Revision 12
40MX and 42MX FPGA Families
Features
High Capacity
•
•
•
•
•
•
•
•
•
•
Single-Chip ASIC Alternative
3,000 to 54,000 System Gates
Up to 2.5 kbits Configurable Dual-Port SRAM
Fast Wide-Decode Circuitry
Up to 202 User-Programmable I/O Pins
5.6 ns Clock-to-Out
250 MHz Performance
5 ns Dual-Port SRAM Access
100 MHz FIFOs
7.5 ns 35-Bit Address Decode
•
•
•
•
•
•
•
•
HiRel Features
•
•
Commercial, Industrial, Automotive,
Temperature Plastic Packages
and
Military
Commercial, Military Temperature, and MIL-STD-883
Ceramic Packages
QML Certification
Ceramic Devices Available to DSCC SMD
Mixed-Voltage Operation (5.0 V or 3.3 V for core and
I/Os), with PCI-Compliant I/Os
Up to 100% Resource Utilization and 100% Pin Locking
Deterministic, User-Controllable Timing
Unique In-System Diagnostic and Verification Capability
with Silicon Explorer II
Low Power Consumption
IEEE Standard 1149.1 (JTAG) Boundary Scan Testing
High Performance
Ease of Integration
Product Profile
Device
Capacity
System Gates
SRAM Bits
Logic Modules
Sequential
Combinatorial
Decode
Clock-to-Out
SRAM Modules
(64x4 or 32x8)
Dedicated Flip-Flops
Maximum Flip-Flops
Clocks
User I/O (maximum)
PCI
Boundary Scan Test (BST)
Packages (by pin count)
PLCC
PQFP
VQFP
TQFP
CQFP
PBGA
A40MX02
3,000
–
–
295
–
9.5 ns
–
–
147
1
57
–
–
44, 68
100
80
–
–
–
A40MX04
6,000
–
–
547
–
9.5 ns
–
–
273
1
69
–
–
44, 68, 84
100
80
–
–
–
A42MX09
14,000
–
348
336
–
5.6 ns
–
348
516
2
104
–
–
84
100, 160
100
176
–
–
A42MX16
24,000
–
624
608
–
6.1 ns
–
624
928
2
140
–
–
84
100, 160, 208
100
176
–
–
A42MX24
36,000
–
954
912
24
6.1 ns
–
954
1,410
2
176
Yes
Yes
84
160, 208
–
176
–
–
A42MX36
54,000
2,560
1,230
1,184
24
6.3 ns
10
1,230
1,822
6
202
Yes
Yes
–
208, 240
–
–
208, 256
272
March 2014
© 2014 Microsemi Corporation
i
40MX and 42MX FPGA Families
Ordering Information
A42MX16 _
1
PQ
G
100
ES
Application (Temperature Range)
Blank = Commercial (0 to +70°C)
I = Industrial (–40 to +85°C)
M = Military (–55 to +125°C)
B = MIL-STD-883
A = Automotive (–40 to +125°C)
Package Lead Count
Lead-Free Packaging
Blank = Standard Packaging
G = RoHS Compliant Packaging
Package Type
PL = Plastic Leaded Chip Carrier
PQ = Plastic Quad Flat Pack
TQ = Thin (1.4 mm) Quad Flat Pack
VQ = Very Thin (1.0 mm) Quad Flat Pack
BG = Plastic Ball Grid Array
CQ =Ceramic Quad Flat Pack
Speed Grade
Blank = Standard Speed
–1 = Approximately 15% Faster than Standard
–2 = Approximately 25% Faster than Standard
–3 = Approximately 35% Faster than Standard
–F = Approximately 40% Slower than Standard
Part Number
A40MX02 = 3,000 System Gates
A40MX04 = 6,000 System Gates
A42MX09 = 14,000 System Gates
A42MX16 = 24,000 System Gates
A42MX24 = 36,000 System Gates
A42MX36 = 54,000 System Gates
Plastic Device Resources
User I/Os
Device
A40MX02
A40MX04
A42MX09
A42MX16
A42MX24
A42MX36
PLCC
44-Pin
34
34
–
–
–
–
PLCC
68-Pin
57
57
–
–
–
–
PLCC
84-Pin
–
69
72
72
72
–
PQFP
100-Pin
57
69
83
83
–
–
PQFP
160-Pin
–
–
101
125
125
–
PQFP
208-Pin
–
–
–
140
176
176
PQFP
240-Pin
–
–
–
–
–
202
VQFP
80-Pin
57
69
–
–
–
–
VQFP
100-Pin
–
–
83
83
–
–
TQFP
176-Pin
–
–
104
140
150
–
PBGA
272-Pin
–
–
–
–
–
202
Note:
Package Definitions
PLCC = Plastic Leaded Chip Carrier, PQFP = Plastic Quad Flat Pack, TQFP = Thin Quad Flat Pack, VQFP = Very Thin Quad
Flat Pack, PBGA = Plastic Ball Grid Array
ii
R evis i o n 12
40MX and 42MX FPGA Families
Ceramic Device Resources
User I/Os
Device
A42MX36
Note:
Package Definitions
CQFP 208-Pin
176
CQFP = Ceramic Quad Flat Pack
CQFP 256-Pin
202
Temperature Grade Offerings
Package
PLCC 44
PLCC 68
PLCC 84
PQFP 100
PQFP 160
PQFP 208
PQFP 240
VQFP 80
VQFP 100
TQFP 176
PBGA 272
CQFP 208
CQFP 256
Note:
C = Commercial
I = Industrial
A = Automotive
M = Military
B = MIL-STD-883 Class B
C, I, A, M
C, I, A, M
C, I, A, M
C, I, A, M
C, I, A, M
C, I, A, M
C, I, A, M
C, I, M
C, M, B
C, M, B
C, I, A, M
A40MX02
C, I, M
C, I, A, M
A40MX04
C, I, M
C, I, M
C, I, A, M
C, I, A, M
C, I, A, M
C, I, A, M
C, I, A, M
C, I, M
C, I, M
C, I, M
C, I, A, M
C, I, A, M
C, I, A, M
C, I, A, M
C, I, A, M
C, I, M
A42MX09
A42MX16
A42MX24
A42MX36
Speed Grade Offerings
–F
C
I
A
M
B
Std
–1
–2
–3
Note:
Refer to the
40MX and 42MX Automotive Family FPGAs
datasheet for details on automotive-grade MX offerings.
