ZBT SRAM, 256KX32, 9ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | ALSC [Alliance Semiconductor Corporation] |
零件包装代码 | QFP |
包装说明 | LQFP, |
针数 | 100 |
Reach Compliance Code | unknown |
ECCN代码 | 3A991.B.2.A |
最长访问时间 | 9 ns |
其他特性 | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
JESD-30 代码 | R-PQFP-G100 |
JESD-609代码 | e0 |
长度 | 20 mm |
内存密度 | 8388608 bit |
内存集成电路类型 | ZBT SRAM |
内存宽度 | 32 |
功能数量 | 1 |
端子数量 | 100 |
字数 | 262144 words |
字数代码 | 256000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 256KX32 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LQFP |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK, LOW PROFILE |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED |
认证状态 | Not Qualified |
座面最大高度 | 1.6 mm |
最大供电电压 (Vsup) | 3.465 V |
最小供电电压 (Vsup) | 3.135 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | TIN LEAD |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 14 mm |
AS7C33256NTD32A-166HTQI | AS7C33256NTD32A-150TQC | AS7C33256NTD36A-166HTQC | AS7C33256NTD32A-100TQC | AS7C33256NTD32A-150TQI | AS7C33256NTD32A-166HTQC | AS7C33256NTD36A-166HTQI | AS7C33256NTD36A-150TQI | AS7C33256NTD36A-150TQC | |
---|---|---|---|---|---|---|---|---|---|
描述 | ZBT SRAM, 256KX32, 9ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | ZBT SRAM, 256KX32, 10ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | ZBT SRAM, 256KX36, 9ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | ZBT SRAM, 256KX32, 12ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | ZBT SRAM, 256KX32, 10ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | ZBT SRAM, 256KX32, 9ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | ZBT SRAM, 256KX36, 9ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | ZBT SRAM, 256KX36, 10ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | ZBT SRAM, 256KX36, 10ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP |
包装说明 | LQFP, | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | LQFP, | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 |
针数 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
最长访问时间 | 9 ns | 10 ns | 9 ns | 12 ns | 10 ns | 9 ns | 9 ns | 10 ns | 10 ns |
其他特性 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
JESD-30 代码 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm |
内存密度 | 8388608 bit | 8388608 bit | 9437184 bit | 8388608 bit | 8388608 bit | 8388608 bit | 9437184 bit | 9437184 bit | 9437184 bit |
内存集成电路类型 | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM |
内存宽度 | 32 | 32 | 36 | 32 | 32 | 32 | 36 | 36 | 36 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 85 °C | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C | 70 °C |
组织 | 256KX32 | 256KX32 | 256KX36 | 256KX32 | 256KX32 | 256KX32 | 256KX36 | 256KX36 | 256KX36 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
最大供电电压 (Vsup) | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
最小供电电压 (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
端子面层 | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
厂商名称 | ALSC [Alliance Semiconductor Corporation] | - | - | - | - | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] |
I/O 类型 | - | COMMON | COMMON | COMMON | COMMON | COMMON | - | COMMON | COMMON |
输出特性 | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE |
封装等效代码 | - | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | - | QFP100,.63X.87 | QFP100,.63X.87 |
电源 | - | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | - | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V |
最大待机电流 | - | 0.03 A | 0.03 A | 0.03 A | 0.03 A | 0.03 A | - | 0.03 A | 0.03 A |
最小待机电流 | - | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | - | 3.14 V | 3.14 V |
最大压摆率 | - | 0.425 mA | 0.475 mA | 0.3 mA | 0.425 mA | 0.475 mA | - | 0.425 mA | 0.425 mA |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved