Datasheet> 器件分类 > 存储> IDT7034S15PF9

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IDT7034S15PF9: 产品描述Dual-Port SRAM, 4KX18, 15ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100; 产品类别存储; 文件大小154KB，共19页; 制造商IDT (Integrated Device Technology)

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IDT7034S15PF9概述

Dual-Port SRAM, 4KX18, 15ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100

IDT7034S15PF9规格参数

参数名称	属性值
是否无铅	含铅
是否Rohs认证	不符合
厂商名称	IDT (Integrated Device Technology)
零件包装代码	QFP
包装说明	LFQFP,
针数	100
Reach Compliance Code	compliant
ECCN代码	EAR99
最长访问时间	15 ns
JESD-30 代码	S-PQFP-G100
JESD-609代码	e0
长度	14 mm
内存密度	73728 bit
内存集成电路类型	DUAL-PORT SRAM
内存宽度	18
湿度敏感等级	3
功能数量	1
端子数量	100
字数	4096 words
字数代码	4000
工作模式	ASYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	4KX18
封装主体材料	PLASTIC/EPOXY
封装代码	LFQFP
封装形状	SQUARE
封装形式	FLATPACK, LOW PROFILE, FINE PITCH
并行/串行	PARALLEL
峰值回流温度（摄氏度）	240
认证状态	Not Qualified
座面最大高度	1.6 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	TIN LEAD
端子形式	GULL WING
端子节距	0.5 mm
端子位置	QUAD
处于峰值回流温度下的最长时间	20
宽度	14 mm
Base Number Matches	1

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HIGH-SPEED

4K x 18 DUAL-PORT

STATIC RAM

Features:

◆

IDT7034S/L

◆

True Dual-Ported memory cells which allow simultaneous

reads of the same memory location

High-speed access

– Commercial: 15/20ns (max.)

– Industrial: 20ns (max.)

Low-power operation

– IDT7034S

Active: 850mW (typ.)

Standby: 5mW (typ.)

– IDT7034L

Active: 850mW (typ.)

Standby: 1mW (typ.)

Separate upper-byte and lower-byte control for multi-

plexed bus compatibility

IDT7034 easily expands data bus width to 36 bits or more

◆

using the Master/Slave select when cascading more than

one device

M/S = H for

BUSY

output flag on Master

M/S = L for

BUSY

input on Slave

Interrupt Flag

On-chip port arbitration logic

Full on-chip hardware support of semaphore signaling

between ports

Fully asynchronous operation from either port

Battery backup operation—2V data retention

TTL-compatible, single 5V (±10%) power supply

Available in 100-pin Thin Quad Flatpack

Industrial temperature range (–40°C to +85°C) is available

for selected speeds

Functional Block Diagram

I/O

-I/O

17L

I/O

-I/O

BUSY

(1,2)

I/O

Control

I/O

Control

I/O

-I/O

17R

I/O

-I/O

BUSY

(1,2)

11L

Address

Decoder

MEMORY

ARRAY

Address

Decoder

11R

SEM

(2)

INT

ARBITRATION

INTERRUPT

SEMAPHORE

LOGIC

SEM

(2)

INT

4089 drw 01

NOTES:

1. (MASTER):

BUSY

is output; (SLAVE):

BUSY

is input.

BUSY

outputs and

INT

outputs are non-tri-stated push-pull.

AUGUST 2001

DSC 4089/8

IDT7034S15PF9相似产品对比

	IDT7034S15PF9	IDT7034S15PFG	IDT7034S20PFGI	IDT7034S20PFG	IDT7034S20PFI	IDT7034S20PF9	IDT7034L20PFGI	IDT7034L15PF9	IDT7034L20PFG	IDT7034L20PF9
描述	Dual-Port SRAM, 4KX18, 15ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100	Dual-Port SRAM, 4KX18, 15ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100	Dual-Port SRAM, 4KX18, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100	Dual-Port SRAM, 4KX18, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100	Dual-Port SRAM, 4KX18, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100	Dual-Port SRAM, 4KX18, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100	Dual-Port SRAM, 4KX18, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100	Dual-Port SRAM, 4KX18, 15ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100	Dual-Port SRAM, 4KX18, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100	Dual-Port SRAM, 4KX18, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
是否无铅	含铅	不含铅	不含铅	不含铅	含铅	含铅	不含铅	含铅	不含铅	含铅
是否Rohs认证	不符合	符合	符合	符合	不符合	不符合	符合	不符合	符合	不符合
厂商名称	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
零件包装代码	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP
包装说明	LFQFP,	LFQFP,	LFQFP,	LFQFP,	LFQFP, QFP100,.63SQ,20	14 X 14 MM, 1.40 MM HEIGHT, TQFP-100	LFQFP,	LFQFP,	LFQFP,	14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
针数	100	100	100	100	100	100	100	100	100	100
Reach Compliance Code	compliant	compliant	compliant	compliant	not_compliant	compliant	compliant	compliant	compliant	compliant
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
最长访问时间	15 ns	15 ns	20 ns	20 ns	20 ns	20 ns	20 ns	15 ns	20 ns	20 ns
JESD-30 代码	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100
JESD-609代码	e0	e3	e3	e3	e0	e0	e3	e0	e3	e0
长度	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm
内存密度	73728 bit	73728 bit	73728 bit	73728 bit	73728 bit	73728 bit	73728 bit	73728 bit	73728 bit	73728 bit
内存集成电路类型	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM
内存宽度	18	18	18	18	18	18	18	18	18	18
湿度敏感等级	3	3	3	3	3	3	3	3	3	3
功能数量	1	1	1	1	1	1	1	1	1	1
端子数量	100	100	100	100	100	100	100	100	100	100
字数	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words
字数代码	4000	4000	4000	4000	4000	4000	4000	4000	4000	4000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	70 °C	70 °C	85 °C	70 °C	85 °C	70 °C	85 °C	70 °C	70 °C	70 °C
组织	4KX18	4KX18	4KX18	4KX18	4KX18	4KX18	4KX18	4KX18	4KX18	4KX18
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	LFQFP	LFQFP	LFQFP	LFQFP	LFQFP	LFQFP	LFQFP	LFQFP	LFQFP	LFQFP
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	240	260	260	260	240	240	260	240	260	240
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子面层	TIN LEAD	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Tin/Lead (Sn85Pb15)	TIN LEAD	Matte Tin (Sn)	TIN LEAD	Matte Tin (Sn)	TIN LEAD
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm
端子位置	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
处于峰值回流温度下的最长时间	20	30	30	30	20	20	30	20	30	20
宽度	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm

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器件捷径: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

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