Contact your local Microsemi SoC Products Group representative for device availability.
R ev i si o n 1 2
iii
40MX and 42MX FPGA Families
Table of Contents
40MX and 42MX FPGA Families
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
MX Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
Other Architectural Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10
Development Tool Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16
Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16
5.0 V Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-17
3.3 V Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-19
Mixed 5.0 V / 3.3 V Operating Conditions (for 42MX Devices Only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-21
Timing Models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-27
Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-35
Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-83
Package Pin Assignments
PL44 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
PL68 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
PL84 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5
PQ100 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9
PQ160 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-13
PQ208 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-19
PQ240 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-26
VQ80 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-30
VQ100 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-32
TQ176 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-34
CQ208 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-40
CQ256 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-43
BG272 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-47
Datasheet Information
List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
R ev i si o n 1 2
iv
1 – 40MX and 42MX FPGA Families
General Description
Microsemi's 40MX and 42MX families offer a cost-effective design solution at 5V. The MX devices are single-chip
solutions and provide high performance while shortening the system design and development cycle. MX devices can
integrate and consolidate logic implemented in multiple PALs, CPLDs, and FPGAs. Example applications include high-
speed controllers and address decoding, peripheral bus interfaces, DSP, and co-processor functions.
The MX device architecture is based on Microsemi’s patented antifuse technology implemented in a 0.45µm triple-
metal CMOS process. With capacities ranging from 3,000 to 54,000 system gates, the MX devices provide
performance up to 250 MHz, are live on power-up and have one-fifth the standby power consumption of comparable
FPGAs. MX FPGAs provide up to 202 user I/Os and are available in a wide variety of packages and speed grades.
A42MX24 and A42MX36 devices also feature MultiPlex I/Os, which support mixed-voltage systems, enable
programmable PCI, deliver high-performance operation at both 5.0V and 3.3V, and provide a low-power mode. The
devices are fully compliant with the PCI Local Bus Specification (version 2.1). They deliver 200 MHz on-chip operation
and 6.1 ns clock-to-output performance.
The 42MX24 and 42MX36 devices include system-level features such as IEEE Standard 1149.1 (JTAG) Boundary
Scan Testing and fast wide-decode modules. In addition, the A42MX36 device offers dual-port SRAM for implementing
fast FIFOs, LIFOs, and temporary data storage. The storage elements can efficiently address applications requiring
wide datapath manipulation and can perform transformation functions such as those required for telecommunications,
networking, and DSP.
All MX devices are fully tested over automotive and military temperature ranges. In addition, the largest member of the
family, the A42MX36, is available in both CQ208 and CQ256 ceramic packages screened to MIL-STD-883 levels. For
easy prototyping and conversion from plastic to ceramic, the CQ208 and PQ208 devices are pin-compatible.
MX Architectural Overview
The MX devices are composed of fine-grained building blocks that enable fast, efficient logic designs. All devices
within these families are composed of logic modules, I/O modules, routing resources and clock networks, which are
the building blocks for fast logic designs. In addition, the A42MX36 device contains embedded dual-port SRAM
modules, which are optimized for high-speed datapath functions such as FIFOs, LIFOs and scratchpad memory.
A42MX24 and A42MX36 also contain wide-decode modules.
Logic Modules
The 40MX logic module is an eight-input, one-output logic circuit designed to implement a wide range of logic functions
with efficient use of interconnect routing resources (Figure
1-1 on page 1-2).
The logic module can implement the four basic logic functions (NAND, AND, OR and NOR) in gates of two, three, or
four inputs. The logic module can also implement a variety of D-latches, exclusivity functions, AND-ORs and OR-
ANDs. No dedicated hard-wired latches or flip-flops are required in the array; latches and flip-flops can be constructed
from logic modules whenever required in the application.
R ev i si o n 1 2
1-1