(Note 3) ........................... (GND –0.3V) to (OV
DD
+ 0.3V)
Digital Output Voltage
(Note 3) ........................... (GND –0.3V) to (OV
DD
+ 0.3V)
Power Dissipation .............................................. 500mW
Operating Temperature Range
LTC2380C ................................................ 0°C to 70°C
LTC2380I .............................................–40°C to 85°C
LTC2380H .......................................... –40°C to 125°C
Storage Temperature Range .................. –65°C to 150°C
PIN CONFIGURATION
TOP VIEW
CHAIN
V
DD
GND
IN
+
IN
–
GND
REF
REF/DGC
1
2
3
4
5
6
7
8
17
GND
16 GND
15 OV
DD
14 SDO
13 SCK
12 RDL/SDI
11 BUSY
10 GND
9 CNV
TOP VIEW
CHAIN
V
DD
GND
IN
+
IN
–
GND
REF
REF/DGC
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
GND
OV
DD
SDO
SCK
RDL/SDI
BUSY
GND
CNV
DE PACKAGE
16-LEAD (4mm
×
3mm) PLASTIC DFN
T
JMAX
= 150°C,
θ
JA
= 40°C/W
EXPOSED PAD (PIN 17) IS GND, MUST BE SOLDERED TO PCB
MS PACKAGE
16-LEAD PLASTIC MSOP
T
JMAX
= 150°C,
θ
JA
= 110°C/W
ORDER INFORMATION
LEAD FREE FINISH
LTC2380CMS-16#PBF
LTC2380IMS-16#PBF
LTC2380HMS-16#PBF
LTC2380CDE-16#PBF
LTC2380IDE-16#PBF
TAPE AND REEL
LTC2380CMS-16#TRPBF
LTC2380IMS-16#TRPBF
LTC2380HMS-16#TRPBF
LTC2380CDE-16#TRPBF
LTC2380IDE-16#TRPBF
PART MARKING*
238016
238016
238016
23806
23806
PACKAGE DESCRIPTION
16-Lead Plastic MSOP
16-Lead Plastic MSOP
16-Lead Plastic MSOP
16-Lead (4mm
×
3mm) Plastic DFN
16-Lead (4mm
×
3mm) Plastic DFN
TEMPERATURE RANGE
0°C to 70°C
–40°C to 85°C
–40°C to 125°C
0°C to 70°C
–40°C to 85°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to:
http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to:
http://www.linear.com/tapeandreel/
238016fa
2
LTC2380-16
The
l
denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at T
A
= 25°C. (Note 4)
SYMBOL
V
IN
+
V
IN
–
V
IN
+ – V
IN
–
V
CM
I
IN
C
IN
CMRR
PARAMETER
Absolute Input Range (IN
+
)
Absolute Input Range (IN
–
)
Input Differential Voltage Range
Common-Mode Input Range
Analog Input Leakage Current
Analog Input Capacitance
Input Common Mode Rejection Ratio
Sample Mode
Hold Mode
f
IN
= 1MHz
CONDITIONS
(Note 5)
(Note 5)
V
IN
= V
IN
+ – V
IN
–
l
l
l
l
l
ELECTRICAL CHARACTERISTICS
MIN
–0.05
–0.05
–V
REF
V
REF
/2–
0.1
TYP
MAX
V
REF
+ 0.05
V
REF
+ 0.05
+V
REF
UNITS
V
V
V
V
μA
pF
pF
dB
V
REF
/2
V
REF
/2+
0.1
±1
45
5
83
The
l
denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at T
A
= 25°C. (Note 4)
SYMBOL PARAMETER
Resolution
No Missing Codes
Transition Noise
INL
DNL
BZE
FSE
Integral Linearity Error
Differential Linearity Error
Bipolar Zero-Scale Error
Bipolar Zero-Scale Error Drift
Bipolar Full-Scale Error
Bipolar Full-Scale Error Drift
(Note 7)
l
CONVERTER CHARACTERISTICS
CONDITIONS
l
l
l
l
l
MIN
16
16
TYP
MAX
UNITS
Bits
Bits
0.15
(Note 6)
(Note 7)
–0.6
–0.5
–4
–13
±0.2
±0.1
0
1
±2
±0.05
13
0.6
0.5
4
LSB
RMS
LSB
LSB
LSB
mLSB/°C
LSB
ppm/°C
DYNAMIC ACCURACY
SYMBOL PARAMETER
