XNOR Gate, CMOS, CDIP14,
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Fairchild |
| 包装说明 | DIP, DIP14,.3 |
| Reach Compliance Code | compliant |
| JESD-30 代码 | R-XDIP-T14 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | XNOR GATE |
| 湿度敏感等级 | 2A |
| 端子数量 | 14 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 250 |
| 电源 | 5/15 V |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 4077BDCQM | FM3SX17U2640CLF | 4077DM | OSTV7020140 | TSW-217-09-T-D-RA | 4077DMQB | CD4070BMW/883 | CD4070BMJ/883 | CD4077BCM | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | XNOR Gate, CMOS, CDIP14, | Cable Assembly, | XNOR Gate, CMOS, CDIP14, | Terminal and Terminal Block, | Board Connector, 34 Contact(s), 2 Row(s), Male, Right Angle, 0.2 inch Pitch, Solder Terminal, Black Insulator, Receptacle | XNOR Gate, CMOS, CDIP14, | XOR Gate, CMOS, CDFP14, | XOR Gate, CMOS, CDIP14, | XNOR Gate, CMOS, PDSO14, |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | unknown | unknown | unknown |
| 是否Rohs认证 | 不符合 | 符合 | 不符合 | 符合 | - | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DIP, DIP14,.3 | - | DIP, DIP14,.3 | - | - | DIP, DIP14,.3 | DFP, FL14,.3 | DIP, DIP14,.3 | SOP, SOP14,.25 |
| JESD-30 代码 | R-XDIP-T14 | - | R-XDIP-T14 | - | - | R-XDIP-T14 | R-XDFP-F14 | R-XDIP-T14 | R-PDSO-G14 |
| JESD-609代码 | e0 | - | e0 | - | - | e0 | e0 | e0 | e0 |
| 逻辑集成电路类型 | XNOR GATE | - | XNOR GATE | - | - | XNOR GATE | XOR GATE | XOR GATE | XNOR GATE |
| 端子数量 | 14 | - | 14 | - | - | 14 | 14 | 14 | 14 |
| 最高工作温度 | 85 °C | 70 °C | 125 °C | - | 105 °C | 125 °C | 125 °C | 125 °C | 85 °C |
| 最低工作温度 | -40 °C | -20 °C | -55 °C | - | -55 °C | -55 °C | -55 °C | -55 °C | -40 °C |
| 封装主体材料 | CERAMIC | - | CERAMIC | - | - | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| 封装代码 | DIP | - | DIP | - | - | DIP | DFP | DIP | SOP |
| 封装等效代码 | DIP14,.3 | - | DIP14,.3 | - | - | DIP14,.3 | FL14,.3 | DIP14,.3 | SOP14,.25 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | - | IN-LINE | - | - | IN-LINE | FLATPACK | IN-LINE | SMALL OUTLINE |
| 电源 | 5/15 V | - | 5/15 V | - | - | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
| 认证状态 | Not Qualified | - | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 施密特触发器 | NO | - | NO | - | - | NO | NO | NO | NO |
| 表面贴装 | NO | - | NO | - | - | NO | YES | NO | YES |
| 技术 | CMOS | - | CMOS | - | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | MILITARY | - | - | MILITARY | MILITARY | MILITARY | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | - | THROUGH-HOLE | - | - | THROUGH-HOLE | FLAT | THROUGH-HOLE | GULL WING |
| 端子节距 | 2.54 mm | - | 2.54 mm | - | 5.08 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | - | DUAL | - | - | DUAL | DUAL | DUAL | DUAL |
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