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W19B320BTBG

产品描述Flash, 2MX16, 70ns, PDSO48, TSOP-48
产品类别存储    存储   
文件大小649KB,共51页
制造商Winbond(华邦电子)
官网地址http://www.winbond.com.tw
下载文档 详细参数 选型对比 全文预览

W19B320BTBG概述

Flash, 2MX16, 70ns, PDSO48, TSOP-48

W19B320BTBG规格参数

参数名称属性值
厂商名称Winbond(华邦电子)
零件包装代码TSOP
包装说明TSOP-48
针数48
Reach Compliance Codeunknown
ECCN代码3A991.B.1.A
最长访问时间70 ns
其他特性TOP BOOT BLOCK
备用内存宽度8
启动块TOP
JESD-30 代码R-PDSO-G48
长度18.4 mm
内存密度33554432 bit
内存集成电路类型FLASH
内存宽度16
功能数量1
端子数量48
字数2097152 words
字数代码2000000
工作模式ASYNCHRONOUS
最高工作温度85 °C
最低工作温度-20 °C
组织2MX16
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE
并行/串行PARALLEL
编程电压3 V
认证状态Not Qualified
座面最大高度1.2 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2.7 V
标称供电电压 (Vsup)3 V
表面贴装YES
技术CMOS
温度等级OTHER
端子形式GULL WING
端子节距0.5 mm
端子位置DUAL
类型NOR TYPE
宽度12 mm

文档预览

下载PDF文档
W19B320BT/B DATASHEET
Table of Contents-
1.
2.
3.
4.
5.
6.
GENERAL DESCRIPTION ......................................................................................................................4
FEATURES ..............................................................................................................................................4
PIN CONFIGURATIONS .........................................................................................................................5
BLOCK DIAGRAM ...................................................................................................................................5
PIN DESCRIPTION..................................................................................................................................5
FUNCTIONAL DESCRIPTION ................................................................................................................6
6.1
6.1.1
6.1.2
6.1.3
6.1.4
6.1.5
6.1.6
6.1.7
6.1.8
6.1.9
6.1.10
6.1.11
6.1.12
6.1.13
6.2
6.2.1
6.2.2
6.2.3
6.2.4
6.2.5
6.2.6
6.2.7
6.3
6.3.1
6.3.2
6.3.3
6.3.4
Device Bus Operation.....................................................................................................................6
Word/Byte Configuration ................................................................................................................6
Reading Array Data ........................................................................................................................6
Writing Commands/Command Sequences ....................................................................................6
Standby Mode.................................................................................................................................7
Automatic Sleep Mode....................................................................................................................7
#RESET: Hardware Reset Pin .......................................................................................................7
Output Disable Mode ......................................................................................................................8
AUTOSELECT Mode......................................................................................................................8
Sector/Sector Block Protection and Unprotection ..........................................................................8
Write Protect (#WP)........................................................................................................................8
Temporary Sector Unprotect ..........................................................................................................8
Security Sector Flash Memory Region ...........................................................................................9
Hardware Data Protection ............................................................................................................10
Command Definitions ...................................................................................................................10
Reading Array Data ......................................................................................................................10
Reset Command...........................................................................................................................10
AUTOSELECT Command Sequence...........................................................................................11
Byte/Word Program Command Sequence ...................................................................................11
Unlock Bypass Command Sequence...........................................................................................12
Chip Erase Command Sequence .................................................................................................12
Sector Erase Command Sequence ..............................................................................................13
Write Operation Status .................................................................................................................13
DQ7: #Data Polling .......................................................................................................................13
RY/#BY: Ready/#Busy..................................................................................................................14
DQ6: Toggle Bit I ..........................................................................................................................14
Reading Toggle Bits DQ6/DQ2 ....................................................................................................14
Publication Release Date: Dec. 22, 2008
Revision A5
-1-

