MBF2-MBF10
Schottky Surface Mount Flat Bridge Rectifier
MBS
.193(4.90)
.177(4.50)
Features
Low profile package
Ideal for automated placement
Ultrafast reverse recovery time
Low power losses, high efficiency
Low forward voltage drop
High surge capability
High temperature soldering：
260℃/10 seconds at terminals
.033(0.84)
.022(0.56)
.157(4.00)
.142(3.60)
.272(6.9)
MAX
.102(2.60)
.087(2.20)
.106(2.70)
.090(2.30)
.053(1.53)
.037(0.95)
.014(0.35
.006(0.15
.008(0.20) .114(2.9)
.043(1.10) .083(2.12)
MAX
MAX
.028(0.70) .043(1.10)
Dimensions in inches and (millimeters)
Mechanical Date
Case:
MBF molded plastic body over
Schottky barrier chips
Polarity:
Polarity symbols marked on body
Maximum Ratings & Thermal Characteristics & Electrical Characteristics
(T
A
= 25
°C
unless otherwise noted)
Symbol
MBF2
20
14
20
MBF4
40
28
40
MBF6
60
42
60
1.0
30
MBF8
80
56
80
MBF10
100
70
100
UNIT
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
0.2×0.2"(5.0×5.0mm)copper pad area
Peak forward surge current 8.3 ms single half
sine-wave superimposed on rated load
Maximum instantaneous forwad voltage at 1.0A
Maximum DC reverse current
T
A
= 25
℃
at Rated DC blocking voltage
T
A
= 100℃
Typical Junction Capacitance at 4.0V,1.0MHz
Typical Thermal resistance (Note1)
Operating junction temperature range
Storage temperature range
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
V
F
I
R
C
J
R
θJA
R
θJL
T
J
T
STG
V
V
V
A
A
0.50
0.55
0.70
0.5
20
0.85
V
mA
250
85
20
–55
to +125
–
55 to +150
125
pF
℃/
W
℃
℃
Note：1.Thermal resistance from junction to ambient and from junction to lead P.C.B.mounted on 0.2×0.2"(5.0×5.0mm)copper pad areas.
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