MADP-000208-13180W
SURMOUNT
TM
8m PIN Diode Pair
RoHS Compliant
Features
Surface Mount Device
8 µm I-Region Length Devices
Two PIN diodes in Flexible Configuration
No Wire bonds Required
Rugged Silicon-Glass Construction
Silicon Nitride Passivation
Polymer Scratch Protection
Low Parasitic Capacitance and Inductance
M/A-COM Products
Rev. V2
Outline Drawing
Description
The MADP-000208-13180W is a pair of silicon
glass PIN diodes incorporated onto one chip and
is fabricated using M/A-COM Technology Solutions
patented HMIC
TM
process. The device features
three silicon pedestals embedded in low loss, low
dispersion glass (k=4.1, Tanδ=0.002). The diodes
are formed on the top of pedestals and connections
to the backside of the device are made via elec-
trically conductive sidewalls. Selective backside
metallization is applied to produce a surface mount
device. This vertical topology provides for excep-
tional heat transfer and also allows the topside to be
fully encapsulated with silicon nitride. An additional
polymer layer is also added to provide scratch and
impact protection. These protective coatings pre-
vent damage to the junction and the anode air-
bridge during handling and assembly.
Bottom Side Contacts (Circuit Side)
Dim.
A
B
C
D
E
F
G
Inches
min
0.0440
0.0140
0.0045
0.0115
0.0055
0.0055
0.0115
max
0.0460
0.0160
0.0055
0.0125
0.0065
0.0065
0.0125
Millimeter
min
1.118
0.355
0.114
0.292
0.140
0.140
0.292
max
1.168
0.406
0.140
0.318
0.165
0.165
0.318
Applications
The MADP-000208-13180W packageless devices
are suitable for usage in high incident power, 44.8
dBm C.W at 2 GHz., series, shunt, or series-shunt
switches. The low parasitic inductance, < 0.12
nH, and excellent RC constant, make these de-
vices an attractive alternative for high frequency
switch elements when compared to their plastic
device counterparts.
Ordering Information
Part Number
MADP-000208-13180W
Package
200 pieces per tray
1
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MADP-000208-13180W
SURMOUNT
TM
8m PIN Diode Pair
RoHS Compliant
Electrical Specifications
1,2,3
: T
A
= +25°C
D1 - J1 to J3 & D2 - J3 to J4
Parameter
Capacitance (C
T
)
4
Resistance (R
S
)
Forward Voltage (V
F
)
4
Reverse Leakage Current (I
R
)
4
C.W. Thermal Resistance (R
θJL
)
Lifetime (T
L
)
1.
2.
3.
4.
M/A-COM Products
Rev. V2
Test Conditions
-10 V, 1 MHz
+10 mA, 1 GHz
+100 mA, 1 GHz
+5 mA
+100 mA
| -90V |
Units
pF
Ω
V
µA
°C/W
Min.
—
—
—
—
—
—
—
—
Typ.
0.81
0.40
0.30
0.78
1.00
—
58
0.5
Max.
0.90
0.62
0.52
0.90
1.1
10
—
—
+10 mA / -6 mA ( 50% - 90% V )
µS
Total capacitance (C
T
), is equivalent to the sum of Junction Capacitance (C
J
) and Parasitic Capacitance (C
PAR
)
Series resistance (R
S
) is equivalent to the total diode resistance: R
S
= R
J
(Junction Resistance) + R
C
(Ohmic Resistance)
R
S
is measured on an HP4291A Impedance Analyzer with die mounted in an ODS-186 package using Sn60/Pb40 solder.
On wafer measurement.
Absolute Maximum Ratings
Parameter
Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Junction Temperature
C.W. Incident Power
Mounting Temperature
for RoHS Solders
Absolute Maximum
500 mA
- 90 V
-55 °C to +125°C
-55 °C to +150°C
+175°C
44.8 dBm @ 2 GHz
+260 °C for 10 seconds
Application Schematic
D2
D1
J4
J3
J1
2
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MADP-000208-13180W
SURMOUNT
TM
8m PIN Diode Pair
RoHS Compliant
Typical Performance Curves @ 25°C
Resistance vs. Frequency @ 5, 10 & 20 mA
0.8
0.7
0.6
5 mA
10 mA
20 mA
M/A-COM Products
Rev. V2
Resistance vs. Forward Current @ 30, 500, 1000 MHz
0.7
0.6
30 MHz
500 MHz
1000 MHz
0.5
0.5
0.4
0.4
0.3
0.2
0.0
0.3
0.5
1.0
1.5
2.0
0.2
0.0
20.0
40.0
60.0
80.0
100.0
Frequency (GHz)
Current (mA)
Capacitance vs. Frequency @ 10 & 40 V
0.90
Capacitance vs. Voltage @ 30, 500, 1000 MHz
0.90
0.85
0.85
0.80
0.80
0.75
10 Volts
40 Volts
0.75
30 MHz
500 MHz
1000 MHz
0.70
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0.70
0
8
16
24
32
40
Frequency (GHz)
Voltage (V)
Series Inductance vs. Frequency @ 5, 10 & 20 mA
0.12
0.10
Series Inductance vs. Forward Current @ 500 & 1000 MHz
0.12
0.11
0.08
0.06
0.04
0.02
0.00
0.0
0.08
5 mA
10 mA
20 mA
0.10
500 MHz
1000 MHz
0.09
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0
20
40
60
80
100
3
Frequency (GHz)
I (mA)
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MADP-000208-13180W
SURMOUNT
TM
8m PIN Diode Pair
RoHS Compliant
Die Handling and Mounting Information
Handling:
All semiconductor chips should be handled with care to avoid damage or contamination
from perspiration, salts, and skin oils. The use of plastic tipped tweezers or vacuum pickups is
strongly recommended for individual components. Bulk handling should ensure that abrasion and
mechanical shock are minimized.
Electro-Static Sensitivity:
The MADP-000208-13108W Diode Pair are ESD, Class 1A sensitive
(HBM). Proper ESD precautions should be taken.
Die Attach Surface:
Die can be mounted with an 80Au/Sn20, eutectic solder preform, RoHS
compliant solders or electrically conductive silver epoxy. The metal RF and D.C. ground plane
mounting surface must be free of contamination and should have a surface flatness of < ±0.002”.
Eutectic Die Attachment Using Hot Gas Die Bonder:
A work surface temperature of 255
o
C is
recommended. When hot forming gas is applied, the temperature should be approximately 290
o
C.
The chip should not be exposed to temperatures greater than 320
o
C for more than 10 seconds.
Eutectic Die Attachment Using Reflow Oven:
Please visit the
www.macomtech.com
and see
Application Note M538,
“Surface Mounting Instructions” for the recommended time-temperature
profile.
Electrically Conductive Epoxy Die Attachment:
A controlled amount of electrically conductive,
silver epoxy, approximately 1–2 mils in thickness, should be used to minimize ohmic and thermal
resistance. A thin epoxy fillet should be visible around the perimeter of the bond pad after placement
to ensure full area coverage. Cure conductive epoxy per manufacturer’s schedule. Typically 150°C
for 1 hour.
M/A-COM Products
Rev. V2
4
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
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