IC,LOGIC MUX,QUAD,2-INPUT,CMOS,DIP,16PIN,PLASTIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Renesas(瑞萨电子) |
| 包装说明 | DIP, DIP16,.3 |
| Reach Compliance Code | not_compliant |
| JESD-30 代码 | R-PDIP-T16 |
| JESD-609代码 | e0 |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | MULTIPLEXER |
| 最大I（ol） | 0.00042 A |
| 功能数量 | 4 |
| 输入次数 | 2 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 包装方法 | TAPE AND REEL |
| 电源 | 5/15 V |
| Prop。Delay @ Nom-Sup | 300 ns |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| CD40257BEX98 | 5962-01-255-0813 | SLRC2184001BFACS | CD40257BK | CD40257BK3 | CD40257BF3A | CD40257BE98 | CD40257BE | 5962-01-120-8685 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC,LOGIC MUX,QUAD,2-INPUT,CMOS,DIP,16PIN,PLASTIC | IC,LOGIC MUX,QUAD,2-INPUT,CMOS,DIP,16PIN,CERAMIC | Array/Network Resistor, Isolated, Thin Film, 0.1W, 184000ohm, 0.1% +/-Tol, -10,10ppm/Cel, 1010, | CD40257BK | CD40257BK3 | IC,LOGIC MUX,QUAD,2-INPUT,CMOS,DIP,16PIN,CERAMIC | CD40257BE98 | IC,LOGIC MUX,QUAD,2-INPUT,CMOS,DIP,16PIN,PLASTIC | IC,LOGIC MUX,QUAD,2-INPUT,CMOS,DIP,16PIN,CERAMIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | not_compliant | _compli | unknown | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| 端子数量 | 16 | 16 | 4 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 85 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 85 °C | 85 °C | 125 °C |
| 最低工作温度 | -40 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -40 °C | -40 °C | -55 °C |
| 封装形式 | IN-LINE | IN-LINE | SMT | FLATPACK | FLATPACK | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 技术 | CMOS | CMOS | THIN FILM | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 厂商名称 | Renesas(瑞萨电子) | - | - | - | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
| 包装说明 | DIP, DIP16,.3 | DIP, DIP16,.3 | - | - | - | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| JESD-30 代码 | R-PDIP-T16 | R-XDIP-T16 | - | R-XDFP-F16 | R-XDFP-F16 | R-XDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-XDIP-T16 |
| JESD-609代码 | e0 | - | e0 | e0 | e0 | e0 | e0 | e0 | - |
| 负载电容（CL） | 50 pF | 50 pF | - | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | - | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| 最大I（ol） | 0.00042 A | 0.00036 A | - | 0.00036 A | 0.00036 A | 0.00036 A | 0.00042 A | 0.00042 A | 0.00036 A |
| 功能数量 | 4 | 4 | - | 4 | 4 | 4 | 4 | 4 | 4 |
| 输入次数 | 2 | 2 | - | 2 | 2 | 2 | 2 | 2 | 2 |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC | - | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
| 封装代码 | DIP | DIP | - | DFP | DFP | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP16,.3 | DIP16,.3 | - | FL16,.3 | FL16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 电源 | 5/15 V | 5/15 V | - | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
| Prop。Delay @ Nom-Sup | 300 ns | - | - | 300 ns | 300 ns | 300 ns | 300 ns | 300 ns | 300 ns |
| 表面贴装 | NO | NO | - | YES | YES | NO | NO | NO | NO |
| 温度等级 | INDUSTRIAL | MILITARY | - | MILITARY | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | - | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | - | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 认证状态 | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
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