EEPROM, 16X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8
参数名称 | 属性值 |
厂商名称 | Xicor Inc |
包装说明 | PLASTIC, SOIC-8 |
Reach Compliance Code | unknown |
最大时钟频率 (fCLK) | 1 MHz |
JESD-30 代码 | R-PDSO-G8 |
长度 | 4.9 mm |
内存密度 | 128 bit |
内存集成电路类型 | EEPROM |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 8 |
字数 | 16 words |
字数代码 | 16 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
组织 | 16X8 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
并行/串行 | SERIAL |
认证状态 | Not Qualified |
座面最大高度 | 1.75 mm |
串行总线类型 | I2C |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
宽度 | 3.9 mm |
最长写入周期时间 (tWC) | 5 ms |
X24001SM-3T1 | X24001SI-2.7T1 | X24001SM-2.7T1 | X24001SIT1 | X24001S-3T1 | X24001S-2.7T1 | X24001SMT1 | X24001ST1 | X24001SI-3T1 | |
---|---|---|---|---|---|---|---|---|---|
描述 | EEPROM, 16X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | EEPROM, 16X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | EEPROM, 16X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | EEPROM, 16X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | EEPROM, 16X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | EEPROM, 16X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | EEPROM, 16X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | EEPROM, 16X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | EEPROM, 16X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 |
包装说明 | PLASTIC, SOIC-8 | PLASTIC, SOIC-8 | PLASTIC, SOIC-8 | PLASTIC, SOIC-8 | PLASTIC, SOIC-8 | PLASTIC, SOIC-8 | PLASTIC, SOIC-8 | PLASTIC, SOIC-8 | PLASTIC, SOIC-8 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
最大时钟频率 (fCLK) | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz |
JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
长度 | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm |
内存密度 | 128 bit | 128 bit | 128 bit | 128 bit | 128 bit | 128 bit | 128 bit | 128 bit | 128 bi |
内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
字数 | 16 words | 16 words | 16 words | 16 words | 16 words | 16 words | 16 words | 16 words | 16 words |
字数代码 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 125 °C | 85 °C | 125 °C | 85 °C | 70 °C | 70 °C | 125 °C | 70 °C | 85 °C |
最低工作温度 | -55 °C | -40 °C | -55 °C | -40 °C | - | - | -55 °C | - | -40 °C |
组织 | 16X8 | 16X8 | 16X8 | 16X8 | 16X8 | 16X8 | 16X8 | 16X8 | 16X8 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | SOP | SOP | SOP | SOP | SOP | SOP | SOP | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm |
串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 3 V | 2.7 V | 2.7 V | 4.5 V | 3 V | 2.7 V | 4.5 V | 4.5 V | 3 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | INDUSTRIAL | MILITARY | INDUSTRIAL | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | INDUSTRIAL |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm |
最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
厂商名称 | Xicor Inc | - | Xicor Inc | Xicor Inc | Xicor Inc | Xicor Inc | Xicor Inc | Xicor Inc | Xicor Inc |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved