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IDT71V2548S150BG: 产品描述ZBT SRAM, 256KX18, 3.8ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, MS-028AA, BGA-119; 产品类别存储存储; 文件大小513KB，共28页; 制造商IDT (Integrated Device Technology)

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IDT71V2548S150BG概述

ZBT SRAM, 256KX18, 3.8ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, MS-028AA, BGA-119

IDT71V2548S150BG规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	IDT (Integrated Device Technology)
零件包装代码	BGA
包装说明	14 X 22 MM, PLASTIC, MS-028AA, BGA-119
针数	119
Reach Compliance Code	not_compliant
ECCN代码	3A991.B.2.A
最长访问时间	3.8 ns
其他特性	PIPELINED ARCHITECTURE
最大时钟频率 (fCLK)	150 MHz
I/O 类型	COMMON
JESD-30 代码	R-PBGA-B119
JESD-609代码	e0
长度	22 mm
内存密度	4718592 bit
内存集成电路类型	ZBT SRAM
内存宽度	18
湿度敏感等级	3
功能数量	1
端子数量	119
字数	262144 words
字数代码	256000
工作模式	SYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	256KX18
输出特性	3-STATE
封装主体材料	PLASTIC/EPOXY
封装代码	BGA
封装等效代码	BGA119,7X17,50
封装形状	RECTANGULAR
封装形式	GRID ARRAY
并行/串行	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	2.5,3.3 V
认证状态	Not Qualified
座面最大高度	2.36 mm
最大待机电流	0.04 A
最小待机电流	3.14 V
最大压摆率	0.325 mA
最大供电电压 (Vsup)	3.465 V
最小供电电压 (Vsup)	3.135 V
标称供电电压 (Vsup)	3.3 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	Tin/Lead (Sn63Pb37)
端子形式	BALL
端子节距	1.27 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	14 mm

IDT71V2548S150BG相似产品对比

	IDT71V2548S150BG	IDT71V2546S100PF	IDT71V2548S133PF	IDT71V2548S100BG	IDT71V2546S150PF	IDT71V2546S133PF	IDT71V2548S100PF	IDT71V2548S133BG	IDT71V2548S150PF
描述	ZBT SRAM, 256KX18, 3.8ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, MS-028AA, BGA-119	ZBT SRAM, 128KX36, 5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100	ZBT SRAM, 256KX18, 4.2ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100	ZBT SRAM, 256KX18, 5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, MS-028AA, BGA-119	ZBT SRAM, 128KX36, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100	ZBT SRAM, 128KX36, 4.2ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100	ZBT SRAM, 256KX18, 5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100	ZBT SRAM, 256KX18, 4.2ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, MS-028AA, BGA-119	ZBT SRAM, 256KX18, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
厂商名称	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
零件包装代码	BGA	QFP	QFP	BGA	QFP	QFP	QFP	BGA	QFP
包装说明	14 X 22 MM, PLASTIC, MS-028AA, BGA-119	14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100	14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100	14 X 22 MM, PLASTIC, MS-028AA, BGA-119	14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100	14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100	14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100	14 X 22 MM, PLASTIC, MS-028AA, BGA-119	14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100
针数	119	100	100	119	100	100	100	119	100
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
ECCN代码	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
最长访问时间	3.8 ns	5 ns	4.2 ns	5 ns	3.8 ns	4.2 ns	5 ns	4.2 ns	3.8 ns
其他特性	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE
最大时钟频率 (fCLK)	150 MHz	100 MHz	133 MHz	100 MHz	150 MHz	133 MHz	100 MHz	133 MHz	150 MHz
I/O 类型	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 代码	R-PBGA-B119	R-PQFP-G100	R-PQFP-G100	R-PBGA-B119	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PBGA-B119	R-PQFP-G100
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0	e0
长度	22 mm	20 mm	20 mm	22 mm	20 mm	20 mm	20 mm	22 mm	20 mm
内存密度	4718592 bit	4718592 bit	4718592 bit	4718592 bit	4718592 bit	4718592 bit	4718592 bit	4718592 bit	4718592 bit
内存集成电路类型	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM
内存宽度	18	36	18	18	36	36	18	18	18
湿度敏感等级	3	3	3	3	3	3	3	3	3
功能数量	1	1	1	1	1	1	1	1	1
端子数量	119	100	100	119	100	100	100	119	100
字数	262144 words	131072 words	262144 words	262144 words	131072 words	131072 words	262144 words	262144 words	262144 words
字数代码	256000	128000	256000	256000	128000	128000	256000	256000	256000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	256KX18	128KX36	256KX18	256KX18	128KX36	128KX36	256KX18	256KX18	256KX18
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	BGA	LQFP	LQFP	BGA	LQFP	LQFP	LQFP	BGA	LQFP
封装等效代码	BGA119,7X17,50	QFP100,.63X.87	QFP100,.63X.87	BGA119,7X17,50	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	BGA119,7X17,50	QFP100,.63X.87
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	GRID ARRAY	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	GRID ARRAY	FLATPACK, LOW PROFILE
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED	240	240	NOT SPECIFIED	240	240	240	NOT SPECIFIED	240
电源	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	2.36 mm	1.6 mm	1.6 mm	2.36 mm	1.6 mm	1.6 mm	1.6 mm	2.36 mm	1.6 mm
最大待机电流	0.04 A	0.04 A	0.04 A	0.04 A	0.04 A	0.04 A	0.04 A	0.04 A	0.04 A
最小待机电流	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V
最大压摆率	0.325 mA	0.25 mA	0.3 mA	0.25 mA	0.325 mA	0.3 mA	0.25 mA	0.3 mA	0.325 mA
最大供电电压 (Vsup)	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V
最小供电电压 (Vsup)	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V
标称供电电压 (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子面层	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn85Pb15)
端子形式	BALL	GULL WING	GULL WING	BALL	GULL WING	GULL WING	GULL WING	BALL	GULL WING
端子节距	1.27 mm	0.65 mm	0.65 mm	1.27 mm	0.65 mm	0.65 mm	0.65 mm	1.27 mm	0.65 mm
端子位置	BOTTOM	QUAD	QUAD	BOTTOM	QUAD	QUAD	QUAD	BOTTOM	QUAD
处于峰值回流温度下的最长时间	NOT SPECIFIED	20	20	NOT SPECIFIED	20	20	20	NOT SPECIFIED	20
宽度	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm

IDT71V2548S150BG

IDT71V2548S150BG概述

IDT71V2548S150BG规格参数

IDT71V2548S150BG相似产品对比

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