IC 8-CHANNEL, DIFFERENTIAL MULTIPLEXER, CDIP28, CERDIP-28, Multiplexer or Switch
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 零件包装代码 | DIP |
| 包装说明 | CERDIP-28 |
| 针数 | 28 |
| Reach Compliance Code | unknown |
| 其他特性 | OVERVOLTAGE PROTECTION |
| 模拟集成电路 - 其他类型 | DIFFERENTIAL MULTIPLEXER |
| JESD-30 代码 | R-GDIP-T28 |
| JESD-609代码 | e0 |
| 标称负供电电压 (Vsup) | -15 V |
| 信道数量 | 8 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 标称断态隔离度 | 66 dB |
| 通态电阻匹配规范 | 36 Ω |
| 最大通态电阻 (Ron) | 580 Ω |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP28,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 电源 | +-15 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.72 mm |
| 最大信号电流 | 0.025 A |
| 最大供电电流 (Isup) | 24 mA |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | NO |
| 最长断开时间 | 600 ns |
| 最长接通时间 | 2500 ns |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | BIPOLAR |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 15.24 mm |
| MUX28BT | MUX16BT | MUX16FP | MUX16AT | |
|---|---|---|---|---|
| 描述 | IC 8-CHANNEL, DIFFERENTIAL MULTIPLEXER, CDIP28, CERDIP-28, Multiplexer or Switch | IC 16-CHANNEL, SGL ENDED MULTIPLEXER, CDIP28, CERDIP-28, Multiplexer or Switch | IC 16-CHANNEL, SGL ENDED MULTIPLEXER, PDIP28, PLASTIC, DIP-28, Multiplexer or Switch | IC 16-CHANNEL, SGL ENDED MULTIPLEXER, CDIP28, CERDIP-28, Multiplexer or Switch |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | DIP | DIP | DIP |
| 包装说明 | CERDIP-28 | CERDIP-28 | PLASTIC, DIP-28 | CERDIP-28 |
| 针数 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknown | not_compliant | unknown | unknown |
| 其他特性 | OVERVOLTAGE PROTECTION | OVERVOLTAGE PROTECTION | OVERVOLTAGE PROTECTION | OVERVOLTAGE PROTECTION |
| 模拟集成电路 - 其他类型 | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | R-GDIP-T28 | R-GDIP-T28 | R-PDIP-T28 | R-GDIP-T28 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V |
| 信道数量 | 8 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 | 28 |
| 标称断态隔离度 | 66 dB | 66 dB | 66 dB | 66 dB |
| 通态电阻匹配规范 | 36 Ω | 36 Ω | 36 Ω | 20.3 Ω |
| 最大通态电阻 (Ron) | 580 Ω | 580 Ω | 580 Ω | 380 Ω |
| 最高工作温度 | 125 °C | 125 °C | 85 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -40 °C | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | +-15 V | +-15 V | +-15 V | +-15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.72 mm | 5.72 mm | 6.35 mm | 5.72 mm |
| 最大信号电流 | 0.025 A | 0.025 A | 0.025 A | 0.025 A |
| 最大供电电流 (Isup) | 24 mA | 24 mA | 24 mA | 24 mA |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | NO | NO | NO |
| 最长断开时间 | 600 ns | 500 ns | 500 ns | 500 ns |
| 最长接通时间 | 2500 ns | 2500 ns | 2500 ns | 2000 ns |
| 切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | MILITARY | MILITARY | INDUSTRIAL | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
| 厂商名称 | ADI(亚德诺半导体) | - | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 |
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