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MJ21193_13

产品描述Silicon Power Transistors 16 AMP COMPLEMENTARY SILICON POWER TRANSISTORS
文件大小122KB,共6页
制造商ON Semiconductor(安森美)
官网地址http://www.onsemi.cn
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MJ21193_13概述

Silicon Power Transistors 16 AMP COMPLEMENTARY SILICON POWER TRANSISTORS

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MJ21193 - PNP
MJ21194 - NPN
Silicon Power Transistors
The MJ21193 (PNP) and MJ21194 (NPN) utilize Perforated Emitter
technology and are specifically designed for high power audio output,
disk head positioners and linear applications.
Features
http://onsemi.com
Total Harmonic Distortion Characterized
High DC Current Gain
Excellent Gain Linearity
High SOA
These Devices are Pb−Free and are RoHS Compliant*
16 AMP COMPLEMENTARY
SILICON POWER
TRANSISTORS
250 VOLTS, 250 WATTS
SCHEMATIC
PNP
NPN
CASE 3
MAXIMUM RATINGS
Rating
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
Collector−Emitter Voltage
1.5 V
Collector Current
Continuous
Collector Current
Peak (Note 1)
Base Current
Continuous
Total Power Dissipation @ T
C
= 25°C
Derate Above 25°C
Operating and Storage Junction
Temperature Range
Symbol
V
CEO
V
CBO
V
EBO
V
CEX
I
C
I
CM
I
B
P
D
T
J
, T
stg
Value
250
400
5
400
16
30
5
250
1.43
65 to +200
Unit
Vdc
Vdc
Vdc
Vdc
Adc
Adc
Adc
W
W/°C
°C
1
BASE
CASE 3
1
BASE
EMITTER 2
EMITTER 2
3
MARKING
DIAGRAM
1
2
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Pulse Test: Pulse Width = 5
ms,
Duty Cycle
10%. (continued)
TO−204AA (TO−3)
CASE 1−07
STYLE 1
MJ2119xG
AYYWW
MEX
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Case
Symbol
R
qJC
Max
0.7
Unit
°C/W
MJ2119x = Device Code
x = 3 or 4
G
= Pb−Free Package
A
= Assembly Location
YY
= Year
WW
= Work Week
MEX
= Country of Origin
ORDERING INFORMATION
Device
MJ21193G
MJ21194G
Package
TO−3
(Pb−Free)
TO−3
(Pb−Free)
Shipping
100 Units / Tray
100 Units / Tray
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2013
September, 2013
Rev. 6
1
Publication Order Number:
MJ21193/D

 
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