Inverter
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Nexperia |
| 包装说明 | DHVQFN-14 |
| Reach Compliance Code | compliant |
| 系列 | LVC/LCX/Z |
| JESD-30 代码 | R-PQCC-N14 |
| JESD-609代码 | e4 |
| 长度 | 3 mm |
| 逻辑集成电路类型 | INVERTER |
| 湿度敏感等级 | 1 |
| 功能数量 | 6 |
| 输入次数 | 1 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVQCCN |
| 封装形状 | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 传播延迟（tpd） | 10.2 ns |
| 座面最大高度 | 1 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 1.2 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 2.5 mm |
| 74LVC04ABQ | 935277011118 | 74LVC04ADB-T | 74LVC04APW-T | 74LVC04AD-T | 935273675115 | 74LVC04APW | 74LVC04ADB | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Inverter | Inverter | Inverter | Inverter | Inverter | Inverter | Inverter | Inverter |
| 厂商名称 | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia |
| 包装说明 | DHVQFN-14 | , | SSOP, | TSSOP, | SOP, | HVQCCN, | TSSOP-14 | SSOP-14 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 逻辑集成电路类型 | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER |
| 是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 系列 | LVC/LCX/Z | - | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 代码 | R-PQCC-N14 | - | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PQCC-N14 | R-PDSO-G14 | R-PDSO-G14 |
| JESD-609代码 | e4 | - | - | e4 | e4 | e4 | e4 | e4 |
| 长度 | 3 mm | - | 6.2 mm | 5 mm | 8.65 mm | 3 mm | 5 mm | 6.2 mm |
| 湿度敏感等级 | 1 | - | - | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 6 | - | 6 | 6 | 6 | 6 | 6 | 6 |
| 输入次数 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 14 | - | 14 | 14 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 125 °C | - | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | - | SSOP | TSSOP | SOP | HVQCCN | TSSOP | SSOP |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| 传播延迟（tpd） | 10.2 ns | - | 10.2 ns | 10.2 ns | 10.2 ns | 10.2 ns | 10.2 ns | 10.2 ns |
| 座面最大高度 | 1 mm | - | 2 mm | 1.1 mm | 1.75 mm | 1 mm | 1.1 mm | 2 mm |
| 最大供电电压 (Vsup) | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 1.2 V | - | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| 标称供电电压 (Vsup) | 1.8 V | - | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | - | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD | - | GULL WING | GULL WING | GULL WING | NO LEAD | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | - | 0.65 mm | 0.65 mm | 1.27 mm | 0.5 mm | 0.65 mm | 0.65 mm |
| 端子位置 | QUAD | - | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL |
| 宽度 | 2.5 mm | - | 5.3 mm | 4.4 mm | 3.9 mm | 2.5 mm | 4.4 mm | 5.3 mm |
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