Interface Circuit
| 参数名称 | 属性值 |
| 厂商名称 | Dynex |
| 包装说明 | , |
| Reach Compliance Code | unknown |
| SA8282IGDMP1S | SA8281IGMP1S | SA8282IGMP1S | SA8281IGDP1S | |
|---|---|---|---|---|
| 描述 | Interface Circuit | Analog Circuit, CMOS, PDSO28 | Analog Circuit, CMOS, PDSO28 | Analog Circuit, CMOS, PDIP28 |
| 包装说明 | , | SOP, SOP28,.4 | SOP, SOP28,.4 | DIP, DIP28,.6 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 厂商名称 | Dynex | - | Dynex | Dynex |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 |
| JESD-30 代码 | - | R-PDSO-G28 | R-PDSO-G28 | R-PDIP-T28 |
| JESD-609代码 | - | e0 | e0 | e0 |
| 端子数量 | - | 28 | 28 | 28 |
| 最高工作温度 | - | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | SOP | SOP | DIP |
| 封装等效代码 | - | SOP28,.4 | SOP28,.4 | DIP28,.6 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| 电源 | - | 5 V | 5 V | 5 V |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | - | 5 V | 5 V | 5 V |
| 表面贴装 | - | YES | YES | NO |
| 技术 | - | CMOS | CMOS | CMOS |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | - | GULL WING | GULL WING | THROUGH-HOLE |
| 端子节距 | - | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | - | DUAL | DUAL | DUAL |
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