Voltage Reference, 5V, PBGA6
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| JESD-30 代码 | R-PBGA-B6 |
| JESD-609代码 | e0 |
| 湿度敏感等级 | 1 |
| 端子数量 | 6 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 标称输出电压 | 5 V |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | FBGA |
| 封装等效代码 | BGA6,2X3,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, FINE PITCH |
| 认证状态 | Not Qualified |
| 表面贴装 | YES |
| 最大电压温度系数 | 30 ppm/°C |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn63Pb37) |
| 端子形式 | BALL |
| 端子节距 | 0.5 mm |
| 端子位置 | BOTTOM |
| 微调/可调输出 | NO |
| 最大电压容差 | 0.2% |
| MAX6023EBT50 | MAX6023EBT30 | MAX6023EBT12 | MAX6023EBT25 | MAX6023EBT21 | MAX6023EBT45 | MAX6023EBT41 | |
|---|---|---|---|---|---|---|---|
| 描述 | Voltage Reference, 5V, PBGA6 | Three Terminal Voltage Reference | Voltage Reference, 1.25V, PBGA6 | Voltage Reference, 2.5V, PBGA6 | Voltage Reference, 2.048V, PBGA6 | Voltage Reference, 4.5V, PBGA6 | Voltage Reference, 4.096V, PBGA6 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子面层 | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) |
| ECCN代码 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 |
| JESD-30 代码 | R-PBGA-B6 | - | R-PBGA-B6 | R-PBGA-B6 | R-PBGA-B6 | R-PBGA-B6 | R-PBGA-B6 |
| 端子数量 | 6 | - | 6 | 6 | 6 | 6 | 6 |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 标称输出电压 | 5 V | - | 1.25 V | 2.5 V | 2.048 V | 4.5 V | 4.096 V |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | FBGA | - | FBGA | FBGA | FBGA | FBGA | FBGA |
| 封装等效代码 | BGA6,2X3,20 | - | BGA6,2X3,20 | BGA6,2X3,20 | BGA6,2X3,20 | BGA6,2X3,20 | BGA6,2X3,20 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, FINE PITCH | - | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | YES | - | YES | YES | YES | YES | YES |
| 最大电压温度系数 | 30 ppm/°C | - | 30 ppm/°C | 30 ppm/°C | 30 ppm/°C | 30 ppm/°C | 30 ppm/°C |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | BALL | - | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 0.5 mm | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | BOTTOM | - | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 微调/可调输出 | NO | - | NO | NO | NO | NO | NO |
| 最大电压容差 | 0.2% | - | 0.24% | 0.2% | 0.2% | 0.2% | 0.2% |
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