Audio Amplifier, 1.4W, 1 Channel(s), 1 Func, BICMOS, PBGA9, 1.5 X 1.5 MM, ROHS COMPLIANT, UCSP-9
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | BGA |
| 包装说明 | VFBGA, |
| 针数 | 9 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 标称带宽 | 22 kHz |
| 商用集成电路类型 | AUDIO AMPLIFIER |
| 增益 | 9 dB |
| JESD-30 代码 | S-PBGA-B9 |
| JESD-609代码 | e1 |
| 长度 | 1.52 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 9 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 标称输出功率 | 1.4 W |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VFBGA |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.67 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.5 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 1.52 mm |
| MAX9717CEBL+ | MAX9717AEUA-T | MAX9717CEUA-T | MAX9716ETA+ | MAX9717DEUA-T | MAX9717BEUA-T | MAX9717BEBL | MAX9717AEBL | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Audio Amplifier, 1.4W, 1 Channel(s), 1 Func, BICMOS, PBGA9, 1.5 X 1.5 MM, ROHS COMPLIANT, UCSP-9 | Audio Amplifier, 1.4W, 1 Channel(s), 1 Func, BICMOS, PDSO8, 3 X 3 MM, MO-187, MICRO, SOP-8 | Audio Amplifier, 1.4W, 1 Channel(s), 1 Func, BICMOS, PDSO8, 3 X 3 MM, MO-187, MICRO, SOP-8 | Audio Amplifier, 1.4W, 1 Channel(s), 1 Func, BICMOS, 3 X 3 MM, 0.80 MM HEIGHT, TDFN-8 | Audio Amplifier, 1.4W, 1 Channel(s), 1 Func, BICMOS, PDSO8, 3 X 3 MM, MO-187, MICRO, SOP-8 | Audio Amplifier, 1.4W, 1 Channel(s), 1 Func, BICMOS, PDSO8, 3 X 3 MM, MO-187, MICRO, SOP-8 | Audio Amplifier, 1.4W, 1 Channel(s), 1 Func, BICMOS, PBGA9, 1.5 X 1.5 MM, UCSP-9 | Audio Amplifier, 1.4W, 1 Channel(s), 1 Func, BICMOS, PBGA9, 1.5 X 1.5 MM, UCSP-9 |
| 是否无铅 | 不含铅 | 含铅 | 含铅 | 不含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 符合 | 不符合 | 不符合 | 符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | BGA | TSSOP | TSSOP | DFN | TSSOP | TSSOP | BGA | BGA |
| 包装说明 | VFBGA, | 3 X 3 MM, MO-187, MICRO, SOP-8 | HTSSOP, TSSOP8,.19 | HVSON, SOLCC8,.12,25 | HTSSOP, TSSOP8,.19 | HTSSOP, TSSOP8,.19 | 1.5 X 1.5 MM, UCSP-9 | 1.5 X 1.5 MM, UCSP-9 |
| 针数 | 9 | 8 | 8 | 8 | 8 | 8 | 9 | 9 |
| Reach Compliance Code | compliant | not_compliant | not_compliant | compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 标称带宽 | 22 kHz | 22 kHz | 22 kHz | 22 kHz | 22 kHz | 22 kHz | 22 kHz | 22 kHz |
| 商用集成电路类型 | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER |
| JESD-30 代码 | S-PBGA-B9 | S-PDSO-G8 | S-PDSO-G8 | S-XDSO-N8 | S-PDSO-G8 | S-PDSO-G8 | S-PBGA-B9 | S-PBGA-B9 |
| 长度 | 1.52 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 1.52 mm | 1.52 mm |
| 信道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 9 | 8 | 8 | 8 | 8 | 8 | 9 | 9 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 标称输出功率 | 1.4 W | 1.4 W | 1.4 W | 1.4 W | 1.4 W | 1.4 W | 1.4 W | 1.4 W |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VFBGA | HTSSOP | HTSSOP | HVSON | HTSSOP | HTSSOP | VFBGA | VFBGA |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 | NOT SPECIFIED | NOT SPECIFIED | 260 | NOT SPECIFIED | NOT SPECIFIED | 245 | 245 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.67 mm | 1.1 mm | 1.1 mm | 0.8 mm | 1.1 mm | 1.1 mm | 0.67 mm | 0.67 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | BALL | GULL WING | GULL WING | NO LEAD | GULL WING | GULL WING | BALL | BALL |
| 端子节距 | 0.5 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.5 mm | 0.5 mm |
| 端子位置 | BOTTOM | DUAL | DUAL | DUAL | DUAL | DUAL | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 1.52 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 1.52 mm | 1.52 mm |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | - | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 增益 | 9 dB | - | 9 dB | - | 12 dB | 6 dB | 6 dB | - |
| JESD-609代码 | e1 | e0 | e0 | e3 | e0 | e0 | - | - |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - |
| 封装等效代码 | - | TSSOP8,.19 | TSSOP8,.19 | SOLCC8,.12,25 | TSSOP8,.19 | TSSOP8,.19 | - | - |
| 电源 | - | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | - | - |
| 最大压摆率 | - | 8 mA | 8 mA | 8 mA | 8 mA | 8 mA | - | - |
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