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MN18R1628EF0-CM8

产品描述Rambus DRAM Module, 128MX18, CMOS
产品类别存储    存储   
文件大小516KB,共16页
制造商SAMSUNG(三星)
官网地址http://www.samsung.com/Products/Semiconductor/
下载文档 详细参数 选型对比 全文预览

MN18R1628EF0-CM8概述

Rambus DRAM Module, 128MX18, CMOS

MN18R1628EF0-CM8规格参数

参数名称属性值
厂商名称SAMSUNG(三星)
包装说明,
Reach Compliance Codeunknown
ECCN代码EAR99
访问模式BLOCK ORIENTED PROTOCOL
其他特性SELF CONTAINED REFRESH
JESD-30 代码R-XXMA-X200
内存密度2415919104 bit
内存集成电路类型RAMBUS DRAM MODULE
内存宽度18
功能数量1
端口数量1
端子数量200
字数134217728 words
字数代码128000000
工作模式SYNCHRONOUS
组织128MX18
封装主体材料UNSPECIFIED
封装形状RECTANGULAR
封装形式MICROELECTRONIC ASSEMBLY
认证状态Not Qualified
自我刷新YES
最大供电电压 (Vsup)2.63 V
最小供电电压 (Vsup)2.37 V
标称供电电压 (Vsup)2.5 V
表面贴装NO
技术CMOS
端子形式UNSPECIFIED
端子位置UNSPECIFIED

MN18R1628EF0-CM8相似产品对比

MN18R1628EF0-CM8 MP18R1624EF0-CT9 MP18R1628EF0-CM8 MP18R1628EF0-CT9 MN18R1624EF0-CT9 MN18R1624EF0-CM8 MP18R1624EF0-CM8 MN18R1628EF0-CT9
描述 Rambus DRAM Module, 128MX18, CMOS Rambus DRAM Module, 64MX18, CMOS Rambus DRAM Module, 128MX18, CMOS Rambus DRAM Module, 128MX18, CMOS Rambus DRAM Module, 64MX18, CMOS Rambus DRAM Module, 64MX18, CMOS Rambus DRAM Module, 64MX18, CMOS Rambus DRAM Module, 128MX18, CMOS
厂商名称 SAMSUNG(三星) SAMSUNG(三星) SAMSUNG(三星) SAMSUNG(三星) SAMSUNG(三星) SAMSUNG(三星) SAMSUNG(三星) SAMSUNG(三星)
Reach Compliance Code unknown unknown compliant unknown unknown unknown unknown unknown
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
访问模式 BLOCK ORIENTED PROTOCOL BLOCK ORIENTED PROTOCOL BLOCK ORIENTED PROTOCOL BLOCK ORIENTED PROTOCOL BLOCK ORIENTED PROTOCOL BLOCK ORIENTED PROTOCOL BLOCK ORIENTED PROTOCOL BLOCK ORIENTED PROTOCOL
其他特性 SELF CONTAINED REFRESH SELF CONTAINED REFRESH SELF CONTAINED REFRESH SELF CONTAINED REFRESH SELF CONTAINED REFRESH SELF CONTAINED REFRESH SELF CONTAINED REFRESH SELF CONTAINED REFRESH
JESD-30 代码 R-XXMA-X200 R-XXMA-X200 R-XXMA-X200 R-XXMA-X200 R-XXMA-X200 R-XXMA-X200 R-XXMA-X200 R-XXMA-X200
内存密度 2415919104 bit 1207959552 bit 2415919104 bit 2415919104 bit 1207959552 bit 1207959552 bit 1207959552 bit 2415919104 bit
内存集成电路类型 RAMBUS DRAM MODULE RAMBUS DRAM MODULE RAMBUS DRAM MODULE RAMBUS DRAM MODULE RAMBUS DRAM MODULE RAMBUS DRAM MODULE RAMBUS DRAM MODULE RAMBUS DRAM MODULE
内存宽度 18 18 18 18 18 18 18 18
功能数量 1 1 1 1 1 1 1 1
端口数量 1 1 1 1 1 1 1 1
端子数量 200 200 200 200 200 200 200 200
字数 134217728 words 67108864 words 134217728 words 134217728 words 67108864 words 67108864 words 67108864 words 134217728 words
字数代码 128000000 64000000 128000000 128000000 64000000 64000000 64000000 128000000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
组织 128MX18 64MX18 128MX18 128MX18 64MX18 64MX18 64MX18 128MX18
封装主体材料 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
自我刷新 YES YES YES YES YES YES YES YES
最大供电电压 (Vsup) 2.63 V 2.63 V 2.63 V 2.63 V 2.63 V 2.63 V 2.63 V 2.63 V
最小供电电压 (Vsup) 2.37 V 2.37 V 2.37 V 2.37 V 2.37 V 2.37 V 2.37 V 2.37 V
标称供电电压 (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
表面贴装 NO NO NO NO NO NO NO NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
端子形式 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
端子位置 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED

 
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