64KX16 UVPROM, 150ns, CDIP40, WINDOWED, CERAMIC, DIP-40
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP |
| 包装说明 | WDIP, DIP40,.6 |
| 针数 | 40 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 150 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-GDIP-T40 |
| JESD-609代码 | e0 |
| 内存密度 | 1048576 bit |
| 内存集成电路类型 | UVPROM |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 端子数量 | 40 |
| 字数 | 65536 words |
| 字数代码 | 64000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 64KX16 |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | WDIP |
| 封装等效代码 | DIP40,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE, WINDOW |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.72 mm |
| 最大待机电流 | 0.0001 A |
| 最大压摆率 | 0.05 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 15.24 mm |
| NM27P210QE150 | NM27P210Q150 | NM27P210QE120 | NM27P210VE150 | NM27P210QM150 | NM27P210VE120 | NM27P210V150 | NM27P210Q120 | NM27P210V120 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | 64KX16 UVPROM, 150ns, CDIP40, WINDOWED, CERAMIC, DIP-40 | 64KX16 UVPROM, 150ns, CDIP40, WINDOWED, CERAMIC, DIP-40 | 64KX16 UVPROM, 120ns, CDIP40, WINDOWED, CERAMIC, DIP-40 | 64KX16 OTPROM, 150ns, PQCC44, PLASTIC, LCC-44 | 64KX16 UVPROM, 150ns, CDIP40, WINDOWED, CERAMIC, DIP-40 | 64KX16 OTPROM, 120ns, PQCC44, PLASTIC, LCC-44 | 64KX16 OTPROM, 150ns, PQCC44, PLASTIC, LCC-44 | 64KX16 UVPROM, 120ns, CDIP40, WINDOWED, CERAMIC, DIP-40 | 64KX16 OTPROM, 120ns, PQCC44, PLASTIC, LCC-44 |
| 零件包装代码 | DIP | DIP | DIP | LCC | DIP | LCC | LCC | DIP | LCC |
| 包装说明 | WDIP, DIP40,.6 | WDIP, DIP40,.6 | WDIP, DIP40,.6 | QCCJ, LDCC44,.7SQ | WDIP, | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | WDIP, DIP40,.6 | QCCJ, LDCC44,.7SQ |
| 针数 | 40 | 40 | 40 | 44 | 40 | 44 | 44 | 40 | 44 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 150 ns | 150 ns | 120 ns | 150 ns | 150 ns | 120 ns | 150 ns | 120 ns | 120 ns |
| JESD-30 代码 | R-GDIP-T40 | R-GDIP-T40 | R-GDIP-T40 | S-PQCC-J44 | R-GDIP-T40 | S-PQCC-J44 | S-PQCC-J44 | R-GDIP-T40 | S-PQCC-J44 |
| 内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bi | 1048576 bi |
| 内存集成电路类型 | UVPROM | UVPROM | UVPROM | OTP ROM | UVPROM | OTP ROM | OTP ROM | UVPROM | OTP ROM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 40 | 40 | 40 | 44 | 40 | 44 | 44 | 40 | 44 |
| 字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
| 字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 70 °C | 85 °C | 85 °C | 125 °C | 85 °C | 70 °C | 70 °C | 70 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -55 °C | -40 °C | - | - | - |
| 组织 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | WDIP | WDIP | WDIP | QCCJ | WDIP | QCCJ | QCCJ | WDIP | QCCJ |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE, WINDOW | CHIP CARRIER | IN-LINE, WINDOW | CHIP CARRIER | CHIP CARRIER | IN-LINE, WINDOW | CHIP CARRIER |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.72 mm | 5.72 mm | 5.72 mm | 4.57 mm | 5.72 mm | 4.57 mm | 4.57 mm | 5.72 mm | 4.57 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | YES | NO | YES | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE | J BEND |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | QUAD | DUAL | QUAD | QUAD | DUAL | QUAD |
| 宽度 | 15.24 mm | 15.24 mm | 15.24 mm | 16.5862 mm | 15.24 mm | 16.5862 mm | 16.5862 mm | 15.24 mm | 16.5862 mm |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | - | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) | - | - | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | - | COMMON | COMMON | COMMON | COMMON |
| JESD-609代码 | e0 | e0 | e0 | e0 | - | e0 | e0 | e0 | e0 |
| 封装等效代码 | DIP40,.6 | DIP40,.6 | DIP40,.6 | LDCC44,.7SQ | - | LDCC44,.7SQ | LDCC44,.7SQ | DIP40,.6 | LDCC44,.7SQ |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V |
| 最大待机电流 | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | - | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
| 最大压摆率 | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | - | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
