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IDT7034L20PFG

产品描述Dual-Port SRAM, 4KX18, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
产品类别存储    存储   
文件大小154KB,共19页
制造商IDT (Integrated Device Technology)
标准  
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IDT7034L20PFG概述

Dual-Port SRAM, 4KX18, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100

IDT7034L20PFG规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码QFP
包装说明LFQFP,
针数100
Reach Compliance Codecompliant
ECCN代码EAR99
最长访问时间20 ns
JESD-30 代码S-PQFP-G100
JESD-609代码e3
长度14 mm
内存密度73728 bit
内存集成电路类型DUAL-PORT SRAM
内存宽度18
湿度敏感等级3
功能数量1
端子数量100
字数4096 words
字数代码4000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织4KX18
封装主体材料PLASTIC/EPOXY
封装代码LFQFP
封装形状SQUARE
封装形式FLATPACK, LOW PROFILE, FINE PITCH
并行/串行PARALLEL
峰值回流温度(摄氏度)260
认证状态Not Qualified
座面最大高度1.6 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Matte Tin (Sn)
端子形式GULL WING
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间30
宽度14 mm

文档预览

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HIGH-SPEED
4K x 18 DUAL-PORT
STATIC RAM
Features:
IDT7034S/L
True Dual-Ported memory cells which allow simultaneous
reads of the same memory location
High-speed access
– Commercial: 15/20ns (max.)
– Industrial: 20ns (max.)
Low-power operation
– IDT7034S
Active: 850mW (typ.)
Standby: 5mW (typ.)
– IDT7034L
Active: 850mW (typ.)
Standby: 1mW (typ.)
Separate upper-byte and lower-byte control for multi-
plexed bus compatibility
IDT7034 easily expands data bus width to 36 bits or more
using the Master/Slave select when cascading more than
one device
M/S = H for
BUSY
output flag on Master
M/S = L for
BUSY
input on Slave
Interrupt Flag
On-chip port arbitration logic
Full on-chip hardware support of semaphore signaling
between ports
Fully asynchronous operation from either port
Battery backup operation—2V data retention
TTL-compatible, single 5V (±10%) power supply
Available in 100-pin Thin Quad Flatpack
Industrial temperature range (–40°C to +85°C) is available
for selected speeds
Functional Block Diagram
R/
W
L
UB
L
R/
W
R
UB
R
LB
L
CE
L
OE
L
LB
R
CE
R
OE
R
I/O
9L
-I/O
17L
I/O
0L
-I/O
8L
BUSY
L
(1,2)
I/O
Control
I/O
Control
I/O
9R
-I/O
17R
I/O
0R
-I/O
8R
BUSY
R
(1,2)
.
A
11L
A
0L
Address
Decoder
13
MEMORY
ARRAY
13
Address
Decoder
A
11R
A
0R
CE
L
OE
L
R/
W
L
SEM
L
(2)
INT
L
ARBITRATION
INTERRUPT
SEMAPHORE
LOGIC
CE
R
OE
R
R/
W
R
SEM
R
(2)
INT
R
4089 drw 01
M/
S
NOTES:
1. (MASTER):
BUSY
is output; (SLAVE):
BUSY
is input.
2.
BUSY
outputs and
INT
outputs are non-tri-stated push-pull.
AUGUST 2001
1
©2001 Integrated Device Technology, Inc.
DSC 4089/8

IDT7034L20PFG相似产品对比

IDT7034L20PFG IDT7034S15PFG IDT7034S15PF9 IDT7034S20PFGI IDT7034S20PFG IDT7034S20PFI IDT7034S20PF9 IDT7034L20PFGI IDT7034L15PF9 IDT7034L20PF9
描述 Dual-Port SRAM, 4KX18, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 Dual-Port SRAM, 4KX18, 15ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 Dual-Port SRAM, 4KX18, 15ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 Dual-Port SRAM, 4KX18, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 Dual-Port SRAM, 4KX18, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 Dual-Port SRAM, 4KX18, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 Dual-Port SRAM, 4KX18, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 Dual-Port SRAM, 4KX18, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 Dual-Port SRAM, 4KX18, 15ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 Dual-Port SRAM, 4KX18, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
是否无铅 不含铅 不含铅 含铅 不含铅 不含铅 含铅 含铅 不含铅 含铅 含铅
是否Rohs认证 符合 符合 不符合 符合 符合 不符合 不符合 符合 不符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 QFP QFP QFP QFP QFP QFP QFP QFP QFP QFP
包装说明 LFQFP, LFQFP, LFQFP, LFQFP, LFQFP, LFQFP, QFP100,.63SQ,20 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 LFQFP, LFQFP, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
针数 100 100 100 100 100 100 100 100 100 100
Reach Compliance Code compliant compliant compliant compliant compliant not_compliant compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 20 ns 15 ns 15 ns 20 ns 20 ns 20 ns 20 ns 20 ns 15 ns 20 ns
JESD-30 代码 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100
JESD-609代码 e3 e3 e0 e3 e3 e0 e0 e3 e0 e0
长度 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
内存密度 73728 bit 73728 bit 73728 bit 73728 bit 73728 bit 73728 bit 73728 bit 73728 bit 73728 bit 73728 bit
内存集成电路类型 DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM
内存宽度 18 18 18 18 18 18 18 18 18 18
湿度敏感等级 3 3 3 3 3 3 3 3 3 3
功能数量 1 1 1 1 1 1 1 1 1 1
端子数量 100 100 100 100 100 100 100 100 100 100
字数 4096 words 4096 words 4096 words 4096 words 4096 words 4096 words 4096 words 4096 words 4096 words 4096 words
字数代码 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 85 °C 70 °C 85 °C 70 °C 85 °C 70 °C 70 °C
组织 4KX18 4KX18 4KX18 4KX18 4KX18 4KX18 4KX18 4KX18 4KX18 4KX18
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LFQFP LFQFP LFQFP LFQFP LFQFP LFQFP LFQFP LFQFP LFQFP LFQFP
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 260 260 240 260 260 240 240 260 240 240
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL
端子面层 Matte Tin (Sn) Matte Tin (Sn) TIN LEAD Matte Tin (Sn) Matte Tin (Sn) Tin/Lead (Sn85Pb15) TIN LEAD Matte Tin (Sn) TIN LEAD TIN LEAD
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
处于峰值回流温度下的最长时间 30 30 20 30 30 20 20 30 20 20
宽度 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm

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