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70T3719MS133BBG

产品描述PBGA-324, Tray
产品类别存储    存储   
文件大小591KB,共26页
制造商IDT (Integrated Device Technology)
标准  
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70T3719MS133BBG概述

PBGA-324, Tray

70T3719MS133BBG规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码PBGA
包装说明BGA, BGA324,18X18,40
针数324
制造商包装代码BBG324
Reach Compliance Codecompliant
ECCN代码3A991.B.2.A
最长访问时间15 ns
其他特性PIPELINED OR FLOW-THROUGH ARCHITECTURE
最大时钟频率 (fCLK)133 MHz
I/O 类型COMMON
JESD-30 代码S-PBGA-B324
JESD-609代码e1
内存密度18874368 bit
内存集成电路类型DUAL-PORT SRAM
内存宽度72
湿度敏感等级3
功能数量1
端口数量2
端子数量324
字数262144 words
字数代码256000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织256KX72
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA324,18X18,40
封装形状SQUARE
封装形式GRID ARRAY
并行/串行PARALLEL
峰值回流温度(摄氏度)260
电源2.5,2.5/3.3 V
认证状态Not Qualified
最大待机电流0.02 A
最小待机电流2.4 V
最大压摆率0.74 mA
最大供电电压 (Vsup)2.6 V
最小供电电压 (Vsup)2.4 V
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30

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HIGH-SPEED 2.5V
70T3719/99M
256/128K x 72
SYNCHRONOUS
DUAL-PORT STATIC RAM
WITH 3.3V OR 2.5V INTERFACE
Features:
True Dual-Port memory cells which allow simultaneous
access of the same memory location
High-speed data access
– Commercial: 3.6ns (166MHz)
4.2ns (133MHz)(max.)
– Industrial: 4.2ns (133MHz) (max.)
Selectable Pipelined or Flow-Through output mode
Counter enable and repeat features
Dual chip enables allow for depth expansion without
additional logic
Interrupt and Collision Detection Flags
Full synchronous operation on both ports
– 6ns cycle time, 166MHz operation (23.9Gbps bandwidth)
– Fast 3.6ns clock to data out
– Self-timed write allows fast cycle time
– 1.7ns setup to clock and 0.5ns hold on all control, data, and
address inputs @ 166MHz
– Data input, address, byte enable and control registers
Separate byte controls for multiplexed bus and bus
matching compatibility
Dual Cycle Deselect (DCD) for Pipelined Output Mode
2.5V (±100mV) power supply for core
LVTTL compatible, selectable 3.3V (±150mV) or 2.5V
(±100mV) power supply for I/Os and control signals on
each port
Industrial temperature range (-40°C to +85°C) is
available at 133MHz
Available in a 324-pin Green Ball Grid Array (BGA)
Includes JTAG Functionality
Green parts available, see ordering information
Functional Block Diagram
BE
7L
BE
7R
BE
0L
BE
0R
FT/PIPE
L
1/0
0a 1a
a
0h 1h
h
1h 0h
h
1a 0a
a
1/0
FT/PIPE
R
R/W
L
R/W
R
CE
0L
CE
1L
1
0
1/0
B
W
0
L
B
W
7
L
B
W
7
R
B
W
0
R
1
0
1/0
CE
0R
CE
1R
OE
L
OE
R
D
OUT
0-8_L
D
OUT
9-17_L
D
OUT
18-26_L
D
OUT
27-35_L
D
OUT
36-44_L
D
OUT
45-53_L
D
OUT
54-62_L
D
OUT
63-72_L
1h 0h
1a 0a
a
h
D
OUT
0-8_R
D
OUT
9-17_R
D
OUT
18-26_R
D
OUT
27-35_R
D
OUT
36-44_R
D
OUT
45-53_R
D
OUT
54-62_R
D
OUT
63-72_R
0a 1a
h
a
0h 1h
0/1
,
FT/PIPE
R
FT/PIPE
L
0/1
256/128K x 72
MEMORY
ARRAY
Byte 0
I/O
0L
- I/O
71L
Byte 7
D
IN
_L
D
IN
_R
Byte 7
Byte 0
I/O
0R
- I/O
71R
CLK
L
A
17L
(1)
A
0L
REPEAT
L
ADS
L
CNTEN
L
A
17R
(1)
CLK
R
,
Counter/
Address
Reg.
ADDR_L
ADDR_R
Counter/
Address
Reg.
A
0
R
REPEAT
R
ADS
R
CNTEN
R
CE
0L
CE
1L
R/W
L
COL
L
INT
L
ZZ
L
(2)
INTERRUPT
COLLISION
DETECTION
LOGIC
CE
0R
CE
1R
R/W
R
COL
R
INT
R
TDI
JTAG
TDO
TCK
T MS
T RST
LOGIC
NOTES:
1. Address A
17
is a NC for the IDT70T3799.
2. The sleep mode pin shuts off all dynamic inputs, except JTAG inputs, when asserted. All static inputs, i.e., PL/FTx and OPTx
and the sleep mode pins themselves (ZZx) are not affected during sleep mode.
ZZ
CONTROL
ZZ
R
(2)
5687 drw 01
NOVEMBER 2019
DSC 5687/6
1
©2019 Integrated Device Technology, Inc.

