GOLD |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| 82S185B/BVA | 82S185/BYA | 82S185A/BYA | 82S185B/BYA | 82S185/BVA | 82S185A/BVA | |
|---|---|---|---|---|---|---|
| 描述 | IC 2K X 4 OTPROM, 90 ns, CDIP18, 0.300 INCH, CERAMIC, DIP-18, Programmable ROM | IC 2K X 4 OTPROM, 115 ns, CDFP18, CERAMIC, FP-18, Programmable ROM | IC 2K X 4 OTPROM, 55 ns, CDFP18, CERAMIC, FP-18, Programmable ROM | IC 2K X 4 OTPROM, 90 ns, CDFP18, CERAMIC, FP-18, Programmable ROM | IC 2K X 4 OTPROM, 115 ns, CDIP18, 0.300 INCH, CERAMIC, DIP-18, Programmable ROM | IC 2K X 4 OTPROM, 55 ns, CDIP18, 0.300 INCH, CERAMIC, DIP-18, Programmable ROM |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | DIP | DFP | DFP | DFP | DIP | DIP |
| 包装说明 | DIP, | DFP, | DFP, | DFP, | DIP, | DIP, |
| 针数 | 18 | 18 | 18 | 18 | 18 | 18 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 90 ns | 115 ns | 55 ns | 90 ns | 115 ns | 55 ns |
| JESD-30 代码 | R-GDIP-T18 | R-CDFP-F18 | R-CDFP-F18 | R-CDFP-F18 | R-GDIP-T18 | R-GDIP-T18 |
| 内存密度 | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit |
| 内存集成电路类型 | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| 内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 18 | 18 | 18 | 18 | 18 | 18 |
| 字数 | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words |
| 字数代码 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 2KX4 | 2KX4 | 2KX4 | 2KX4 | 2KX4 | 2KX4 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DFP | DFP | DFP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | FLATPACK | FLATPACK | FLATPACK | IN-LINE | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | NO | NO |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | FLAT | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
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