Flash, 16MX1, PDSO8, LEAD FREE, SOIC-8
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Numonyx ( Micron ) |
零件包装代码 | SOIC |
包装说明 | SOP, SOP8,.3 |
针数 | 16 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
启动块 | BOTTOM |
最大时钟频率 (fCLK) | 68 MHz |
耐久性 | 100000 Write/Erase Cycles |
JESD-30 代码 | S-PDSO-G8 |
JESD-609代码 | e3 |
长度 | 5.232 mm |
内存密度 | 16777216 bit |
内存集成电路类型 | FLASH |
内存宽度 | 1 |
功能数量 | 1 |
端子数量 | 8 |
字数 | 16777216 words |
字数代码 | 16000000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 16MX1 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP8,.3 |
封装形状 | SQUARE |
封装形式 | SMALL OUTLINE |
并行/串行 | SERIAL |
峰值回流温度(摄氏度) | 260 |
电源 | 3/3.3 V |
编程电压 | 2.7 V |
认证状态 | Not Qualified |
座面最大高度 | 2.642 mm |
串行总线类型 | SPI |
最大待机电流 | 0.00007 A |
最大压摆率 | 0.045 mA |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 2.7 V |
标称供电电压 (Vsup) | 3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | MATTE TIN |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 40 |
类型 | NOR TYPE |
宽度 | 5.232 mm |
写保护 | HARDWARE/SOFTWARE |
QH25F016S33B8 | QB25F016S33B8 | QH25F640S33B8 | QH25F320S33B8 | QB25F640S33B8 | QB25F160S33B8 | QB25F320S33B8 | |
---|---|---|---|---|---|---|---|
描述 | Flash, 16MX1, PDSO8, LEAD FREE, SOIC-8 | Flash, 16MX1, PDSO8, SOIC-8 | Flash, 64MX1, PDSO16, LEAD FREE, SOIC-16 | Flash, 32MX1, PDSO16, LEAD FREE, SOIC-16 | Flash, 64MX1, PDSO16, SOIC-16 | Flash, 16MX1, PDSO16, SOIC-16 | Flash, 32MX1, PDSO16, SOIC-16 |
是否Rohs认证 | 符合 | 不符合 | 符合 | 符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Numonyx ( Micron ) | Numonyx ( Micron ) | Numonyx ( Micron ) | Numonyx ( Micron ) | Numonyx ( Micron ) | Numonyx ( Micron ) | Numonyx ( Micron ) |
零件包装代码 | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC |
包装说明 | SOP, SOP8,.3 | SOP, SOP8,.3 | SOP, SOP16,.4 | LEAD FREE, SOIC-16 | SOP, SOP16,.4 | SOP, SOP16,.4 | SOIC-16 |
针数 | 16 | 8 | 16 | 16 | 16 | 16 | 16 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
ECCN代码 | EAR99 | EAR99 | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | EAR99 | 3A991.B.1.A |
启动块 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
最大时钟频率 (fCLK) | 68 MHz | 68 MHz | 68 MHz | 68 MHz | 68 MHz | 68 MHz | 68 MHz |
耐久性 | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
JESD-30 代码 | S-PDSO-G8 | S-PDSO-G8 | S-PDSO-G16 | S-PDSO-G16 | S-PDSO-G16 | R-PDSO-G16 | S-PDSO-G16 |
JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
长度 | 5.232 mm | 5.232 mm | 10.338 mm | 10.338 mm | 10.338 mm | 10.338 mm | 10.338 mm |
内存密度 | 16777216 bit | 16777216 bit | 67108864 bit | 33554432 bit | 67108864 bit | 16777216 bit | 33554432 bi |
内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
内存宽度 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 16 | 16 | 16 | 16 | 16 |
字数 | 16777216 words | 16777216 words | 67108864 words | 33554432 words | 67108864 words | 16777216 words | 33554432 words |
字数代码 | 16000000 | 16000000 | 64000000 | 32000000 | 64000000 | 16000000 | 32000000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 16MX1 | 16MX1 | 64MX1 | 32MX1 | 64MX1 | 16MX1 | 32MX1 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | SOP | SOP | SOP | SOP | SOP | SOP |
封装等效代码 | SOP8,.3 | SOP8,.3 | SOP16,.4 | SOP16,.4 | SOP16,.4 | SOP16,.4 | SOP16,.4 |
封装形状 | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
峰值回流温度(摄氏度) | 260 | 260 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 260 | NOT SPECIFIED |
电源 | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V |
编程电压 | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.642 mm | 2.159 mm | 2.642 mm | 2.642 mm | 2.642 mm | 2.642 mm | 2.642 mm |
串行总线类型 | SPI | SPI | SPI | SPI | SPI | SPI | SPI |
最大待机电流 | 0.00007 A | 0.00007 A | 0.00007 A | 0.00007 A | 0.00007 A | 0.00007 A | 0.00007 A |
最大压摆率 | 0.045 mA | 0.045 mA | 0.045 mA | 0.045 mA | 0.045 mA | 0.045 mA | 0.045 mA |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 40 | 40 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 40 | NOT SPECIFIED |
类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
宽度 | 5.232 mm | 5.232 mm | 7.519 mm | 7.519 mm | 7.519 mm | 7.519 mm | 7.519 mm |
写保护 | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
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