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IDT7200L12TPG

产品描述FIFO, 256X9, 12ns, Asynchronous, CMOS, PDIP28, GREEN, PLASTIC, DIP-28
产品类别存储    存储   
文件大小301KB,共14页
制造商IDT (Integrated Device Technology)
标准
下载文档 详细参数 选型对比 全文预览

IDT7200L12TPG概述

FIFO, 256X9, 12ns, Asynchronous, CMOS, PDIP28, GREEN, PLASTIC, DIP-28

IDT7200L12TPG规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
零件包装代码DIP
包装说明DIP, DIP28,.3
针数28
Reach Compliance Codecompli
ECCN代码EAR99
最长访问时间12 ns
其他特性RETRANSMIT
最大时钟频率 (fCLK)50 MHz
周期时间20 ns
JESD-30 代码R-PDIP-T28
JESD-609代码e3
长度34.671 mm
内存密度2304 bi
内存集成电路类型OTHER FIFO
内存宽度9
功能数量1
端子数量28
字数256 words
字数代码256
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织256X9
可输出NO
封装主体材料PLASTIC/EPOXY
封装代码DIP
封装等效代码DIP28,.3
封装形状RECTANGULAR
封装形式IN-LINE
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
电源5 V
认证状态Not Qualified
座面最大高度4.572 mm
最大待机电流0.005 A
最大压摆率0.08 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装NO
技术CMOS
温度等级COMMERCIAL
端子面层Matte Tin (Sn) - annealed
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度7.62 mm
Base Number Matches1

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CMOS ASYNCHRONOUS FIFO
256 x 9, 512 x 9 and 1,024 x 9
FEATURES:
IDT7200L
IDT7201LA
IDT7202LA
First-In/First-Out dual-port memory
256 x 9 organization (IDT7200)
512 x 9 organization (IDT7201)
1,024 x 9 organization (IDT7202)
Low power consumption
— Active: 440mW (max.)
—Power-down: 28mW (max.)
Ultra high speed—12ns access time
Asynchronous and simultaneous read and write
Fully expandable by both word depth and/or bit width
720x family is pin and functionally compatible from 256 x 9 to 64k x 9
Status Flags: Empty, Half-Full, Full
Auto-retransmit capability
High-performance CEMOS™ technology
Military product compliant to MIL-STD-883, Class B
Standard Military Drawing #5962-87531, 5962-89666, 5962-89863
and 5962-89536 are listed on this function
Dual versions available in the TSSOP package. For more informa-
tion, see IDT7280/7281/7282 data sheet
IDT7280 = 2 x IDT7200
IDT7281 = 2 x IDT7201
IDT7282 = 2 x IDT7202
Industrial temperature range (–40
o
C to +85
o
C) is available
(plastic packages only)
Green parts available, see ordering information
DESCRIPTION:
The IDT7200/7201/7202 are dual-port memories that load and empty data
on a first-in/first-out basis. The devices use Full and Empty flags to prevent data
overflow and underflow and expansion logic to allow for unlimited expansion
capability in both word size and depth.
The reads and writes are internally sequential through the use of ring
pointers, with no address information required to load and unload data. Data
is toggled in and out of the devices through the use of the Write (W) and Read
(R) pins.
The devices utilize a 9-bit wide data array to allow for control and parity bits
at the user’s option. This feature is especially useful in data communications
applications where it is necessary to use a parity bit for transmission/reception
error checking. It also features a Retransmit (RT) capability that allows for reset
of the read pointer to its initial position when
RT
is pulsed LOW to allow for
retransmission from the beginning of data. A Half-Full Flag is available in the
single device mode and width expansion modes.
These FIFOs are fabricated using high-speed CMOS technology. They
are designed for those applications requiring asynchronous and simultaneous
read/writes in multiprocessing and rate buffer applications. Military grade
product is manufactured in compliance with MIL-STD-883, Class B.
FUNCTIONAL BLOCK DIAGRAM
DATA INPUTS
(D
0
-D
8
)
W
WRITE
CONTROL
WRITE
POINTER
RAM
ARRAY
256 x 9
512 x 9
1,024 x 9
READ
POINTER
R
READ
CONTROL
THREE-
STATE
BUFFERS
DATA OUTPUTS
(Q
0
-Q
8
)
RS
RESET
LOGIC
FL/RT
FLAG
LOGIC
EXPANSION
LOGIC
EF
FF
XI
XO/HF
2679 drw 01
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
COMMERCIAL, INDUSTRIAL AND MILITARY TEMPERATURE RANGES
1
©2012
Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
JUNE 2012
DSC-2679/13

