EEPROM, 2KX8, 100ns, Parallel, CMOS, PDIP24,
| 参数名称 | 属性值 |
| 厂商名称 | Exel Microelectronics Inc |
| Reach Compliance Code | unknown |
| 最长访问时间 | 100 ns |
| JESD-30 代码 | R-PDIP-T24 |
| 内存密度 | 16384 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 字数 | 2048 words |
| 字数代码 | 2000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 2KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | PARALLEL |
| 编程电压 | 5 V |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | DUAL |
| XLS28C16B-100P | XLS28C16B-100C | XLS28C16B-100D | XLS28C16B-100J | XLS28C16B-100P3 | |
|---|---|---|---|---|---|
| 描述 | EEPROM, 2KX8, 100ns, Parallel, CMOS, PDIP24, | EEPROM, 2KX8, 100ns, Parallel, CMOS, CDIP24, | EEPROM, 2KX8, 100ns, Parallel, CMOS, PQCC32, | EEPROM, 2KX8, 100ns, Parallel, CMOS, PDSO24, | EEPROM, 2KX8, 100ns, Parallel, CMOS, PDIP24, |
| 厂商名称 | Exel Microelectronics Inc | Exel Microelectronics Inc | Exel Microelectronics Inc | Exel Microelectronics Inc | Exel Microelectronics Inc |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 最长访问时间 | 100 ns | 100 ns | 100 ns | 100 ns | 100 ns |
| JESD-30 代码 | R-PDIP-T24 | R-GDIP-T24 | R-PQCC-J32 | R-PDSO-G24 | R-PDIP-T24 |
| 内存密度 | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 32 | 24 | 24 |
| 字数 | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words |
| 字数代码 | 2000 | 2000 | 2000 | 2000 | 2000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | CHIP CARRIER | SMALL OUTLINE | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 编程电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | J BEND | GULL WING | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | QUAD | DUAL | DUAL |
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