SINAD
SNR
The
l
denotes the specifications which apply over the full operating temperature range,
otherwise specifications are at T
A
= 25°C and A
IN
= –1dBFS. (Notes 4, 8)
CONDITIONS
f
IN
= 2kHz, V
REF
= 5V
f
IN
= 2kHz, V
REF
= 5V
f
IN
= 2kHz, V
REF
= 5V, REF/DGC = GND
f
IN
= 2kHz, V
REF
= 2.5V
f
IN
= 2kHz, V
REF
= 5V
f
IN
= 2kHz, V
REF
= 5V, REF/DGC = GND
f
IN
= 2kHz, V
REF
= 2.5V
f
IN
= 2kHz
l
l
l
l
l
l
l
MIN
93.8
94.4
93.4
90.6
TYP
96
96.2
95.3
93.4
–117
–114
–103
118
34
500
4
MAX
UNITS
dB
dB
dB
dB
Signal-to-(Noise + Distortion) Ratio
Signal-to-Noise Ratio
THD
Total Harmonic Distortion
–103
–101
–95
dB
dB
dB
dB
MHz
ps
ps
ns
SFDR
Spurious Free Dynamic Range
–3dB Input Bandwidth
Aperture Delay
Aperture Jitter
Transient Response
Full-Scale Step
165
238016fa
3
LTC2380-16
REFERENCE INPUT
SYMBOL
V
REF
I
REF
V
IHDGC
V
ILDGC
PARAMETER
Reference Voltage
Reference Input Current
High Level Input Voltage REF/DGC Pin
Low Level Input Voltage REF/DGC Pin
The
l
denotes the specifications which apply over the full operating temperature range, otherwise
specifications are at T
A
= 25°C. (Note 4)
CONDITIONS
(Note 5)
(Note 9)
l
l
l
l
MIN
2.5
TYP
1.2
MAX
5.1
1.4
0.2V
REF
UNITS
V
mA
V
V
0.8V
REF
The
l
denotes the specifications which apply over the
full operating temperature range, otherwise specifications are at T
A
= 25°C. (Note 4)
SYMBOL PARAMETER
V
IH
V
IL
I
IN
C
IN
V
OH
V
OL
I
OZ
I
SOURCE
I
SINK
High Level Input Voltage
Low Level Input Voltage
Digital Input Current
Digital Input Capacitance
High Level Output Voltage
Low Level Output Voltage
Hi-Z Output Leakage Current
Output Source Current
Output Sink Current
I
O
= –500μA
I
O
= 500μA
V
OUT
= 0V to OV
DD
V
OUT
= 0V
V
OUT
= OV
DD
l
l
l
DIGITAL INPUTS AND DIGITAL OUTPUTS
CONDITIONS
MIN
l
l
TYP
MAX
0.2 • OV
DD
UNITS
V
V
μA
pF
V
0.8 • OV
DD
–10
5
OV
DD
– 0.2
0.2
–10
–10
10
10
10
V
IN
= 0V to OV
DD
l
V
μA
mA
mA
POWER REQUIREMENTS
SYMBOL
V
DD
OV
DD
I
VDD
I
OVDD
I
PD
I
PD
P
D
PARAMETER
Supply Voltage
Supply Voltage
Supply Current
Supply Current
Power Down Mode
Power Down Mode
Power Dissipation
Power Down Mode
Power Down Mode
The
l
denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at T
A
= 25°C. (Note 4)
CONDITIONS
l
l
l
l
l
MIN
2.375
1.71
TYP
2.5
7.5
1.1
0.9
0.9
19
2.25
2.25
MAX
2.625
5.25
8.8
90
140
22
225
315
UNITS
V
V
mA
mA
μA
μA
mW
μW
μW
2Msps Sample Rate
2Msps Sample Rate (C
L
= 20pF)
Conversion Done (I
VDD
+ I
OVDD
+ I
REF
)
Conversion Done (I
VDD
+ I
OVDD
+ I
REF
, H-Grade)
2Msps Sample Rate
Conversion Done (I
VDD
+ I
OVDD
+ I
REF
)
Conversion Done (I
VDD
+ I
OVDD
+ I
REF
, H-Grade)
ADC TIMING CHARACTERISTICS
SYMBOL
f
SMPL
t
CONV
t
ACQ
t
CYC
t
CNVH
t
BUSYLH
t
CNVL
t
QUIET
t
SCK
t
SCKH
PARAMETER
Maximum Sampling Frequency
Conversion Time
Acquisition Time
Time Between Conversions
CNV High Time
CNV↑ to BUSY Delay
Minimum Low Time for CNV
SCK Quiet Time from CNV↑
SCK Period
SCK High Time
The
l
denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at T
A
= 25°C. (Note 4)
CONDITIONS
l
l
MIN
278
165
500
20
TYP
MAX
2
322
UNITS
Msps
ns
ns
ns
ns
t
ACQ
= t
CYC
– t
CONV
– t
BUSYLH
(Note 10)
l
l
l
l
l
l
l
l
C
L
= 20pF
(Note 11)
(Note 10)
(Notes 11, 12)
13
20
10
10
4
ns
ns
ns
ns
ns
238016fa
4
LTC2380-16
ADC TIMING CHARACTERISTICS
SYMBOL
t
SCKL
t
SSDISCK
t
HSDISCK
t
SCKCH
t
DSDO
t
HSDO
t
DSDOBUSYL
t
EN
t
DIS
PARAMETER
SCK Low Time
SDI Setup Time From SCK↑
SDI Hold Time From SCK↑
SCK Period in Chain Mode
SDO Data Valid Delay from SCK↑
SDO Data Remains Valid Delay from SCK↑
SDO Data Valid Delay from BUSY↓
Bus Enable Time After RDL↓
Bus Relinquish Time After RDL↑
(Note 11)
(Note 11)
t
SCKCH
= t
SSDISCK
+ t
DSDO
(Note 11)
C
L
= 20pF (Note 11)
C
L
= 20pF (Note 10)
C
L
= 20pF (Note 10)
(Note 11)
(Note 11)
The
l
denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at T
A
= 25°C. (Note 4)
CONDITIONS
l
l
l
l
l
l
l
l
l
MIN
4
4
1
13.5
TYP
MAX
UNITS
ns
ns
ns
ns
9.5
1
5
16
13
ns
ns
ns
ns
ns
Note 1:
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may effect device
reliability and lifetime.
Note 2:
All voltage values are with respect to ground.
Note 3:
When these pin voltages are taken below ground or above REF or
OV
DD
, they will be clamped by internal diodes. This product can handle
input currents up to 100mA below ground or above REF or OV
DD
without
latch-up.
Note 4:
V
DD
= 2.5V, OV
DD
= 2.5V, REF = 5V, V
CM
= 2.5V, f
SMPL
= 2MHz,
REF/DGC = V
REF
.
Note 5:
Recommended operating conditions.
Note 6:
Integral nonlinearity is defined as the deviation of a code from a
straight line passing through the actual endpoints of the transfer curve.
The deviation is measured from the center of the quantization band.
Note 7:
Bipolar zero-scale error is the offset voltage measured from
–0.5LSB when the output code flickers between 0000 0000 0000 0000 and
1111 1111 1111 1111. Full-scale bipolar error is the worst-case of –FS
or +FS untrimmed deviation from ideal first and last code transitions and
includes the effect of offset error.
Note 8:
All specifications in dB are referred to a full-scale ±5V input with a
5V reference voltage.
Note 9:
f
SMPL
= 2MHz, I
REF
varies proportionately with sample rate.
Note 10:
Guaranteed by design, not subject to test.
Note 11:
Parameter tested and guaranteed at OV
DD
= 1.71V, OV
DD
= 2.5V
and OV
DD
= 5.25V.
Note 12:
t
SCK
of 10ns maximum allows a shift clock frequency up to
100MHz for rising capture.
0.8*OV
DD
0.2*OV
DD
t
DELAY
0.8*OV
DD
0.2*OV
DD
t
DELAY
0.8*OV
DD
0.2*OV
DD
50%
t
WIDTH
50%
238016 F01
Figure 1. Voltage Levels for Timing Specifications
射频识别(Radio Frequency Identification，RFID)技术是一种利用无线射频通信实现的非接触式自动识别技术，与目前广泛采用的条形码技术相比，RFID具有容量大、识别距离远、穿透能力强、抗污性强等特点。RFID技术已经发展得比较成熟并获得了大规模商用，但超高频RFID技术相对滞后。本文分析了射频芯片nRF9E5的功能特性，并将其用于RFID系统中，设计了一套有源超高频(...[详细]
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