IDT7200L12TPG相似产品对比

IDT7200L12TPG IDT7201LA15SOGI8 IDT7201LA15SOGI IDT7202LA15PDGI IDT7202LA12PDG IDT7202LA50JG IDT7200L15TPGI
描述 FIFO, 256X9, 12ns, Asynchronous, CMOS, PDIP28, GREEN, PLASTIC, DIP-28 FIFO, 512X9, 15ns, Asynchronous, CMOS, PDSO28, PLASTIC, SOIC-28 FIFO, 512X9, 15ns, Asynchronous, CMOS, PDSO28, GREEN, SOIC-28 FIFO, 1KX9, 15ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, GREEN, PLASTIC, DIP-28 FIFO, 1KX9, 12ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, GREEN, PLASTIC, DIP-28 FIFO, 1KX9, 50ns, Asynchronous, CMOS, PQCC32, GREEN, PLASTIC, LCC-32 FIFO, 256X9, 15ns, Asynchronous, CMOS, PDIP28, GREEN, PLASTIC, DIP-28
是否无铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合
零件包装代码 DIP SOIC SOIC DIP DIP QFJ DIP
包装说明 DIP, DIP28,.3 SOP, SOP, DIP, DIP28,.6 DIP, DIP28,.6 QCCJ, DIP, DIP28,.3
针数 28 28 28 28 28 32 28
Reach Compliance Code compli compliant compliant compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 12 ns 15 ns 15 ns 15 ns 12 ns 50 ns 15 ns
其他特性 RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT
周期时间 20 ns 25 ns 25 ns 25 ns 20 ns 65 ns 25 ns
JESD-30 代码 R-PDIP-T28 R-PDSO-G28 R-PDSO-G28 R-PDIP-T28 R-PDIP-T28 R-PQCC-J32 R-PDIP-T28
JESD-609代码 e3 e3 e3 e3 e3 e3 e3
长度 34.671 mm 18.3642 mm 18.3642 mm 36.576 mm 36.576 mm 13.97 mm 34.671 mm
内存密度 2304 bi 4608 bit 4608 bit 9216 bit 9216 bit 9216 bit 2304 bit
内存宽度 9 9 9 9 9 9 9
功能数量 1 1 1 1 1 1 1
端子数量 28 28 28 28 28 32 28
字数 256 words 512 words 512 words 1024 words 1024 words 1024 words 256 words
字数代码 256 512 512 1000 1000 1000 256
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 85 °C 85 °C 85 °C 70 °C 70 °C 85 °C
最低工作温度 - -40 °C -40 °C -40 °C - - -40 °C
组织 256X9 512X9 512X9 1KX9 1KX9 1KX9 256X9
可输出 NO NO NO NO NO NO NO
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 DIP SOP SOP DIP DIP QCCJ DIP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE SMALL OUTLINE SMALL OUTLINE IN-LINE IN-LINE CHIP CARRIER IN-LINE
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) NOT SPECIFIED 260 260 260 260 260 NOT SPECIFIED
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 4.572 mm 3.048 mm 3.048 mm 4.699 mm 4.699 mm 3.55 mm 4.572 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO YES YES NO NO YES NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL
端子面层 Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed
端子形式 THROUGH-HOLE GULL WING GULL WING THROUGH-HOLE THROUGH-HOLE J BEND THROUGH-HOLE
端子节距 2.54 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm
端子位置 DUAL DUAL DUAL DUAL DUAL QUAD DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED 30 30 30 30 30 NOT SPECIFIED
宽度 7.62 mm 8.763 mm 8.763 mm 15.24 mm 15.24 mm 11.43 mm 7.62 mm
Base Number Matches 1 1 1 1 1 1 1
最大时钟频率 (fCLK) 50 MHz - - 40 MHz 50 MHz - 40 MHz
内存集成电路类型 OTHER FIFO - - OTHER FIFO OTHER FIFO - OTHER FIFO
封装等效代码 DIP28,.3 - - DIP28,.6 DIP28,.6 - DIP28,.3
电源 5 V - - 5 V 5 V - 5 V
最大待机电流 0.005 A - - 0.005 A 0.005 A - 0.005 A
最大压摆率 0.08 mA - - 0.08 mA 0.08 mA - 0.08 mA
厂商名称 - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
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