F-209-1
SEAM–30–02.0–S–06–2–A–GP–K–TR
SEAM–20–01–S–06–2–RA–GP–TR
OPEN PIN FIELD ARRAY
Mates with:
SEAF-RA, SADL, SEAF
SEAM-RA,
SEAM-GP SERIES
SEAM
NO. PINS
PER ROW
01
PLATING
OPTION
NO. OF
ROWS
2
RA
OPTION
TR
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?SEAM
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Current Rating:
Testing Now!
Operating Temp Range:
-55°C to +125°C
Plating:
Au over 50µ" (1,27µm) Ni
Contact Resistance:
Testing Now!
Working Voltage:
Testing Now!
RoHS Compliant:
Yes
– 04
– 20, – 30,
–40, –50
NUMBER PINS
PER ROW
–20
–30
–40
–50
– GP
–2
= Lead-Free
Tin Alloy
95.5% Sn/
3.8% Ag/
0.7% Cu
Solder
Charge
= Guide
Post
–L
= 10µ" (0,25µm)
Gold on contact area,
Matte Tin on solder tail
=Four
Rows
– TR
=Tape &
Reel
– 06
=Six
Rows
–K
= (7,49mm)
.295" DIA
Polyimide
film
Pick &
Place Pad
–S
A
(38,94) 1.533
(51,64) 2.033
(64,34) 2.533
(77,04) 3.033
= 30µ" (0,76µm)
Gold on contact area,
Matte Tin on solder tail
Processing:
Max Processing Temp:
230°C for 60 seconds, or 260°C
for 20 seconds 3x
Lead-Free Solderable:
Yes
–GP= No. of positions x (1,27) .050 + (19,56) 0.77
6)
Without –GP= No. of positions x (1,27) .050
+ (11,18) 0.44
ositions (1
50
A
(5,36)
.211
(1,60)
.063
(8,13)
8,1
.320
(19,30) .760
9,30) 60
(12,32)
2,32)
.485
4
(7,91)
.312
(0,64)
.025
ALSO
AVAILABLE
Tin-Lead Solder Charge.
Call Samtec.
Note:
Some sizes, styles and
options are non-standard,
non-returnable.
(1,27)
.050
(3,05).120 DIA
Mates with:
SEAF-RA-GP
SEAM
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?SEAM-GP
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Current Rating:
2.7 A
Operating Temp Range:
-55°C to +125°C
Plating:
Au over 50µ" (1,27µm) Ni
Contact Resistance:
5.5 mΩ
Working Voltage:
240 VAC
Mated Cycles:
100
RoHS Compliant:
Yes
NO. PINS
PER ROW
02.0
PLATING
OPTION
NO. OF
ROWS
2
A
GP
K
TR
–K
– 04
– 20, – 30,
–40, –50
–L
= 10µ" (0,25µm)
Gold on contact area,
Matte Tin on solder tail
=Four
Rows
–2
= Lead-Free Tin Alloy
95.5% Sn/3.8%
Ag/0.7% Cu
Solder Charge
= Polyimide
film Pick &
Place Pad
– 06
=Six
Rows
– TR
=Tape & Reel
(Not available
with 50
positions)
–S
= 30µ" (0,76µm)
Gold on contact area,
Matte Tin on solder tail
(3,05)
.120
DIA
No. of positions x (1,27) .050 + (19,46) .766
(8,13)
.320 (12,65)
.498
06
Processing:
Max Processing Temp:
230°C for 60 seconds, or
260°C for 20 seconds 3x
Lead-Free Solderable:
Yes
Note:
Some sizes, styles and
options are non-standard,
non-returnable.
(5,54)
.218
(4,60)
.181
01
(1,27)
.050
(1,27)
.050
(0,86)
(1,12) .044 DIA
.034 DIA
No. of positions x
(1,27) .050 + (3,58) .141
(0,51)
.020 (1,02)
SQ .040
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