W19B320BTBG相似产品对比

W19B320BTBG W19B320BTT7H W19B320BBBG W19B320BBBH W19B320BBTG W19B320BTTH W19B320BTTG W19B320BTBH W19B320BBTH
描述 Flash, 2MX16, 70ns, PDSO48, TSOP-48 IC flash 32mbit 70ns 48tsop Flash, 2MX16, 70ns, PDSO48, TSOP-48 Flash, 2MX16, 70ns, PDSO48, TSOP-48 Flash, 2MX16, 70ns, PDSO48, TSOP-48 Flash, 2MX16, 70ns, PDSO48, TSOP-48 Flash, 2MX16, 70ns, PDSO48, TSOP-48 Flash, 2MX16, 70ns, PDSO48, TSOP-48 Flash, 2MX16, 70ns, PDSO48, TSOP-48
厂商名称 Winbond(华邦电子) - Winbond(华邦电子) Winbond(华邦电子) Winbond(华邦电子) Winbond(华邦电子) Winbond(华邦电子) Winbond(华邦电子) Winbond(华邦电子)
零件包装代码 TSOP - TSOP TSOP TSOP TSOP TSOP TSOP TSOP
包装说明 TSOP-48 - TSOP-48 TSSOP, BGA48,6X8,32 TSOP-48 TSOP-48 TSOP-48 TSOP-48 TSSOP, TSSOP48,.8,20
针数 48 - 48 48 48 48 48 48 48
Reach Compliance Code unknown - unknown compliant unknown compliant unknown compliant compliant
ECCN代码 3A991.B.1.A - 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A
最长访问时间 70 ns - 70 ns 70 ns 70 ns 70 ns 70 ns 70 ns 70 ns
其他特性 TOP BOOT BLOCK - BOTTOM BOOT BLOCK BOTTOM BOOT BLOCK BOTTOM BOOT BLOCK TOP BOOT BLOCK TOP BOOT BLOCK TOP BOOT BLOCK BOTTOM BOOT BLOCK
备用内存宽度 8 - 8 8 8 8 8 8 8
启动块 TOP - BOTTOM BOTTOM BOTTOM TOP TOP TOP BOTTOM
JESD-30 代码 R-PDSO-G48 - R-PDSO-G48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48
长度 18.4 mm - 18.4 mm 18.4 mm 18.4 mm 18.4 mm 18.4 mm 18.4 mm 18.4 mm
内存密度 33554432 bit - 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit
内存集成电路类型 FLASH - FLASH FLASH FLASH FLASH FLASH FLASH FLASH
内存宽度 16 - 16 16 16 16 16 16 16
功能数量 1 - 1 1 1 1 1 1 1
端子数量 48 - 48 48 48 48 48 48 48
字数 2097152 words - 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words
字数代码 2000000 - 2000000 2000000 2000000 2000000 2000000 2000000 2000000
工作模式 ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 85 °C - 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -20 °C - -20 °C -20 °C -20 °C -20 °C -20 °C -20 °C -20 °C
组织 2MX16 - 2MX16 2MX16 2MX16 2MX16 2MX16 2MX16 2MX16
封装主体材料 PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP - TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP
封装形状 RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE - SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
并行/串行 PARALLEL - PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
编程电压 3 V - 3 V 3 V 3 V 3 V 3 V 3 V 3 V
认证状态 Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.2 mm - 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
最大供电电压 (Vsup) 3.6 V - 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 2.7 V - 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
标称供电电压 (Vsup) 3 V - 3 V 3 V 3 V 3 V 3 V 3 V 3 V
表面贴装 YES - YES YES YES YES YES YES YES
技术 CMOS - CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 OTHER - OTHER OTHER OTHER OTHER OTHER OTHER OTHER
端子形式 GULL WING - GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.5 mm - 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
端子位置 DUAL - DUAL DUAL DUAL DUAL DUAL DUAL DUAL
类型 NOR TYPE - NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
宽度 12 mm - 12 mm 12 mm 12 mm 12 mm 12 mm 12 mm 12 mm
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