256KX16 VIDEO DRAM, 70ns, CDFP64, CERAMIC, DFP-64
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DFP |
| 包装说明 | CERAMIC, DFP-64 |
| 针数 | 64 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 访问模式 | FAST PAGE WITH EDO |
| 最长访问时间 | 70 ns |
| 其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 256 X 16 SAM PORT |
| JESD-30 代码 | R-CDFP-F64 |
| 长度 | 18.985 mm |
| 内存密度 | 4194304 bit |
| 内存集成电路类型 | VIDEO DRAM |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 64 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 256KX16 |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | GDFP |
| 封装等效代码 | TPAK64,1.6SQ,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK, GUARD RING |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 刷新周期 | 512 |
| 筛选级别 | 38535Q/M;38534H;883B |
| 座面最大高度 | 3.81 mm |
| 最大待机电流 | 0.012 A |
| 最大压摆率 | 0.225 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | FLAT |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 10.985 mm |
| SMJ55166-70HKCM | 5962-9564301QYC | 5962-9564301QXA | 5962-9564301QXX | 5962-9564301QYX | SMJ55166-70GBM | |
|---|---|---|---|---|---|---|
| 描述 | 256KX16 VIDEO DRAM, 70ns, CDFP64, CERAMIC, DFP-64 | 256KX16 VIDEO DRAM, 80ns, DFP64, FP-64 | 256KX16 VIDEO DRAM, 80ns, CPGA68, CERAMIC, PGA-68 | IC 256K X 16 VIDEO DRAM, 80 ns, CPGA68, CERAMIC, PGA-68, Dynamic RAM | IC 256K X 16 VIDEO DRAM, 80 ns, DFP64, Dynamic RAM | 256KX16 VIDEO DRAM, 70ns, CPGA68, CERAMIC, PGA-68 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | CERAMIC, DFP-64 | FP-64 | CERAMIC, PGA-68 | PGA, | DFP, | PGA, PGA68,9X9 |
| Reach Compliance Code | not_compliant | unknown | not_compliant | unknown | unknown | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO |
| 最长访问时间 | 70 ns | 80 ns | 80 ns | 80 ns | 80 ns | 70 ns |
| 其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 256 X 16 SAM PORT | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 256 X 16 SAM PORT | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 256 X 16 SAM PORT | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 256 X 16 SAM PORT | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 256 X 16 SAM PORT | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 256 X 16 SAM PORT |
| JESD-30 代码 | R-CDFP-F64 | R-XDFP-F64 | S-CPGA-P68 | S-CPGA-P68 | R-XDFP-F64 | S-CPGA-P68 |
| 内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
| 内存集成电路类型 | VIDEO DRAM | VIDEO DRAM | VIDEO DRAM | VIDEO DRAM | VIDEO DRAM | VIDEO DRAM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 64 | 64 | 68 | 68 | 64 | 68 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | GDFP | DFP | PGA | PGA | DFP | PGA |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | FLATPACK, GUARD RING | FLATPACK | GRID ARRAY | GRID ARRAY | FLATPACK | GRID ARRAY |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | FLAT | FLAT | PIN/PEG | PIN/PEG | FLAT | PIN/PEG |
| 端子位置 | DUAL | DUAL | PERPENDICULAR | PERPENDICULAR | DUAL | PERPENDICULAR |
| 零件包装代码 | DFP | DFP | PGA | PGA | - | PGA |
| 针数 | 64 | 64 | 68 | 68 | - | 68 |
| 长度 | 18.985 mm | 18.985 mm | - | - | 18.985 mm | 24.38 mm |
| 封装等效代码 | TPAK64,1.6SQ,20 | TPAK64,1.6SQ,20 | PGA68,9X9 | - | - | PGA68,9X9 |
| 电源 | 5 V | 5 V | 5 V | - | - | 5 V |
| 筛选级别 | 38535Q/M;38534H;883B | MIL-PRF-38535 Class Q | MIL-PRF-38535 Class Q | - | - | 38535Q/M;38534H;883B |
| 最大待机电流 | 0.012 A | 0.012 A | 0.012 A | - | - | 0.012 A |
| 最大压摆率 | 0.225 mA | 0.2 mA | 0.2 mA | - | - | 0.225 mA |
| 端子节距 | 0.5 mm | 0.5 mm | 2.54 mm | - | 0.5 mm | 2.54 mm |
| 宽度 | 10.985 mm | 10.985 mm | - | - | 10.985 mm | 24.38 mm |
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