IC QUAD OP-AMP, 350 uV OFFSET-MAX, CDIP14, 0.300 INCH, HERMETIC SEALED, CERAMIC, DIP-14, Operational Amplifier
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Linear ( ADI ) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP14,.3 |
| 针数 | 14 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER |
| 架构 | VOLTAGE-FEEDBACK |
| 最大平均偏置电流 (IIB) | 0.03 µA |
| 25C 时的最大偏置电流 (IIB) | 0.035 µA |
| 标称共模抑制比 | 114 dB |
| 频率补偿 | YES |
| 最大输入失调电压 | 350 µV |
| JESD-30 代码 | R-GDIP-T14 |
| JESD-609代码 | e0 |
| 长度 | 19.939 mm |
| 低-失调 | YES |
| 微功率 | YES |
| 负供电电压上限 | -22 V |
| 标称负供电电压 (Vsup) | -15 V |
| 功能数量 | 4 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5/+-15 V |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 5.08 mm |
| 最小摆率 | 0.2 V/us |
| 标称压摆率 | 0.4 V/us |
| 最大压摆率 | 2.4 mA |
| 供电电压上限 | 22 V |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 最小电压增益 | 400000 |
| 宽度 | 7.62 mm |
| LT1014AMJ/883 | LT1013AMH/883 | LT1013MJ8/883 | LT1013AMJ8/883 | LT1014MJ/883 | |
|---|---|---|---|---|---|
| 描述 | IC QUAD OP-AMP, 350 uV OFFSET-MAX, CDIP14, 0.300 INCH, HERMETIC SEALED, CERAMIC, DIP-14, Operational Amplifier | IC DUAL OP-AMP, 300 uV OFFSET-MAX, MBCY8, 0.200 INCH, METAL CAN, TO-5, 8 PIN, Operational Amplifier | IC , Part Number Only | IC DUAL OP-AMP, 300 uV OFFSET-MAX, CDIP8, 0.300 INCH, HERMETIC SEALED, CERAMIC, DIP-8, Operational Amplifier | IC QUAD OP-AMP, 550 uV OFFSET-MAX, CDIP14, 0.300 INCH, HERMETIC SEALED, CERAMIC, DIP-14, Operational Amplifier |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) |
| 包装说明 | DIP, DIP14,.3 | , CAN8,.2 | DIP, DIP8,.3 | DIP, DIP8,.3 | DIP, DIP14,.3 |
| 针数 | 14 | 8 | 8 | 8 | 14 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| 架构 | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| 最大平均偏置电流 (IIB) | 0.03 µA | 0.03 µA | 0.045 µA | 0.03 µA | 0.045 µA |
| 25C 时的最大偏置电流 (IIB) | 0.035 µA | 0.035 µA | 0.05 µA | 0.035 µA | 0.05 µA |
| 标称共模抑制比 | 114 dB | 114 dB | 113 dB | 114 dB | 113 dB |
| 频率补偿 | YES | YES | YES | YES | YES |
| 最大输入失调电压 | 350 µV | 300 µV | 550 µV | 300 µV | 550 µV |
| JESD-30 代码 | R-GDIP-T14 | O-MBCY-W8 | R-GDIP-T8 | R-GDIP-T8 | R-GDIP-T14 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 低-失调 | YES | YES | NO | YES | NO |
| 微功率 | YES | YES | YES | YES | YES |
| 负供电电压上限 | -22 V | -22 V | -22 V | -22 V | -22 V |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V |
| 功能数量 | 4 | 2 | 2 | 2 | 4 |
| 端子数量 | 14 | 8 | 8 | 8 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | METAL | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装等效代码 | DIP14,.3 | CAN8,.2 | DIP8,.3 | DIP8,.3 | DIP14,.3 |
| 封装形状 | RECTANGULAR | ROUND | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | CYLINDRICAL | IN-LINE | IN-LINE | IN-LINE |
| 电源 | 5/+-15 V | 5/+-15 V | 5/+-15 V | 5/+-15 V | 5/+-15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
| 最小摆率 | 0.2 V/us | 0.2 V/us | 0.2 V/us | 0.2 V/us | 0.2 V/us |
| 标称压摆率 | 0.4 V/us | 0.4 V/us | 0.4 V/us | 0.4 V/us | 0.4 V/us |
| 最大压摆率 | 2.4 mA | 1.2 mA | 1.4 mA | 1.2 mA | 2.8 mA |
| 供电电压上限 | 22 V | 22 V | 22 V | 22 V | 22 V |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | NO | NO | NO | NO |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | WIRE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | DUAL | BOTTOM | DUAL | DUAL | DUAL |
| 最小电压增益 | 400000 | 500000 | 250000 | 500000 | 250000 |
| 是否无铅 | 含铅 | - | 含铅 | 含铅 | 含铅 |
| 零件包装代码 | DIP | TO-5 | - | DIP | DIP |
| 长度 | 19.939 mm | - | 10.287 mm | - | 19.939 mm |
| 封装代码 | DIP | - | DIP | DIP | DIP |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - |
| 座面最大高度 | 5.08 mm | - | 5.08 mm | 5.08 mm | 5.08 mm |
| 端子节距 | 2.54 mm | - | 2.54 mm | 2.54 mm | 2.54 mm |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - |
| 宽度 | 7.62 mm | - | 7.62 mm | 7.62 mm | 7.62 mm |
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