70T3719MS133BBG相似产品对比

70T3719MS133BBG 70T3799MS133BBGI 70T3799MS133BBG 70T3719MS166BBG
描述 PBGA-324, Tray PBGA-324, Tray PBGA-324, Tray PBGA-324, Tray
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
是否无铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合
零件包装代码 PBGA PBGA PBGA PBGA
包装说明 BGA, BGA324,18X18,40 BGA, BGA324,18X18,40 BGA, BGA324,18X18,40 BGA, BGA324,18X18,40
针数 324 324 324 324
制造商包装代码 BBG324 BBG324 BBG324 BBG324
Reach Compliance Code compliant compliant compliant compliant
ECCN代码 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
最长访问时间 15 ns 15 ns 15 ns 12 ns
其他特性 PIPELINED OR FLOW-THROUGH ARCHITECTURE PIPELINED OR FLOW-THROUGH ARCHITECTURE PIPELINED OR FLOW-THROUGH ARCHITECTURE PIPELINED OR FLOW-THROUGH ARCHITECTURE
最大时钟频率 (fCLK) 133 MHz 133 MHz 133 MHz 166 MHz
I/O 类型 COMMON COMMON COMMON COMMON
JESD-30 代码 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324
JESD-609代码 e1 e1 e1 e1
内存密度 18874368 bit 9437184 bit 9437184 bit 18874368 bit
内存集成电路类型 DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM
内存宽度 72 72 72 72
湿度敏感等级 3 3 3 3
功能数量 1 1 1 1
端口数量 2 2 2 2
端子数量 324 324 324 324
字数 262144 words 131072 words 131072 words 262144 words
字数代码 256000 128000 128000 256000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 85 °C 70 °C 70 °C
组织 256KX72 128KX72 128KX72 256KX72
输出特性 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA BGA
封装等效代码 BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40
封装形状 SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 260 260 260 260
电源 2.5,2.5/3.3 V 2.5,2.5/3.3 V 2.5,2.5/3.3 V 2.5,2.5/3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
最大待机电流 0.02 A 0.025 A 0.02 A 0.02 A
最小待机电流 2.4 V 2.4 V 2.4 V 2.4 V
最大压摆率 0.74 mA 0.9 mA 0.74 mA 0.9 mA
最大供电电压 (Vsup) 2.6 V 2.6 V 2.6 V 2.6 V
最小供电电压 (Vsup) 2.4 V 2.4 V 2.4 V 2.4 V
标称供电电压 (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
端子形式 BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 30 30 30 30
Base Number Matches - 1 1 1

 
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