Inverter, CMOS, PDSO14,
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
包装说明 | SOP, SOP14,.25 |
Reach Compliance Code | unknown |
JESD-30 代码 | R-PDSO-G14 |
JESD-609代码 | e0 |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | INVERTER |
最大I(ol) | 0.012 A |
端子数量 | 14 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP14,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
电源 | 3.3/5 V |
Prop。Delay @ Nom-Sup | 9.5 ns |
认证状态 | Not Qualified |
施密特触发器 | NO |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
74AC04D | 74ACT04DB | 74ACT04D | 74ACT04PW | 74AC04DB | 74AC04PW | |
---|---|---|---|---|---|---|
描述 | Inverter, CMOS, PDSO14, | Inverter, CMOS, PDSO14, | Inverter, CMOS, PDSO14, | Inverter, CMOS, PDSO14, | Inverter, CMOS, PDSO14, | Inverter, CMOS, PDSO14, |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
包装说明 | SOP, SOP14,.25 | SSOP, SSOP14,.3 | SOP, SOP14,.25 | TSSOP, TSSOP14,.25 | SSOP, SSOP14,.3 | TSSOP, TSSOP14,.25 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER |
最大I(ol) | 0.012 A | 0.024 A | 0.024 A | 0.024 A | 0.012 A | 0.012 A |
端子数量 | 14 | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | SSOP | SOP | TSSOP | SSOP | TSSOP |
封装等效代码 | SOP14,.25 | SSOP14,.3 | SOP14,.25 | TSSOP14,.25 | SSOP14,.3 | TSSOP14,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
电源 | 3.3/5 V | 5 V | 5 V | 5 V | 3.3/5 V | 3.3/5 V |
Prop。Delay @ Nom-Sup | 9.5 ns | 8.5 ns | 8.5 ns | 8.5 ns | 9.5 ns | 9.5 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
施密特触发器 | NO | NO | NO | NO | NO | NO |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 0.635 mm | 1.27 mm | 0.635 mm | 0.635 mm | 0.635 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved