IRLR8721PBF
IRLU8721PBF
Applications
l
High Frequency Synchronous Buck
Converters for Computer Processor Power
l
High Frequency Isolated DC-DC
Converters with Synchronous Rectification
for Telecom and Industrial Use
l
Lead-Free
Benefits
l
Very Low RDS(on) at 4.5V V
GS
l
Ultra-Low Gate Impedance
l
Fully Characterized Avalanche Voltage
and Current
D-Pak
IRLR8721PBF
I-Pak
IRLU8721PBF
V
DSS
R
DS(on)
max
30V
Absolute Maximum Ratings
Parameter
V
DS
V
GS
I
D
@ T
C
= 25°C
I
D
@ T
C
= 100°C
I
DM
P
D
@T
C
= 25°C
P
D
@T
C
= 100°C
T
J
T
STG
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
8.4m
:
Qg
8.5nC
Units
V
Max.
30
± 20
65
f
46
f
260
65
33
A
Maximum Power Dissipation
Maximum Power Dissipation
Linear Derating Factor
Operating Junction and
Storage Temperature Range
W
W/°C
°C
0.43
-55 to + 175
Thermal Resistance
Parameter
R
θJC
R
θJA
R
θJA
Junction-to-Case
Junction-to-Ambient (PCB Mount)
Junction-to-Ambient
Typ.
Max.
2.3
50
110
Units
°C/W
gÃ
–––
–––
–––
2014-6-18
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IRLR/U8721PBF
Static @ T
J
= 25°C (unless otherwise specified)
Parameter
BV
DSS
∆ΒV
DSS
/∆T
J
R
DS(on)
V
GS(th)
∆V
GS(th)
I
DSS
I
GSS
gfs
Q
g
Q
gs1
Q
gs2
Q
gd
Q
godr
Q
sw
Q
oss
R
G
t
d(on)
t
r
t
d(off)
t
f
C
iss
C
oss
C
rss
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Gate Threshold Voltage Coefficient
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Forward Transconductance
Total Gate Charge
Pre-Vth Gate-to-Source Charge
Post-Vth Gate-to-Source Charge
Gate-to-Drain Charge
Gate Charge Overdrive
Switch Charge (Q
gs2
+ Q
gd
)
Output Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Parameter
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Min. Typ. Max. Units
30
–––
–––
–––
1.35
–––
–––
–––
–––
–––
46
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
21
6.3
10.1
1.9
-6.8
–––
–––
–––
–––
–––
8.5
1.9
1.2
3.4
2.0
4.6
7.9
2.3
8.8
30
9.4
6.5
1030
350
110
–––
–––
Conditions
V V
GS
= 0V, I
D
= 250µA
mV/°C Reference to 25°C, I
D
= 1mA
mΩ V
GS
= 10V, I
D
= 25A
8.4
11.8
V
GS
= 4.5V, I
D
= 20A
2.35
V V
DS
= V
GS
, I
D
= 25µA
––– mV/°C
1.0
150
100
-100
–––
13
–––
–––
–––
–––
–––
–––
3.8
–––
–––
–––
–––
–––
–––
–––
Typ.
–––
–––
–––
pF
nC
Ω
µA
nA
S
f
f
V
DS
= 24V, V
GS
= 0V
V
DS
= 24V, V
GS
= 0V, T
J
= 125°C
V
GS
= 20V
V
GS
= -20V
V
DS
= 15V, I
D
= 20A
V
DS
= 15V
V
GS
= 4.5V
I
D
= 20A
See Fig. 16
V
DS
= 16V, V
GS
= 0V
V
DD
= 15V, V
GS
= 4.5V
I
D
= 20A
nC
f
ns
R
G
= 1.8Ω
See Fig. 14
V
GS
= 0V
V
DS
= 15V
ƒ = 1.0MHz
Max.
93
20
6.5
Units
mJ
A
mJ
Avalanche Characteristics
E
AS
I
AR
E
AR
Ã
dh
–––
–––
–––
–––
–––
–––
–––
–––
17
24
Diode Characteristics
Parameter
I
S
I
SM
V
SD
t
rr
Q
rr
t
on
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode)
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Forward Turn-On Time
Min. Typ. Max. Units
65
f
Conditions
MOSFET symbol
showing the
integral reverse
G
D
A
Ãh
260
1.0
26
36
V
ns
nC
S
p-n junction diode.
T
J
= 25°C, I
S
= 20A, V
GS
= 0V
T
J
= 25°C, I
F
= 20A, V
DD
= 15V
di/dt = 300A/µs
f
f
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
2014-6-18
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IRLR/U8721PBF
1000
TOP
VGS
10V
8.0V
5.0V
4.5V
4.0V
3.5V
3.0V
2.7V
1000
TOP
VGS
10V
8.0V
5.0V
4.5V
4.0V
3.5V
3.0V
2.7V
ID, Drain-to-Source Current (A)
100
BOTTOM
ID, Drain-to-Source Current (A)
100
BOTTOM
10
10
2.7V
1
2.7V
Tj = 25°C
0.1
1
≤
60µs PULSE WIDTH
1
100
0.1
1
10
≤
60µs PULSE WIDTH
Tj = 175°C
10
0.1
100
V DS, Drain-to-Source Voltage (V)
V DS, Drain-to-Source Voltage (V)
Fig 1.
Typical Output Characteristics
Fig 2.
Typical Output Characteristics
1000
2.0
RDS(on) , Drain-to-Source On Resistance
(Normalized)
ID, Drain-to-Source Current (A)
ID = 25A
VGS = 10V
100
T J = 175°C
1.5
10
1
T J = 25°C
VDS = 15V
≤60µs
PULSE WIDTH
1.0
0.1
0
2
4
6
8
10
0.5
-60 -40 -20 0 20 40 60 80 100120140160180
T J , Junction Temperature (°C)
VGS, Gate-to-Source Voltage (V)
Fig 3.
Typical Transfer Characteristics
Fig 4.
Normalized On-Resistance
vs. Temperature
2014-6-18
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IRLR/U8721PBF
10000
VGS = 0V,
f = 1 MHZ
C iss = C gs + C gd, C ds SHORTED
C rss = C gd
C oss = C ds + C gd
5.0
ID= 20A
VGS, Gate-to-Source Voltage (V)
4.0
VDS= 24V
VDS= 15V
VDS= 6.0V
C, Capacitance (pF)
1000
Ciss
Coss
Crss
3.0
2.0
100
1.0
10
1
10
VDS, Drain-to-Source Voltage (V)
100
0.0
0
2
4
6
8
10
QG, Total Gate Charge (nC)
Fig 5.
Typical Capacitance vs.
Drain-to-Source Voltage
Fig 6.
Typical Gate Charge vs.
Gate-to-Source Voltage
1000
1000
OPERATION IN THIS AREA
LIMITED BY R DS(on)
100µsec
1msec
100
ID, Drain-to-Source Current (A)
ISD, Reverse Drain Current (A)
T J = 175°C
T J = 25°C
100
10
10
10msec
1
Tc = 25°C
Tj = 175°C
Single Pulse
0.1
0
1
10
100
1
VGS = 0V
0.1
0.0
0.5
1.0
1.5
2.0
VSD, Source-to-Drain Voltage (V)
VDS, Drain-to-Source Voltage (V)
Fig 7.
Typical Source-Drain Diode
Forward Voltage
Fig 8.
Maximum Safe Operating Area
2014-6-18
4
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IRLR/U8721PBF
70
60
ID, Drain Current (A)
2.5
VGS(th) , Gate Threshold Voltage (V)
Limited By Package
50
40
30
20
10
0
25
50
75
100
125
150
175
T C , Case Temperature (°C)
2.0
1.5
ID = 25µA
1.0
0.5
-75 -50 -25 0
25 50 75 100 125 150 175 200
T J , Temperature ( °C )
Fig 9.
Maximum Drain Current vs.
Case Temperature
Fig 10.
Threshold Voltage vs. Temperature
10
Thermal Response ( Z thJC ) °C/W
1
D = 0.50
0.20
0.10
0.05
0.02
0.01
τ
J
τ
J
τ
1
0.1
R
1
R
1
τ
2
R
2
R
2
R
3
R
3
τ
3
τ
C
τ
τ
3
Ri (°C/W)
τi
(sec)
0.3501 0.000072
1.1877
0.7635
0.001239
0.010527
τ
1
τ
2
0.01
SINGLE PULSE
( THERMAL RESPONSE )
1E-005
0.0001
Ci=
τi/Ri
Ci i/Ri
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
0.001
0.01
0.1
0.001
1E-006
t1 , Rectangular Pulse Duration (sec)
Fig 11.
Maximum Effective Transient Thermal Impedance, Junction-to-Case
2014-6-18
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